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Applied Materials Releases Selective Etch Tool

Selectra chamber uses downstream plasma on Producer platform.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

New Tungsten Barrier/Liner, Fill Processes Reduce Resistance and Increase Yield

Applied Materials recently launched two new products aimed at reducing contact resistance and improving yield in tungsten contacts.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’s SLIM and SWIFT advanced fan-out package technologies.

Rhines Expounds on the Deconsolidation of the Semiconductor Industry

“By 2020, we are all going to work for the same company,” Wally Rhines, chairman and chief executive officer of Mentor Graphics, said Tuesday morning (April 26) in his keynote presentation at Mentor’s U2U user conference in Santa Clara, Calif.

Intel Q1 Revenue, Profit Rise; Chipmaker Will Cut Up to 12,000 Jobs

Intel reported net income of $2.0 billion in the first quarter, up 3 percent from a year earlier, while revenue rose 7 percent to $13.7 billion, compared with $12.8 billion one year ago.

Roll-to-Roll Coating Technology: It’s a Different Ball of Wax

Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IoT Demands Part 2: Test and Packaging

To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.