While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center emphasizes that Jabil has progressed from being a board manufacturer to a full-service supply chain management firm.
News Stories Archive
New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects were presented at the CMP Users Group meeting.
GSA’s Silicon Summit at the Computer History Museum in Mountain View, Calif., not far from Google’s headquarters, was dominated by talk of IoT, AR, VR, and (to a lesser extent) wearable devices.
Qualcomm endorses CEA-Leti’s “CoolCube” transistor stacking approach.
Mentor Graphics Corp. (NASDAQ: MENT) announced that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification
A new product from Mentor Graphics called Xpedition® Package Integrator provides a new methodology and platform in addition to a new suite of EDA tools. The platform enables chip, package and board designers to easily see how changing various design elements impact adjacent designs, an industry first.
Aart de Geus is not running for governor of California.
New blogs focus on the speaker lineup at the upcoming The ConFab 2015, ways to cut fab costs and turn-around time with smart, automated resource management, a growing demand for the greening of semiconductors, the quest for more durable displays, new solutions to the industry’s battery problem, the 2015 SPIE Lithography forum, the Grenoble SEMI 3D Summit, and SEMI’s take on President Obama’s State of the Union Address.
Taking “Smart Design from Silicon to Software” as his official theme, Aart de Geus urged attendees to “shift left” – in other words, “squeezing the schedule” to design, verify, debug, and manufacture semiconductors.
Exposures, and reducing their cost, were a theme running through the 2015 SPIE Advanced Lithography Symposium this week in San Jose, Calif., the center of Silicon Valley.
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The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
Everybody’s talking about it, but just what is DFM? According to various EDA company websites, design for manufacturing can be: generation of yield optimized cells; layout compaction; wafer mapping optimization; planarity fill; or, statistical timing among other definitions. Obviously, there is very little consensus. For me, DFM is what makes my job hard: Characterizing it, and developing tools for it, is the most important item on my agenda.
In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.
Certain measurement methodologies can be inaccurate even if they’re precise, and there are known errors associated with certain system parameters.
The etch loading effect is the dominant factor that impacts final CD control at advanced nodes with shrinking critical dimension.
A look at ways to simplify the optical and resist model calibration and to speed up the entire process.
Fabricating interconnects is one of the most process-intensive and cost-sensitive parts of manufacturing.
Testing interposer-based versions of stacked die and future versions using through-silicon vias.
EUV will introduce unwanted patterning distortions that must be accurately modeled and corrected.
How to tame data file sizes, address fractured data files creation and streamline data review techniques.