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IoT Security, Software Are Highlighted at ARM TechCon

Many people are aware of the Internet of Things concept. What they want to know now is how to secure the IoT and how to develop code for it.

ARM CEO Celebrates 500 Years of Connectivity

In his ARM TechCon keynote address on Wednesday morning (November 11), which was entitled “Building Trust in a Connected World,” ARM Holdings CEO Simon Segars reviewed the history of significant products in the 20th century and noted how their pricing was reduced through “optimizing supply chains.”

ARM debuts embedded architecture, new 64-bit processor

ARM Holdings today is introducing the ARMv8-M architecture for embedded devices and the ARM Cortex-A35 64-bit processor as the company opens the annual ARM TechCon conference and exposition in Santa Clara, Calif.

ARM CTO looks forward and backward in keynote

“Innovation is still thriving in semiconductors,” said Mark Muller, chief technology officer of ARM Holdings, in a keynote address Tuesday morning (November 10) at the ARM TechCon conference and exposition in Santa Clara, Calif.

New MEMS, Sensors Emerge at MEMS Executive Congress US

A wide variety of microelectromechanical system (MEMS) devices, sensors, and MEMS sensors were described and introduced at the MEMS Executive Congress US in Napa, Calif.

MEMS, Sensors Poised for Growth in the Internet of Things Era

Not all segments in MEMS and sensors are enjoying hockey-stick growth forecasts, as commoditization and pricing pressures take hold. This was just one of the insights gleaned at last week’s MEMS Executive Congress US 2015.

MEMS Executive Congress US, Day 2: Securing the Internet of Things

On the second day of the MEMS Executive Congress US in Napa, Calif., Wouter Leibbrandt of NXP Semiconductors gave the keynote address on “Secure Connections for the Internet of Things.”

MEMS Executive Congress US Speaker Looks at MEMS Past, Present, and Future

Much has changed in the world of microelectromechanical system (MEMS) devices in the past 20 years, and much more will change in the next two decades, said Steve Nasiri of Nasiri Ventures in his keynote address Wednesday (November 4) at the MEMS Executive Congress US conference in Napa, Calif.

Practical Limits for Metallization Scaling in Fabs

On-chip interconnects for ICs have evolved to meet different exacting needs, and the most advanced chips require multiple levels of copper (Cu) metal lines and via connections between transistors.

Meeting the IoT Design Challenge

Mentor Graphics acquired Tanner EDA in March of 2015, in an effort to better address the design, layout and verification of analog/mixed-signal and MEMS ICs, key building blocks in the IoT. Since then, the Tanner team has moved offices and successfully been integrated into Mentor’s corporate structure.

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies for process technology development and design flow enhancement.

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site options are reviewed for helium, argon, sulfuric acid and Xenon.

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in areas including substrates, materials and production processes? Semiconductor Manufacturing & Design discussed the issues with Mac McDaniel, Director and Chief Marketing Officer, Display Business Group, Applied Materials, Michael Ciesinski, MD of the Flextech Alliance, and Keri Goodwin, Principal Scientist from the Centre for Process Innovation (CPI), in the UK.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important as well as method to perform a built-in self-test.

Why SOI is the Future Technology of Semiconductors

Zvi Or-Bach, President and CEO of MonolithIC 3D, blogs that this is the “one learning” we can take away from IEDM 2013.

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective device dimensions. However, significant compromise is unavoidable when using doping as a means of isolation, as in bulk-based FinFETs.

Packaging Materials Trends — Mobility is the Key Market Driver

The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials. As these trends continue, innovative material solutions will be needed to address demanding requirements related to product integration, mobility, and reliability.

Paradigm Changes in 3D-IC Manufacturing

The process flows applied today for real product manufacturing are quite different from the process flows initially proposed for a universal 3D IC.

GLOBALFOUNDRIES, Open-Silicon and Amkor demo 2.5D test vehicle

GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors.