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Got MEMS? Get In Touch With memsstar For Production Equipment

As you might guess from the company’s name, memsstar is involved in microelectromechanical system (MEMS) devices. The company offers manufacturing equipment for “MEMS-specific production,” says CEO Tony McKie.

Optimal+ Turns 10, Wins Accolades For Its Work

Optimal+ has been in business since 2005. The Israel-based company, which has offices around the world, has something else to celebrate this year: Frost & Sullivan gave Optimal+ its 2015 Global Semiconductor Test Visionary Innovation Leadership Award.

Tanaka Precious Metals Is Big in Bonding Wires, Other Products

Tanaka Precious Metals, a company dating back to 1885, is a leading supplier of gold bonding wire and other types of bonding wire for semiconductor packaging. It also specializes in electroplating equipment, unveiling a new system for research and development applications at SEMICON West 2015.

International Consortium Sets Up Shop for Advanced Manufacturing Research

A metropolitan area in the center of the state is putting together a public-private partnership to attract high-tech companies, convincing them to set up shop and create jobs. Part of the attraction is a big public university, engaging in advanced research.

Low-Cost Manufacturing of Flexible Functionalities

FlexTech Alliance updates on substrates, processes, and devices.

Gases: Completely Necessary to Semiconductor Manufacturing

Silicon wafers. Semiconductor packaging. These are commonly known products in materials for manufacturing and assembling microchips. Process gases? Not as familiar a commodity, yet they are just as critical to semiconductor manufacturing.

CoorsTek Increases its Business with Covalent Acquisition, Organic Growth

CoorsTek made one of the biggest acquisitions of its century-long history late last year in purchasing Covalent Materials, formerly known as Toshiba Ceramics.

Veloce Redefines Power Analysis Flow

Mentor Graphics Corp. released the Veloce® Power Application software that enables accurate, timely and efficient power analysis at the system, RTL and gate level for complex SoC designs.

Tackling Parameter Extraction for 16nm and Below

There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.

Conference features the latest in flexible display technology

At Display Week 2015, bigger is better. Smaller is better. And flexible may be best of all, for the era of wearable electronics.