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Companies Ready Cobalt for MOL, Gate Fill

As cobalt begins to replace tungsten at the smaller-dimension interconnect layers, Applied Materials is readying process flows and E-beam inspection solutions.

Logic Densities Advance at IEDM 2017

At the International Electron Devices Meeting, logic platform presentations from GlobalFoundries and Intel featured Moore’s Law density scaling.

Deep Learning Joins Process Control Arsenal

Where does the machine win, and where does the brain still win?” Howard Witham, APC keynote speaker.

Enabling the A.I. Era

Industry experts talked about how artificial intelligence will require innovation at all levels of the electronics industry, during a recent panel assembled by Applied Materials.

EUV Leads the Next Generation Litho Race

As previously reported by Solid State Technology, the eBeam Initiative recently reported the results of its lithography perceptions and mask-makers’ surveys.

XPoint NVM Array Process Engineering

PCM materials, not PCM devices

Embedded FPGAs Offer SoC Flexibility

With mask costs rising and the need for flexibility growing, companies are beginning to adopt embedded field programmable gate arrays in their SoC designs.

GlobalFoundries Turns the Corner

Stronger than expected demand for AMD’s 14nm-based processors has boosted GlobalFoundries. “We are chasing more demand than we planned on.” –Fab 8 general manager Tom Caulfield.

EUVL Materials Readiness for HVM

Ecosystem stretches for 2018 pilot production.

Mechanistic Modeling of Silicon ALE for FinFETs

U of M and Lam Research show how avoid yield losses.