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The Week in Review: Oct. 16

NY’s Marcy Nanocenter, the largest remaining shovel-ready, greenfield site in New York State’s Tech Valley near Utica, is another step closer to the goal of attracting major semiconductor manufacturing companies. The computer chip packaging consortium will work inside the Quad C Complex now under construction on the SUNYIT campus, which is due to open in late 2014.

SEMI believes that the semiconductor materials market will trend with the device market, resulting in an increase of one percent this year and a seven percent increase in 2014, resulting in a materials market approaching $50 billion in 2014.

At the upcoming International Electron Devices Meeting (IEDM), to be held December 9-11 in Washington, D.C., IBM researchers will report on a CMOS-compatible 200 mm wafer-scale sub-20nm nanochannel fabrication method that enables stretching, translocation and real-time fluorescence microscopy imaging of single DNA molecules.

Dow Electronic Materials announced availability of its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications.

Semiconductor capital spending has increased significantly among pure-play foundries as more IDMs shift to a fabless/fab-lite business model and as new foundry participants intensify competition among the old guard.

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