White Papers Archive

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Innovative Wafers For Energy-Efficient CMOS Technology

How and why substrates will facilitate the introduction of planar and non-planar designs beginning at 28nm.

A Hybrid Model/Pattern-Based OPC Approach For Improved Consistency And TAT

A look at how to improve simulation consistency and to speed up lithography operations.

Challenges For Patterning Process Models Applied To Large Scale

How predictive power and runtime performance of patterning models used in full-chip simulation tools is improving, and what factors limit the predictability of those models.

2012 IP Challenges For The Semiconductor Industry

A global survey of how such problems as patent infringement, counterfeiting and cost are affecting the IC industry.

Computational Lithography

Enabling 12 technology nodes in 12 years.

Designing into A Foundry Low-Power High-k Metal Gate 28nm CMOS Solution

A look at the process technology that will become the foundation for a new generation of portable electronics.

The Challenges Of 28nm HKMG

Designing into a foundry low-power high-k metal gate 28nm solution for high-performance analog mixed signal and mobile applications.

Model-Based Double-Dipole Lithography For Sub-30nm Node Device

How to maximize the process margin of 2D patterns using simpler processes with lower mask costs than double patterning.

Finding And Eliminating Hot Spots

A high-performance electrical driven hotspot detection solution for full-chip design using a novel device parameter matching technique.

Planar Fully Depleted Silicon Technology To Design Competitive SoCs At 28nm And Beyond

A look at the challenges to obtain competitive silicon technology for the upcoming generation of SoCs.

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