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Veloce Redefines Power Analysis Flow

Mentor Graphics Corp. released the Veloce® Power Application software that enables accurate, timely and efficient power analysis at the system, RTL and gate level for complex SoC designs.

Tackling Parameter Extraction for 16nm and Below

There are four reasons why parasitic parameter extraction is getting a lot harder for 16nm and below technology nodes: 1) 3D device geometries, such as the finFET, which result in more complex electrical fields around the device 2) multi-patterning, which causes increased variability; 3) a demand for 10X tighter levels of accuracy, and 4) increased levels of secrecy from foundries and designers.

Conference features the latest in flexible display technology

At Display Week 2015, bigger is better. Smaller is better. And flexible may be best of all, for the era of wearable electronics.

Intel CEO looks to 3D tech at display conference

Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address at the Society for Information Display conference in San Jose, California.

Samsung to put 10nm chips into mass production by end of 2016

Samsung Semiconductor on Thursday announced that it will have 10-nanometer FinFET chips in volume production by the end of next year.

New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips

Applied Materials introduced the Applied Endura Cirrus HTX PVD, a physical vapor deposition system for creating titanium nitride hardmask films that could be used in fabricating 10-nanometer and 7nm chips.

Danaher to buy Pall in $13.8B deal

Danaher Corporation announced that it will acquire Pall Corporation for $13.8 billion. Once the transaction is completed, the merged company plans to split into two publicly traded corporations.

It’s blue skies for Jabil and its customers

While making printed circuit boards is still a big business for the St. Petersburg, Fla.-based Jabil, which boasts 90 plants in 24 countries around the world, the Blue Sky Center emphasizes that Jabil has progressed from being a board manufacturer to a full-service supply chain management firm.

Safe CMP slurries for future IC materials

New CMP processes for new materials planned to be used in building future IC devices are now in R&D. Early data on process trade-offs as well as on EHS aspects were presented at the CMP Users Group meeting.

Silicon Summit speakers look at the future of chip technology

GSA’s Silicon Summit at the Computer History Museum in Mountain View, Calif., not far from Google’s headquarters, was dominated by talk of IoT, AR, VR, and (to a lesser extent) wearable devices.