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The Week in Review: August 29, 2014

Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu’s new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

The Week in Review: August 22, 2014

Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone

Blog review August 18, 2014

New blogs give a deeper look at the ASML/IBM announcement on EUV, Samsung’s V-NAND vertical flash, warpage in packaging as discussed at ECTC, embedded software, an IoT infographic and the puzzle of chip design.

The Week in Review: August 15, 2014

The growing semiconductor market in India; MEMSIC’s monolithic, wafer-level packaged accelerometer; Si2 adds new director of 3DIC Programs; Worldwide silicon wafer area shipments increased during the second quarter 2014; LightFair announces Call for Speakers

Blog review August 4, 2014

New blogs report on the silicon innovation forum held at Semicon West, and the Entegris-sponsored yield forum also at Semicon West, , Apple’s acquisition of LuxVue, SOI papers presented at the VLSI Symposia and the controversial results that IBM reported using ASML’s EUV tool (hint: read the comments).

The Week in Review: August 1, 2014

Wireless connectivity semiconductors set for double-digit growth; New benchmark established for EUVL; Cambridge Nanotherm appoints new CEO; Smart cities on the rise; TriQuint Semiconductor is first GaN RF chip manufacturer to achieve MRL 9

The Week in Review: July 25, 2014

A*STAR and industry partners launch joint labs; Peregrine and RF Micro Devices settle outstanding claims; Micron wins award for 16nm NAND flash memory; Analog Devices completes acquisition of Hittite; Reviews of SIF from SEMICON West 2014

Blog review July 21, 2014

New blogs discuss the best way to verify multi-IP, multiple power domain SoCs, contemplate what TSMC may have changed in 20nm devices from the 28nm generation, what happens when we run out of room “at the bottom” around 4nm, the recent EUV lithography workshop, presentations from The ConFab last month, and Qualcomm’s perspective on 3D integration.

Blog review July 14, 2014

New blogs give several different perspectives on Moore’s Law and the potential for continued scaling, the persistent uncertainty of EUV lithography, the VLSI Symposia and FD-SOI, and the recent Suss Technology Forum.

Blog review June 30, 2014

New blogs review positive comments at The ConFab last week by IBM’s Gary Patton; next week’s Silicon Innovation Forum to held in conjunction with SEMICON West; an interview with Laurent Malier, CEO of CEA-Leti, and news of Intel’s debut of the Xenon Phil processor “Knights Landing” in 2015.