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Blog review April 14, 2014

New blogs provide a preview of The ConFab’s keynote talk by Qualcomm’s Roawen Chen, a review by CEA-Leti researchers on 3D integration with SOI, an analysis of the IMAPS Device Packaging Conference, and an overview of the issues surrounding sustainable manufacturing.

The Week in Review: April 11, 2014

SIA reports sales of semiconductors in February 2014 increased 11.4 percent from February 2013; GSA celebrates 20 years; SEMI expanding Innovation Village at SEMICON Europa

Blog review April 7, 2014

New blogs reveal the lineup of speakers for The ConFab’s Session 1, which will provide an excellent overview of the semiconductor industry’s major drivers and challenges; thought about Altera’s sometimes confusing deals with Intel and TSMC; cost-related issues of FinFETs compared to standard CMOS processes; ASE and Inotera’s join development program aimed at 3D IC packaging.

The Week in Review: April 4, 2014

New AFM for 300mm bare wafers that improves throughput; ON Semiconductor to acquire Trusense Imaging; SureCore reveals results of early testing for new low power SRAM designs; Researchers develop new material able to conduct heat 20 times better than original polymer

Blog review March 31, 2014

New blogs discuss metrology in the age of 3D memory, the many benefits of FDSOI, this year’s IMAPS Device Packaging Conference, the recent MEMS Industry Group meeting in Europe, and the upcoming R&D panel session at The ConFab in June.

The Week in Review: March 28, 2014

Altera and Intel extend partnership; Samsung introduces new flip chip LED packages; eInfochips to offer design services based on 16nm geometry; Particle Measuring Systems joins SEMATECH; CEA-Leti to demonstrate new prototype for wireless high data rate Li-Fi

Blog review March 24, 2014

New blogs take a look at a new IBS analysis of FDSOI, an upcoming webcast on 3D Integration and lithography, and a long angry speech of scorn and criticism on packaging nomenclature, condensed and articulated.

The Week in Review: March 21, 2014

UC Berkley research in on-chip inductors; Equipment bookings and billings continue along a steady trend; SMIC CEO awarded SEMI Outstanding EHS Achievement Award; EVG opens HQ in China; ChaoLogix offers security for semi chips; Applied Materials named a World’s Most Ethical Company

Blog review March 17, 2014

New blogs take a look the keynote lineup for The ConFab, to be held June 22-25 in Las Vegas, the recent SEMI 2.5/3D IC Summit held in Grenoble, and wearable electronics in the IoT era and the role that equipment and materials suppliers need to play.

The Week in Review: March 14, 2014

Toshiba, SanDisk file suit against SK Hynix; imec achieves a record conversion efficiency of 8.4 percent with fullerene-free OPV; STATS ChipPAC unveils new manufacturing method for wafer level packaging; Leti fabricates ultra-scaled split-gate memories with gate length of 16nm; EVG unveils NanoSpray for 2.5D/3D IC/TSV performance