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Silicon as Disruptive Platform for IoT Applications

Q&A with Marie Semeria, CEO of CEA-Leti

Fab Facilities Data and Defectivity

In-the-know attendees at SEMICON West at a Thursday morning working breakfast heard from executives representing the world’s leading memory fabs discuss manufacturing challenges at the 4th annual Entegris Yield Forum.

Global Neon Demand Expected to Exceed Increasing Supply

Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

Test Protocols for the IoT

The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

Applied Materials Intros High Res E-Beam Inspection System

Applied Materials, Inc. introduced its next-generation e-beam inspection system, PROVision, that offers resolution down to 1nm.

CMOS-Photonics Technology Challenges

imec and Mentor detail painstaking progress.

Applied Materials Releases Selective Etch Tool

Selectra chamber uses downstream plasma on Producer platform.

Closed-Loop DFM Solution Accelerates Yield Ramps

Mentor Graphics Corp. announced that Samsung Foundry’s closed-Loop design-for-manufacturing (DFM) solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps.

Pattern Matching Tackles IC Verification and Manufacturing Problems

Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

New Tungsten Barrier/Liner, Fill Processes Reduce Resistance and Increase Yield

Applied Materials recently launched two new products aimed at reducing contact resistance and improving yield in tungsten contacts.