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D2S Releases 4th-Gen IC Computational Design Platform

14 installations of GPU-accelerated platforms aid mask-makers worldwide

Elusive Analog Fault Simulation Finally Grasped

The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan compression.

Linde Launches Asian R&D Center in Taiwan

Strategic investment serves IC, FPD, LED, and PV fabs

What is Your China Strategy?

Equipment vendors have a lot on their plates now, with memory customers pushing 3D NAND, foundries advancing to the 7 nm node, and 200mm fabs clamoring to come up with hard-to-find tools.

3D-NAND Deposition and Etch Integration

Lam talks about process control and default roadmaps.

Silicon as Disruptive Platform for IoT Applications

Q&A with Marie Semeria, CEO of CEA-Leti

Fab Facilities Data and Defectivity

In-the-know attendees at SEMICON West at a Thursday morning working breakfast heard from executives representing the world’s leading memory fabs discuss manufacturing challenges at the 4th annual Entegris Yield Forum.

Global Neon Demand Expected to Exceed Increasing Supply

Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

Test Protocols for the IoT

The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

Applied Materials Intros High Res E-Beam Inspection System

Applied Materials, Inc. introduced its next-generation e-beam inspection system, PROVision, that offers resolution down to 1nm.