SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline. Here’s an update on the newly-published SEMI 450mm specifications as well as the other 450mm SEMI Standards.
Xilinx announced first customer shipment of the semiconductor industry’s first 20nm product manufactured by TSMC, and the PLD industry’s first 20nm All Programmable device. Xilinx UltraScale devices deliver an ASIC-class advantage with the industry’s only ASIC-class programmable architecture coupled with the Vivado ASIC-strength design suite and recently introduced UltraFast design methodology. The UltraScale devices enable 1.5X – 2X more realizable system-level performance and integration for customers, equivalent to a generation ahead of the competition.
SEMI also announced this that the deadline for presenters to submit an abstract for the 25th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 28. ASMC, which takes place May 19-21, 2014 in Saratoga Springs, New York, will feature technical presentations of more than 80 peer-reviewed manuscripts covering critical process technologies and fab productivity.
FlipChip International announced the 100% acquisition of Millennium Microtech (Shanghai) – (MMS), a provider of fully integrated semiconductor packaging and testing services situated in the Zhang Jiang Hi- Tech Park, Pudong New Area, Shanghai, China. The MMS name will be changed to FlipChip International.
Tosoh Corporation announced today that Tosoh Group company Tosoh SMD, Inc., will implement a major expansion at its Grove City, Ohio, operations to develop, produce, and support physical vapor deposition (PVD) sputtering targets for the new 450mm wafer semiconductor market. The expansion is the biggest investment in Tosoh SMD’s history and is meant to position the company for the next generation products and technologies. It will include facilities, novel equipment and tools for manufacturing, and a sputter deposition tool for R&D and evaluation purposes. The first stage is slated to be ready by December 2014.