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ASML Details Advances in DUV, Metrology, EUV

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By Jeff Dorsch, Contributing Editor

ASML Holding is glad to talk about its continuing progress in extreme-ultraviolet lithography technology. But first, the company has some information about its deep-ultraviolet scanners, as well.

ASML continues to ship its TWINSCAN NXT: 1980Di immersion lithography systems, which are capable of processing 275 wafers per hour, according to Michael Lercel, ASML’s director of strategic marketing.

Since shipments began last year, the 1980Di is exhibiting overlay numbers that are “slightly better than expected,” Lercel said Wednesday at the SPIE Advanced Lithography conference in San Jose, Calif. ASML aimed to make the 193i litho system “ a little bit more robust” than its predecessor, the TWINSCAN NXT: 1970Ci, he added. The 1970Ci can be upgraded in the field to the 1980Di’s capabilities, according to the company.

The 1980Di can be utilized in a combination of lithography techniques, including single exposure, lithography-etch-lithography-etch, sidewall spacers, and self-aligned double patterning, Lercel said. It offers the kind of variability control needed for self-aligned quadruple patterning, he added.

The ASML executive also addressed the company’s new YieldStar 350E metrology system, which he said can “correct for overlay errors” and “apply corrections to upstream and downstream problems,” using “a lot of overlay data.”

On the EUV front, Lercel said ASML has made “a lot of progress in the last 12 to 18 months.” At its facilities in Veldhoven, the Netherlands, the company has been able to operate a power source for its EUV systems at 200 watts “for one hour, with full dose control,” he noted.

That’s approaching its high-volume manufacturing target of 250W, according to Lercel. ASML continues to predict its EUV scanners will move into volume production applications in the 2018-19 timeframe, he said.

Intel and Samsung Electronics this week reported running their EUV power sources at 80W over extended periods.

The new TWINSCAN NXE:3350B scanners are now being shipped with 125W power sources, Lercel noted. ASML has demonstrated 80 percent availability in the field, including scheduled downturns, bringing EUV close to matching immersion lithography, Lercel said. Regarding availability, “we need to do better in consistency,” he acknowledged.

ASML has “multiple EUV systems at multiple customers,” Lercel said. In addition to Intel and Samsung, the company’s EUV scanners are also being used at GlobalFoundries, SK Hynix, and Taiwan Semiconductor Manufacturing, among others not yet identified by the equipment vendor.

ASML this week reported reaching a deal with Nippon Control System on integrating optical proximity correction to mask data preparation on a common platform.

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