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Blog review October 20, 2014

New blogs delve in the challenges of IC verification for automotive electronics, the need for higher purity and better-characterized electronic materials, SEMI’s recent Strategic Materials Conference, the IoT and need for security, IBM’s work on graphene, the polymer dielectric market, a recent IMAPS workshop, the Nobel Prize in physics and FD-SOI at Semicon Europa.

The Week in Review: October 17, 2014

Wearable sensors market expanding; Intermolecular appoints new president and CEO; Qualcomm to acquire CSR, Texas Instruments ships more than 22 billion units of copper wire bonding tech; Element Six develops new thermal grade diamond substrate

Deeper Dive — Mentor Graphics Looks to the Future

There has been a great deal of handwringing and naysaying about the industry’s progress to the 14/16-nanometer process node, along with wailing and gnashing of teeth about the slow progress of extreme-ultraviolet lithography, which was supposed to ease the production of 14nm or 16nm chips. Joseph Sawicki, vice president and general manager of Mentor’s Design-to-Silicon Division, is having none of it.

The Week in Review: October 10, 2014

Samsung invests in new fab; Soraa founder wins Nobel Prize in Physics; SIA announces Robert N. Noyce Award recipient; UMC announces joint venture, SiC and GaN technology adoption

Wrap-up: SEMI’s Strategic Materials Conference

SEMI’s Strategic Materials Conference was held September 30-October 1, 2014, in Santa Clara, CA at the Biltmore hotel. Karey Holland of the Techcet Group provides a wrap-up blog.

The Week in Review: September 26, 2014

Nanium launches industry’s largest WLCSP in volume; Pixelligent wins DOE award; EUV at SPIE Photomask; SiTime closes new round of financing, Silicon Motion elects new board member

SPIE Photomask Technology Wrap-up

Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

Blog review September 22, 2014

New blogs report on the recipients of Tech Awards from The Tech Museum of Innovation, why RF-SOI is good for more than integrating RF switches, the use of TSVs in Samsung’s 64 GB DDR4, MEMS in Shanghai at MIG’s event, the Revitalize American Manufacturing and Innovation (RAMI) Act, the growing complexity of fill in IC design, and a potential game-changer for 3D ICs.

The Week in Review: September 19, 2014

EUV available at 10nm; SEMI releases August book-to-bill; Rudolph’s new SONUS technology; Samsung mass produces 6Gb mobile DRAM, ProPlus Designs expands sales operations to Europe; Mentor Graphics appoints new VP of Embedded Systems

SPIE panel tackles mask complexity issues

Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?