Part of the  

Solid State Technology

  and   

The Confab

  Network

About  |  Contact

Posts Tagged ‘Altera’

Intel Q1 Revenue, Profit Rise; Chipmaker Will Cut Up to 12,000 Jobs

Wednesday, April 20th, 2016

thumbnail

By Jeff Dorsch, Contributing Editor

Intel reported net income of $2.0 billion in the first quarter, up 3 percent from a year earlier, while revenue rose 7 percent to $13.7 billion, compared with $12.8 billion one year ago.

The company also announced that it is embarking on an extended restructuring program, eliminating up to 12,000 positions around the world, a reduction in force of about 11 percent, by mid-2017. The cutbacks will include a consolidation of facilities with involuntary and voluntary departures by employees.

“Our first-quarter results tell the story of Intel’s ongoing strategic transformation, which is progressing well and will accelerate in 2016,” Intel CEO Brian Krzanich said in a statement. “We are evolving from a PC company to one that powers the cloud and billions of smart, connected computing devices.”

Intel will focus on its growth businesses – namely, data center, Internet of Things, field-programmable gate arrays, and memory – under the restructuring initiative. The company will realize cost savings of $750 million in 2016 and estimated annual savings of $1.2 billion.

“These actions drive long-term change to further establish Intel as the leader for the smart, connected world,” Krzanich stated. “I am confident that we’ll emerge as a more productive company with broader reach and sharper execution.”

Chief Financial Officer Stacy Smith told analysts the restructuring will make Intel “more agile, more efficient…and more profitable.”

Smith plans to take another post in Intel’s senior management within the next few months. He will be leading sales, manufacturing, and operations once a successor is named as CFO.

Intel said it would consider internal and external candidates for the CFO post.

The company’s second-quarter outlook calls for $13.5 billion in revenue, plus or minus $500 million, with a gross margin percentage of 61 percent. Intel will take a restructuring charge of about $1.2 billion during Q2.

A “weak PC market” in Q1 led to the Client Computing Group posting revenue of $7.5 billion, increasing 2 percent from a year ago yet down 14 percent from the fourth quarter of 2015, Smith said.

The Data Center Group realized Q1 revenue of $4.0 billion, a 9 percent gain from a year earlier. The Internet of Things Group had revenue of $651 million, up 22 percent year-over-year.

Revenue in the Non-Volatile Memory Solutions Group was $557 million, down 6 percent from a year earlier, while the Intel Security Group had Q1 revenue of $537 million, a 12 percent gain from a year ago.

The Programmable Solutions Group, formerly known as Altera (acquired by Intel in late 2015), had $359 million in revenue, not including $99 million in revenue due to acquisition-related adjustments.

Betsy Van Hoes of Wedbush Securities said, “It’s been a long time since there’s been a restructuring of the company. As they forge forward, they need to pare down and invest in the right area. As much as I hate that — it’s terrible for people who are laid off, that — for the investors it’s positive.”

Intel Posts Mixed Results for Q4, 2015

Friday, January 15th, 2016

thumbnail

By Jeff Dorsch, Contributing Editor

Intel reported net income of $11.4 billion on revenue of $55.4 billion for the year ended December 26, compared with net of $11.7 billion on revenue of $55.9 billion in 2014.

For the fourth quarter, the world’s largest chipmaker measured by annual revenue posted net income of $3.6 billion on revenue of $14.9 billion, compared with $3.7 billion in net on revenue of $14.7 billion a year earlier.

Intel said revenue from the Client Computing Group, its PC chip business, was $8.8 billion, down 1 percent from a year ago. The Data Center Group was up 4 percent, year over year, to $4.3 billion.

The Internet of Things and Non-Volatile Memory Solution groups both showed revenue gains, of 8 percent and 10 percent, respectively.

“Our results for the fourth quarter marked a strong finish to the year and were consistent with expectations,” Intel CEO Brian Krzanich said in a statement. “Our 2015 results demonstrate that Intel is evolving and our strategy is working. This year, we’ll continue to drive growth by powering the infrastructure for an increasingly smart and connected world.”

Intel is forecasting revenue of $14 billion for the first quarter of 2016, with full-year revenue growing in middle-to-high single digits. Capital expenditures in 2016 will be flat with last year, at $9.5 billion.

The 2016 forecast does not account for the company’s recent acquisition of Altera, according to Intel.

The Week in Review: October 10, 2014

Friday, October 10th, 2014

Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea to meet growing demand from smartphones, enterprise computing and the emerging “Internet of Things” market.

Soraa, a developer of GaN on GaN LED technology, announced today that one of its founders, Dr. Shuji Nakamura, has been awarded the 2014 Nobel Prize in Physics. Recognizing that Nakamura’s invention, the blue light emitting diode (LED), represents a critical advancement in LED lighting, the Nobel committee explained the innovation “has enabled bright and energy-saving white light sources.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA’s highest honor, the Robert N. Noyce Award.

The Board of Directors of United Microelectronics Corporation (UMC), a global semiconductor foundry, this week announced a joint venture company focused on 12″ wafer foundry services with Xiamen Municipal People’s Government and FuJian Electronics & Information Group.

Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

Solid State Watch: April 18-25, 2014

Friday, April 25th, 2014

Blog review April 7, 2014

Monday, April 7th, 2014

Pete Singer reveals the lineup of presenters for Session 1 of The ConFab, to be held June 22-25 in Las Vegas, and provides summaries of their talks. Speakers will be Vijay Ullal, COO, Fairchild Semiconductor; Dave Anderson, President and CEO, Novati Technologies; Gopal Rao, Senior Director Business Development, SEMATECH; Adrian Maynes, Program Manager, F450C; and Bill McClean, President, IC Insights.

Phil Garrou blogs about a variety of diverse issues this week, including GLOBALFOUNDRIES’ potential purchase of IBM’s semiconductor business, Altera’s separate deals with Intel and TSMC, why FinFET could be more expensive that more conventional CMOS strategies, as view by Handle Jones of IBS, and a new joint development program between ASE and Inotera focused on 3D IC packaging.

The Week in Review: March 28, 2014

Friday, March 28th, 2014

Altera Corporation and Intel Corporation announced their collaboration on the development of multi-die devices that leverage Intel’s package and assembly capabilities and Altera’s leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera’s Stratix 10 FPGAs and SoCs using the 14nm Tri-Gate process. Altera’s work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package.

Samsung introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability. The new offerings, for use in leading-edge LED lighting such as LED bulbs, MR/PAR and downlights, will be available in the market during the second quarter of this year. Samsung’s new flip chip (FC) LED package and flip chip on module (FCOM) solutions feature highly efficient and versatile LED structures, created by flipping over blue LED chips and adhering phosphor film to each of them. Unlike conventional LED packages that dispense phosphor and then place a plastic mold over each chip, Samsung’s FC package technology can produce LED packages down to a chip-scale size without any mold, enabling more compact lighting fixture designs.

eInfochips, a semiconductor and product engineering company, this week launched design services for chips based on 16nm geometry. The comprehensive suite of services includes Netlist to GDSII, Sign-off, and Design for Testability. eInfochips is one of the few engineering services companies in the world capable of delivering 16nm chip designs which reduce a chip’s power consumption by half, while improving performance by one-third over 28nm technology.

SEMATECH announced this week that Particle Measuring Systems has joined SEMATECH to advance the development of nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices. This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.

CEA-Leti will demonstrate its new prototype for wireless high data rate Li-Fi (light fidelity) transmission at Light + Building 2014 in Frankfurt, Germany, March 30-April 4. The technology employs the high-frequency modulation capabilities of light-emitting diode (LED) engines used in commercial lighting. It achieves throughputs of up to 10Mb/s at a range of three meters, suitable for HD video streaming or Internet browsing, using light power of less than 1,000 lumens and with direct or even indirect lighting. With this first proof of concept and its expertise in RF communications, Leti forecasts data transmission rates in excess of 100Mb/s with traditional lighting based on LED lamps using this technology approach and without altering the high-performance lighting characteristics.

Blog review February 24, 2014

Monday, February 24th, 2014

Paul Farrar, general manager of the G450C consortium, said early work has demonstrated good results and that he sees no real barriers to implementing 450mm wafers from a technical standpoint. But as Pete Singer blogs, he also said: “In the end, if this isn’t cheaper, no one is going to do it,” he said.

Adele Hars of Advanced Substrate News reports that body-biasing design techniques, uniquely available in FD-SOI, have allowed STMicroelectronics and CEA-Leti to demonstrate a DSP that runs 10x faster than anything the industry’s seen before at ultra-low voltages.

Dr. Bruce McGaughy, Chief Technology Officer and Senior Vice President of Engineering, ProPlus Design Solutions, Inc., says the move to state-of-the-art 28nm/20nm planar CMOS and 16nm FinFET technologies present greater challenges to yield than any previous generation. This is putting more emphasis on high sigma yield.

Jamie Girard, senior director, North America Public Policy, SEMI President Obama touched on many different policy areas during his State of the Union talk, and specifically mentioned a number of issues that are of top concern in the industry and with SEMI member companies. Among these are funding for federal R&D, including public-private partnerships, trade, high-skilled immigration reform, and solar energy.

Phil Garrou finishes his look at the IEEE 3DIC meeting, with an analysis of presentations from Tohoku University, Fujitsu’s wafer-on-wafer (WOW), ASE/Chiao Tung University and RTI. In another blog, Phil continues his review of the Georgia Tech Interposer conference, highlighting presentations from Corning, Schott Glass, Asahi Glass, Shinko, Altera, Zeon and Ushio.

Pete Singer recommends taking the new survey by the National Center for Manufacturing Sciences (NCMS) but you may first want to give some thought as to what is and what isn’t “nanotechnology.”