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Blog review July 21, 2014

New blogs discuss the best way to verify multi-IP, multiple power domain SoCs, contemplate what TSMC may have changed in 20nm devices from the 28nm generation, what happens when we run out of room “at the bottom” around 4nm, the recent EUV lithography workshop, presentations from The ConFab last month, and Qualcomm’s perspective on 3D integration.

Blog review July 14, 2014

New blogs give several different perspectives on Moore’s Law and the potential for continued scaling, the persistent uncertainty of EUV lithography, the VLSI Symposia and FD-SOI, and the recent Suss Technology Forum.

Blog review June 30, 2014

New blogs review positive comments at The ConFab last week by IBM’s Gary Patton; next week’s Silicon Innovation Forum to held in conjunction with SEMICON West; an interview with Laurent Malier, CEO of CEA-Leti, and news of Intel’s debut of the Xenon Phil processor “Knights Landing” in 2015.

The Week in Review: June 20, 2014

Book-to-bill remains consistent; Inpria receives additional investments; Entegris inaugurates new i2M Center; memsstar relocates to new facility; GS Nanotech announces plan to launch mass assembly of 3D stacked TSVs; Cadence completes acquisition of Jasper Design

Blog review June 16, 2014

New blogs give a preview of an upcoming MEMS webcast; look at the Synopsys Galaxy Design platform’s support of FD-SOI; presentations from the recent Symposium on Polymers; SEMI’s role in supporting legislation in the U.S., Qualcomm’s call for monolithic 3D; and why some companies still struggle with predicting financial operational performance.

The Week in Review: June 13, 2014

2014 and 2015 to be growth years; Flat-panel display shipments increase; News from the 2014 Symposium on VLSI Technology; Release of new UVC LEDs; Dow Corning’s new grading structure for power electronics industry

The Week in Review: June 6, 2014

Fab equipment spending set for historic increase; SID unveils award winners; SIA shows semi sales for April; Imec to collaborate with Samsung; Synopsys and Intel collaborate on SoC design enablement

Blog review June 2, 2014

New blogs address the Internet of Things, which TSMC’s John Lin sees as the next big thing after mobile devices; Applied Materials’ new Volta system design around cobalt liners and capping layers; Soitec’s Christophe Maleville’s view on FDSOI; the recent SEMI 2.5/3D IC forum in Singapore; questions surrounding EUV lithography’s insertion into volume manufacturing, and the MEMS Industry Group’s Conference in Japan.

The Week in Review: May 30, 2014

Applied Materials enables cost-effective vertical integration of 3D chips; STATS ChipPAC introduces robust encapsulated wafer level packaging technology; Global semiconductor leaders develop plan to promote worldwide industry growth; IEDM announces 2014 Call for Papers; Strategic investors to connect with startups at SEMICON West event; Bob Metcalfe to keynote

The Week in Review: May 23, 2014

Worldwide silicon wafer area shipments increase; SEMI book-to-bill ratio; KLA-Tencor releases new reticle inspection system; Mentor Graphics acquires Nimbic; ON Semiconductor introduces new MOSFETs; Brewer Science unveils new temporary wafer bonder;