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SPIE Photomask Panel: Money Is An Issue

“Money (That’s What I Want)” could have been the theme song for playing off the EUV Mask Readiness panel discussion on Thursday morning (October 1) at the SPIE Photomask Technology conference in Monterey, California.

Mask Conference Highlights Progress in Lithography

Harry J. Levinson, senior director of technology research at GlobalFoundries, took “Lithography and Mask Challenges at the Leading Edge” as the theme for his keynote presentation Tuesday morning, opening the SPIE Photomask Technology 2015 conference in Monterey, California.

Intel Mask Engineer Reports “Steady Progress” in EUV Masks

Intel has been working on photomasks for extreme-ultraviolet lithography for more than a decade, and has recently logged significant progress.

CMP Technology Evolving to Engineer Surfaces

New devices, materials, and substrates challenge atomic-scale integration.

SEMI Conference Addresses Issues in Semiconductor Materials

The overall theme for the conference was “Materials for a Smart and Interconnected World.” It featured sessions on “Material Enabling Silicon Everywhere”, “New Emerging Materials Technology & Opportunities at the Edge,” sustainable manufacturing, and a panel of executives from semiconductor manufacturers providing “A View from the Fabs.”

GlobalFoundries CTO Calls for Innovation in Chip Materials

Gary Patton, chief technology officer of GlobalFoundries and head of the company’s worldwide research and development, called for innovation in chip materials in his keynote address on Tuesday at SEMI’s Strategic Materials Conference in Mountain View, Calif.

TSMC Moves from 16nm to 10nm to 7nm

While Taiwan Semiconductor Manufacturing continues to fine-tune its 16-nanometer FinFET process, the world’s largest silicon foundry will begin making chips with 10nm features later this year and will put 7nm chips into risk production in early 2017.

TSMC Forum Emphasizes Industry Collaboration

Taiwan Semiconductor Manufacturing kicked off its Open Innovation Platform (OIP) Ecosystem Forum with thanks – not for another beautiful day in Silicon Valley, but for the collaborative work it does with its customers, suppliers, and other industry partners.

Knowm First to Deliver Configurable Artificial Neural Networks using Bi-Directional Learning Memristors

Breakthrough memristor technology combined with novel adaptive architecture enables machine learning (ML) and artificial intelligence (AI) applications.

Comfortable Consumer EEG Headset Shown by Imec and Holst Centre

Medical-quality data acquisition of signals tracing emotions and moods.

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies for process technology development and design flow enhancement.

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Why SOI is the Future Technology of Semiconductors

Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the “one learning” we can take away from IEDM 2013.

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Packaging Materials Trends — Mobility is the Key Market Driver

The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

Paradigm Changes in 3D-IC Manufacturing

The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC.

GLOBALFOUNDRIES, Open-Silicon and Amkor demo 2.5D test vehicle

GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors.