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The Week in Review: September 26, 2014

Nanium launches industry’s largest WLCSP in volume; Pixelligent wins DOE award; EUV at SPIE Photomask; SiTime closes new round of financing, Silicon Motion elects new board member

SPIE Photomask Technology Wrap-up

Extreme-ultraviolet lithography was a leading topic at the SPIE Photomask Technology conference and exhibition, held September 16-17-18 in Monterey, Calif., yet it wasn’t the only topic discussed and examined. Mask patterning, materials and process, metrology, and simulation, optical proximity correction (OPC), and mask data preparation were extensively covered in conference sessions and poster presentations.

Blog review September 22, 2014

New blogs report on the recipients of Tech Awards from The Tech Museum of Innovation, why RF-SOI is good for more than integrating RF switches, the use of TSVs in Samsung’s 64 GB DDR4, MEMS in Shanghai at MIG’s event, the Revitalize American Manufacturing and Innovation (RAMI) Act, the growing complexity of fill in IC design, and a potential game-changer for 3D ICs.

The Week in Review: September 19, 2014

EUV available at 10nm; SEMI releases August book-to-bill; Rudolph’s new SONUS technology; Samsung mass produces 6Gb mobile DRAM, ProPlus Designs expands sales operations to Europe; Mentor Graphics appoints new VP of Embedded Systems

SPIE panel tackles mask complexity issues

Photomasks that take two-and-a-half days to write. Mask data preparation that enters into Big Data territory. And what happens when extreme-ultraviolet lithography really, truly arrives?

The Week in Review: September 12, 2014

Front end fab equipment spending to increase in 2015; GLOBALFOUNDRIES announces scholarship program; SEMI wins request for etch equipment export control review; New deposition equipment supplier, RF power semiconductor spending on the rise

Blog review September 8, 2014

New blogs report on a “perfect storm” when it comes to the growing complexity of fill in IC design; the disruptive nature of 3D NAND for flash storage; fan out packaging papers presented at ECTC by STATSChipPAC, SPIL, Nanium and Google/Novartis; a look inside and outside Leti in France; FD-SOI’s role in mobile platforms; and how EDA is fostering education.

The Week in Review: September 5, 2014

New non-volatile memory technology; President and CEO of FSA announced; Samsung to use ProPlus 14nm finFET SPICE modeling platform; MEMS gyroscope from Analog Devices; SEMICON Taiwan held this week

The Week in Review: August 29, 2014

Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu’s new foundry company; Thinnest-possible semiconductor; SEMI announces keynotes for Vietnam Semiconductor Strategy Summit

The Week in Review: August 22, 2014

Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new member to board of directors; STATS ChipPAC achieves shipping milestone