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Top Stories Archive

Deep Learning Could Boost Yields, Increase Revenues

Deep learning is “a shiny new hammer” that chip industry may figure out how to use.

Edge Placement Error Control in Multi-Patterning

SPIE-AL presentations show materials dominate patterning.

Picosun and Hitachi MECRALD Process

ALD fab films at lower temperatures.

SiPs Simplify Wireless IoT Design

System-in-package solutions, running a proven software stack, are easing wireless design for Internet of Things end node applications.

Innovations at 7nm to Keep Moore’s Law Alive

EUV, cobalt contacts, are expected to be introduced at the 7nm node by several semiconductor manufacturers.

Photonics in Silicon R&D Toward Tb/s

COSMICC Project and AIM Program developments

MRAM Takes Center Stage at IEDM 2016

With good data retention and speed, and medium density, MRAM may have advantages for systems which have large amounts of on-chip SRAM.

High-NA EUV Lithography Investment

ASML funds Zeiss for anamorphic >0.5 NA.

Process Control Deals with Big Data, Busy Engineers

“Engineers are busy, and so you only tell them something they need to know.” Intel’s Steve Chadwick

2D Materials May Be Brittle

Molybdenum-diselenide brittle, borophene not