Part of the  

Solid State Technology

  and   

The Confab

  Network

About  |  Contact

Top Stories Archive

Cadence Debuts Product for Reducing Test Time, Costs

Cadence Design Systems is introducing the Modus Test Solution, a product that it touts as capable of reducing IC testing time and test costs, while improving profit margins for chips.

Qualcomm Posts Lower Profit, Revenue in Quarter

Qualcomm reported net income of $1.5 billion for the fiscal first quarter ended December 27, down 24 percent from $2.0 billion a year ago. Revenue fell 19 percent to $5.8 billion, from $7.1 billion in the first quarter of fiscal 2015.

Memristor Variants and Models from Knowm

Knowm Inc., a start-up pioneering next-generation advanced computing architectures and technology, recently announced the availability of two new variations of memristors targeting different neuromorphic applications.

Imagining China’s IC Fab Industry in 2035

China has been successfully investing in technology to reach global competitiveness for many decades. Integrated circuit (IC) manufacturing technology is highly strategic for countries, enabling both economically-valuable commercial fabs as well as military power.

Intel Posts Mixed Results for Q4, 2015

Intel reported net income of $11.4 billion on revenue of $55.4 billion for the year ended December 26, compared with net of $11.7 billion on revenue of $55.9 billion in 2014.

Indium-free Perovskite TCOs Could Save Costs

Lei Zhang, et al. from Pennsylvania State University—with collaborators from Rutgers University and University of Toledo—have found two new families of transparent conductive oxides (TCO) based on “correlated” electrons in ternary oxides of vanadium.

Identifying the Prime Challenge of IoT Design

Low-cost IoT designs, which interface the edge of the real world to the Internet, mesh together several design domains. Individually, these design domains are challenging for today’s engineers. Bringing them all together to create an IoT product can place extreme pressure on design teams.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.

Dow, DuPont to Merge in Combination of Chemical Giants

In a deal with significant implications for high-tech chemicals and materials, The Dow Chemical Company and E. I. du Pont de Nemours and Company (DuPont) have agreed to merge, forming the second largest chemical company in the world, behind BASF SE.

IoT Will Enable ‘Living Services,’ Keynote Speaker Says

“It’s not about the sensors,” Nandini (Nan) Nayak, managing director of design strategy at Fjord, said Thursday morning (December 3) in a keynote address at the Designers of Things conference in San Jose, Calif.

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies for process technology development and design flow enhancement.

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Why SOI is the Future Technology of Semiconductors

Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the “one learning” we can take away from IEDM 2013.

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Packaging Materials Trends — Mobility is the Key Market Driver

The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

Paradigm Changes in 3D-IC Manufacturing

The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC.

GLOBALFOUNDRIES, Open-Silicon and Amkor demo 2.5D test vehicle

GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors.