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An EDA view of semiconductor manufacturing

The concern that there is a significant break between tools used by designers targeting leading edge processes, those at 32 nm and smaller to be precise, and those used to target older processes was dispelled during the recent Design Automation Conference (DAC).

3D memory for future nanoelectronic systems

Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.

Qualcomm: Scaling down is not cost-economic anymore – so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D “to extend the semiconductor roadmap way beyond the 2D scaling” as part of their keynote presentations.

ST licenses 28nm FD-SOI to Samsung

Samsung joins GLOBALFOUNDRIES in offering performance boost in 2D silicon.

Scouting report for materials at end of the road: 2013 ITRS

When pavement ends the terrain gets rough, as documented in Emerging Research Materials chapter of newest ITRS.

Wafer-level packaging of ICs for mobile systems of the future

The most functionality at the least cost is the promise of wafer-level packaging (WLP) when dealing with complex integrated circuits (IC) with a high number of input/output connections to the outside world.

GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs

GLOBALFOUNDRIES and Samsung are announcing a joint program for 14nm FinFETs that offers a single process design kit (PDK) and manufacturing at four different fabs with identical processes.

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Big sell: IP Trends and Strategies

Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Why SOI is the Future Technology of Semiconductors

Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the “one learning” we can take away from IEDM 2013.

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Packaging Materials Trends — Mobility is the Key Market Driver

The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

Paradigm Changes in 3D-IC Manufacturing

The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC.

GLOBALFOUNDRIES, Open-Silicon and Amkor demo 2.5D test vehicle

GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors.

Inside the Hybrid Memory Cube

The HMC provides a breakthrough solution that delivers unmatched performance with the utmost reliability.

A New Training Methodology Needed

We have an interesting dynamic in the world of semiconductor training that has been in play since the financial crisis in 2008-2009.