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Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

Global Neon Demand Expected to Exceed Increasing Supply

Linde Electronics and Specialty Gases has made yet another investment to support its vertically integrated neon supply chain, by adding neon production capability to the company’s largest US based atmospheric gases unit (ASU) in La Porte, Texas, which produces oxygen, nitrogen and argon for the petroleum and petrochemical markets in the Houston area.

Test Protocols for the IoT

The Internet-of-Things (IoT) will require components that can sense the world, process and store data, and communicate autonomously within a secured environment.

Applied Materials Intros High Res E-Beam Inspection System

Applied Materials, Inc. introduced its next-generation e-beam inspection system, PROVision, that offers resolution down to 1nm.

Applied Materials Releases Selective Etch Tool

Selectra chamber uses downstream plasma on Producer platform.

Mentor Graphics Offers Tanner Calibre One Verification Suite for the Tanner Analog/Mixed-Signal IC Design Environment

The Tanner Calibre One IC verification suite is now an integral part of the Tanner analog/mixed-signal (AMS) physical design environment

Mentor’s Pattern Matching Tackles IC Verification and Manufacturing Problems

Mentor Graphics Corporation announced that customers and ecosystem partners are expanding their use of Calibre Pattern Matching solution to overcome previously intractable IC verification and manufacturing problems.

Samsung’s Closed-Loop DFM Solution Accelerates Yield Ramps

Mentor Graphics Corp. announced that Samsung Foundry’s Closed-Loop DFM solution uses production Mentor Calibre and Tessent platforms to accelerate customer yield ramps

New Tungsten Barrier/Liner, Fill Processes Reduce Resistance and Increase Yield

Applied Materials recently launched two new products aimed at reducing contact resistance and improving yield in tungsten contacts.

Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies

Amkor Technology, Inc., a outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. to streamline semiconductor package verification with the joint development of a package assembly design kit (PADK) for Amkor’s SLIM and SWIFT advanced fan-out package technologies.