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Qualcomm Posts Lower Profit, Revenue in Quarter

Qualcomm reported net income of $1.5 billion for the fiscal first quarter ended December 27, down 24 percent from $2.0 billion a year ago. Revenue fell 19 percent to $5.8 billion, from $7.1 billion in the first quarter of fiscal 2015.

AMD Net Loss Widens in 2015 on Lower Revenue

Advanced Micro Devices on Tuesday reported a net loss of $660 million on revenue of $3.99 billion for 2015, compared with a net loss of $403 million on revenue of $5.51 billion in 2014.

ASML Has Record Revenue for 2015; Will Raise Dividend, Buy Back More Stock

ASML Holding today reported net income of about $1.5 billion on revenue of $6.855 billion for 2015. That compared with 2014’s net income of $1.3 billion on revenue of $6.385 billion.

Intel Posts Mixed Results for Q4, 2015

Intel reported net income of $11.4 billion on revenue of $55.4 billion for the year ended December 26, compared with net of $11.7 billion on revenue of $55.9 billion in 2014.

Startup Works on Ultralow-k Materials for Chips, Displays

The very last presentation at the 12th annual 3D Advanced Semiconductor Integration and Packaging conference was given by Hash Pakbaz, president and chief executive officer of SBA Materials, a developer of nanoporous and mesoporous materials for semiconductor manufacturing and other applications.

3D ASIP Conference Hears from EDA, IC Gear Companies

John Ferguson of Mentor Graphics provided the electronic design automation perspective on packaging technology at the 12th annual 3D ASIP conference in Redwood City, Calif.

Packaging Conference Addresses Challenges, Opportunities in New Technologies

On the second day of the 12th annual 3D ASIP conference, the heavy hitters came out to talk. Attendees heard presentations from executives of Amkor Technology, the Defense Advanced Research Projects Agency (DARPA), Northrop Grumman, Taiwan Semiconductor Manufacturing, Teledyne Scientific & Imaging, and Xilinx, among other companies.

Conference Features “The Year of Stacked Memory” in 2015

The theme of this year’s 3D Architectures for Semiconductor Integration and Packading (3D ASIP) conference is “The Year of Stacked Memory,” noting how memory die stacked in one package are becoming more commonplace in 2015.

Dow, DuPont to Merge in Combination of Chemical Giants

In a deal with significant implications for high-tech chemicals and materials, The Dow Chemical Company and E. I. du Pont de Nemours and Company (DuPont) have agreed to merge, forming the second largest chemical company in the world, behind BASF SE.

China Bolsters its IC Gear Business with Mattson Acquisition

Mattson Technology agreed this month to be acquired by Beijing E-Town Dragon Semiconductor Industry Investment Center, a limited partnership in China, for about $300 million in cash.