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Knowm First to Deliver Configurable Artificial Neural Networks using Bi-Directional Learning Memristors

Breakthrough memristor technology combined with novel adaptive architecture enables machine learning (ML) and artificial intelligence (AI) applications.

Comfortable Consumer EEG Headset Shown by Imec and Holst Centre

Medical-quality data acquisition of signals tracing emotions and moods.

Managing Dis-Aggregated Data for SiP Yield Ramp

In general, there is an accelerating trend toward System-in-Package (SiP) chip designs including Package-On-Package (POP) and 3D/2.5D-stacks where complex mechanical forces—primarily driven by the many Coefficient of Thermal Expansion (CTE) mismatches within and between chips and packages—influence the electrical properties of ICs.

Neon Gas Supply Issues Dog the Semiconductor Industry

The armed conflict in Ukraine, where most of the world’s supply of neon gas for semiconductor manufacturing and other industrial applications is produced, is leading lithography equipment vendors to offer ways to reduce use of neon, which is utilized as a buffer gas for argon fluoride and krypton fluoride gases employed in lasers for chip production.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

Optimal+ Turns 10, Wins Accolades For Its Work

Optimal+ has been in business since 2005. The Israel-based company, which has offices around the world, has something else to celebrate this year: Frost & Sullivan gave Optimal+ its 2015 Global Semiconductor Test Visionary Innovation Leadership Award.

Low-Cost Manufacturing of Flexible Functionalities

FlexTech Alliance updates on substrates, processes, and devices.

Technologies for Advanced Systems Shown at IMEC Tech Forum USA

R&D summarized of the nanoscale building blocks for our fab future.

Applied Materials’ Olympia ALD Spins Powerful New Capabilities

Applied Materials today unveiled the Applied Olympia ALD system, using thermal sequential-ALD technology for the high-volume manufacturing (HVM) of leading-edge 3D memory and logic chips.

Breaking Down Power Management Verification

During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies for process technology development and design flow enhancement.

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Why SOI is the Future Technology of Semiconductors

Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the “one learning” we can take away from IEDM 2013.

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Packaging Materials Trends — Mobility is the Key Market Driver

The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

Paradigm Changes in 3D-IC Manufacturing

The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC.

GLOBALFOUNDRIES, Open-Silicon and Amkor demo 2.5D test vehicle

GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors.