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News Stories Archive

Blog review December 16, 2014

News blogs delve into TSMC’s announcement of EUV production orders, the International Electron Devices Meeting (IEDM), The 4th Annual Global Interposer Technology Workshop, new MRS awards, electronic materials challenges, FD-SOI, ESD and the recent IMAPS conference.

Mentor Graphics Announces New Verification IP for PCIe 4.0

Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification by a factor of up to 10X.

Applied Materials Introduces New Hardmask Process, Saphira

A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical strength, could reduce manufacturing costs by 35% per module.

The Week in Review: November 21, 2014

China and US boost industrial semiconductor market growth; Global notebook PC market grows; Book-to-bill report shows another month below parity; Holst Center and Cartamundi develop NFC IGZO TFT for gaming; Combo MEMS sensors continue their growth; SEMI announces keynote speakers

NFC IGZO TFT for Game Cards

Holst Centre, imec, and Cartamundi work on flexible Near Field Communication tags embedded in paper cards.

Applied Materials Q4 Report

Applied Materials reported today that its long-pending merger with Tokyo Electron Ltd. may not close until the first quarter of 2015.

Blog review October 27, 2014

New blogs address the challenge of ensuring that manually-designed interconnects will survive ESD events, Nanium’s eWLB fan out technology, The Lanza challenge, Moore’s Law 2.0, Mike Splinter’s pioneer business leader award, and the FD-SOI forum in Shanghai.

The Week in Review: October 24, 2014

GlobalFoundries acquires IBM’s semi business; Mergers and acquisitions shake up automotive semi supplier landscape; Adlyte achieves performance benchmark for EUV light source; Gigaphoton achieves 3-hours of continuous operation of its EUV light source; Book-to-bill ratio declines in September

Blog review October 20, 2014

New blogs delve in the challenges of IC verification for automotive electronics, the need for higher purity and better-characterized electronic materials, SEMI’s recent Strategic Materials Conference, the IoT and need for security, IBM’s work on graphene, the polymer dielectric market, a recent IMAPS workshop, the Nobel Prize in physics and FD-SOI at Semicon Europa.

The Week in Review: October 17, 2014

Wearable sensors market expanding; Intermolecular appoints new president and CEO; Qualcomm to acquire CSR, Texas Instruments ships more than 22 billion units of copper wire bonding tech; Element Six develops new thermal grade diamond substrate