Part of the  

Solid State Technology


The Confab


About  |  Contact

Posts Tagged ‘Intel’

Next Page »

InvenSense Developers Conference Tackles Sensor Security, New Technologies

Monday, November 23rd, 2015

By Jeff Dorsch, Contributing Editor

The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors.

There were track sessions devoted to mobile technology and the Internet of Things, with the latter featuring presentations on industrial and automotive applications, smart homes and drones, smartphones and tablet computers, and wearable electronics. InvenSense partner companies had their own track on New Technologies, fitting into the conference’s “Internet of Sensors” theme.

The conference also featured two developer tracks in parallel, providing five InvenSense presentations on its FireFly hardware and software, SensorStudio, and other offerings.

One of the presentations that wrapped up the conference on Wednesday afternoon (November 18) was given by Pim Tuyls, chief executive officer of Intrinsic-ID, the Dutch company that worked with InvenSense to develop the TrustedSensor product, a secure sensor-based authentication system incorporating the FireFly system-on-a-chip device.

TrustedSensor will be shipped to alpha customers in the first quarter of 2016 and will go out to beta customers in the second quarter of next year, according to Tuyls. “This is real,” he said.

The Intrinsic-ID founder briefly reviewed the company’s history, to start. It was spun out of Royal Philips in 2008 and is an independent company with venture-capital funding, Tuyls noted.

Intrinsic-ID was founded to provide “cyber physical security based on physically unclonable function,” or PUF, Tuyls said. “We invented PUF,” he added. “It has been vetted by security labs and government agencies,” among other parties.

Taking “The Trusted Sensor” as his theme, the Intrinsic-ID CEO said, “Sensors are the first line of defense. You want to make sure you can provide a certain level of security.”

It is critical to achieve “the right balance” in designing, fabricating, and installing sensors, with security, flexibility, and low footprint among the key considerations, according to Tuyls.

While whimsically describing PUF as “a magic concept,” Tuyls noted, “Chips are physically unique,” with no two completely alike due to manufacturing processes.

PUF can “extract a crypto key from any device,” he added. “You can authenticate any device.”

Intrinsic-ID has tested the PUF technology with a wide variety of silicon foundries, Tuyls said – namely, Cypress Semiconductor, GlobalFoundries, IBM, Intel, Renesas Electronics, Samsung Electronics, Taiwan Semiconductor Manufacturing, and United Microelectronics. It has been implemented by Altera, Microsemi, NXP Semiconductors, Samsung, and Synopsys, he added, and process nodes ranging from 180 nanometers down to 14nm have been tested.

Tuyls concluded by emphasizing the importance of sensor security for the Internet of Things. “We should not wait; we should not try to save a few cents,” he said. “It is important, but it is hard.”

Earlier in the day, attendees heard from Sam Massih, InvenSense’s director of wearable sensors. “There’s a wearable solution for every part of the body,” he commented.

“Step count isn’t enough,” Massih said. “You need context for data.” He cited the example of a user who goes to the gym three times a week and spends an hour on the elliptical trainer machine for one hour on each visit.

“That’s data that can be monetized,” he said.

InvenSense announced last month that it would enter the market for automotive sensors. Amir Panush, the company’s head of automotive and IoT industrial, said in his presentation, “Sensors need to be smart enough.”

The megatrends in automotive electronics include the use of motion sensors for safety in advanced driver-assistance systems (ADAS), the smart connected car, and tough emission restrictions, according to Panush.

“We have signed a deal with a Tier One partner,” Panush said, meaning a leading automotive manufacturer, without identifying the company. “We are ramping up internal R&D in automotive.” InvenSense is presently opening design centers focusing on the $5 trillion automotive market, he added.

InvenSense was founded in 2003 and went public in 2011. The company posted revenue of $372 million in fiscal 2015 with a net loss of $1.08 million (primarily due to charging $10.55 million in interest expense against net income), after being profitable for the previous four years. InvenSense gets more than three-quarters of its revenue from mobile sensors and has a growing business in IoT sensors.

Customers in Asia accounted for 63 percent of the company’s fiscal 2015 revenue, according to InvenSense’s 10-K annual report. The company spent $90.6 million on research and development, representing about 24 percent of its net revenue.

GlobalFoundries and TSMC make nearly all of InvenSense’s wafers. Assembly packaging of its microelectromechanical system (MEMS) devices and sensors is outsourced to Advanced Semiconductor Engineering, Amkor Technology, Lingsen Precision Industries, and Siliconware Precision Industries.

The company had 644 employees as of March 29, 2015, with nearly half of them involved in R&D.

STMicroelectronics is InvenSense’s primary competitor for consumer motion sensors, the 10-K states, while the company also competes with Analog Devices, Epson Toyocom, Kionix, Knowles, Maxim Integrated Products, MEMSIC, Murata Manufacturing, Panasonic, Robert Bosch, and Sony.

Wally Rhines of Mentor Graphics Gets Phil Kaufman Award

Monday, November 16th, 2015

By Jeff Dorsch, Contributing Editor

There was a celebrity roast on 4th Street in San Jose, Calif., on Thursday night.

The occasion was the presentation of the annual Phil Kaufman Award to Wally Rhines, chairman and chief executive officer of Mentor Graphics, for his contributions in the field of electronic design automation. Dr. Rhines has served as Mentor’s CEO since 1993 and as chairman of the EDA software and services company since 2000.

The Phil Kaufman Award is presented by the Electronic Design Automation Consortium (EDAC) and the IEEE Council on Electronic Design Automation (CEDA). It honors the memory of Philip A. Kaufman, the EDA industry pioneer, electronics engineer, and entrepreneur, who died in 1992.

Rhines received some gentle ribbing from Craig Barrett, the former Intel chairman and CEO, who once was a Stanford University professor and served on the advisory panel for Rhines’ doctoral thesis.

Barrett said of Rhines, who was a top chip executive at Texas Instruments prior to joining Mentor, “We competed for about 20 years, which is probably why he went to Mentor Graphics.”

He added, “His hairline is receding faster than mine.”

The retired Intel executive later said Rhines’ career has been “fantastic,” adding, “He certainly exceeded all our expectations. You done good, man. Keep it up.”

A video shown before the formal presentation offered Barrett and other top executives showering accolades on Rhines, who turned 69 years old on Wednesday, November 11. Among those praising Rhines were Aart de Geus, chairman and co-CEO of Synopsys, and Lip-Bu Tan, president and CEO of Cadence Design Systems – business rivals and friends.

“He’s actually a cool cat,” de Geus said of Rhines in the video.

In his remarks, Rhines returned the favor to those praising him, saying of de Geus and Tan, “We’ve had enjoyable interactions.

“I’m particularly gratified that my professor, Craig Barrett, came here for my roast,” he said. “He willingly paid for the beer at The Oasis in Menlo Park.”

On a more serious note, Rhines said of Barrett, “He was very critical to my success.”

Rhines recalled the days when chip designers used rubylith sheets to lay out integrated circuits. “We evolved an industry,” he commented. While IC design and layout has become highly automated with EDA software, system design in many industries remains in the rubylith era, Rhines said. He called for a movement to “automate system design the way we automated electronic design.”

The evening drew to a close with a spoof video depicting Rhines as not only a visionary leader in EDA, but also as a race-car mechanic, a sushi chef, and a hair stylist. A good time was had by all.

IoT Security, Software Are Highlighted at ARM TechCon

Friday, November 13th, 2015


By Jeff Dorsch, Contributing Editor

Many people are aware of the Internet of Things concept. What they want to know now is how to secure the IoT and how to develop code for it.

Plenty of vendors on hand for the ARM TechCon conference and exposition in Santa Clara, Calif. this week were offering solutions on both counts. And there were multiple presentations in the three-day conference program devoted to both subjects.

Mentor Graphics, for instance, spoke about “Use Cases for ARM TrustZone Benefits of HW-Enforced Partitioning and OS Separation.” MediaTek presented on “Secured Communication Between Devices and Clouds with LinkIt ONE and mbedTLS.” And so on.

ARM CEO Simon Segars said in his keynote address that security and trust are one of the key principles in the Internet of Things (the others being connectivity and partnership across the ecosystem). Security and trust, he asserted, must be “at every level baked into the hardware, before you start layering software on top.”

James Bruce, ARM’s director of mobile solutions, addressed the security topic at length in an interview at the conference. ARM is taking a holistic approach to security through its TrustZone technology, he said, describing it as “a great place to put [network] keys.”

With microcontrollers, the chips often used in IoT devices, TrustZone makes sure sensitive data is “inaccessible to normal software,” Bruce said. At the same time, “you want to make devices easy to update,” he added.

ARM wants to enable its worldwide ecosystem of partners to stay ahead of cyberattacks and other online dangers, according to Bruce. “That’s why we’re doing the groundwork now,” he said.

The reaction of ARM partners to the introduction of TrustZone CryptoCells and the new ARMv8-M architecture for embedded devices has been “very positive,” Bruce said, adding, “Security can’t be an afterthought.”

Ron Ih, senior manager of marketing and business development in the Security Products Group at Atmel, described standard encryption as “only a piece” of security measures. “Authentication is a key part,” he said.

Atmel was touting its Certified-ID platform at ARM TechCon, featuring the ATECC508A cryptographic co-processor. Ih cited the “made for iPhone” chips that Apple requires of its partners developing products to complement the smartphone, ensuring ecosystem control. “You either have the chip or you don’t,” he said.

“People don’t care about the devices,” Ih concluded. “They care about who the devices are connected to.”

Simon Davidmann, president and chief executive officer of Imperas Software, is a veteran of the electronic design automation field, and he brings his experience to bear in the area of embedded software development.

Software, especially for the IoT, is “getting so complex, you can’t do what you used to do,” he said. “The software world has to change. Nobody should build software without simulation.”

At the same time, simulation is “necessary but not sufficient” in software development, he said. Code developers should be paying attention to abstractions, assertions, verification, and other aspects, according to Davidmann.

“Our customers are starting to adopt virtual platforms,” he added.

Jean Labrosse, president and CEO of MIcrium, a leading provider of real-time operating system kernels and other software components, said “the industry is changing” with the onset of the Internet of Things. Multiple-core chips are entering into the mix – not only for their low-power attributes, but for the safety and security they can provide, he noted.

Jeffrey Fortin, director of product management at Wind River and a specialist in IoT platforms, spoke on the last day of the conference on “Designing for the Internet of Things: The Technology Behind the Hype.”

Wind River, now an Intel subsidiary, has been around for more than three decades, developing “an embedded operating system that could be connected to other systems,” he said.

There are two business interests driving IoT demand, according to Fortin – business optimization and business transformation. He described the IoT as “using data to feed actionable analytics.”

The foundation of the IoT is hardware and software that provides safety and security, Fortin said.

Colt McAnlis of Google (Photo by Jeff Dorsch)

In the final keynote of ARM TechCon, Google developer advocate Colt McAnlis spoke on “The Hard Things About the Internet of Things.”

IoT technology, at present, is “not optimizing the user,” he said in a frequently funny and witty presentation. Networking and battery issues are bedeviling the IoT ecosystem, he asserted.

By draining the batteries of mobile devices with near-constant signals, such as setting location via GPS, companies are imposing “a taxation system for every single thing [IoT] does,” McAnlis said. “We’re talking about how often we’re sampling. People are already realizing this sucks.”

Beacons installed in a shopping mall can bombard smartphone users with advertising and coupons, he noted, while the property management gets data on specifics of foot traffic. “Imagine this at scale,” installed on every block of San Francisco, he added.

“We have a chance to not make this a reality,” McAnlis asserted. “We need IoT technology to make this not suck for users.”

At the end of his keynote, McAnlis asked the attendees to hold up their smartphones and vow, “I solemnly agree not to screw this up.”

Solid State Technology: August 7-14, 2015

Monday, August 24th, 2015
YouTube Preview Image

Solid State Watch: July 31-August 6, 2015

Friday, August 7th, 2015
YouTube Preview Image

Intel CEO looks to 3D tech at display conference

Tuesday, June 2nd, 2015


By Jeff Dorsch, Contributing Editor

Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address today at the Society for Information Display conference in San Jose, California.

In the five decades of Moore’s Law, named for the Intel co-founder, “computing has really had one trajectory,” Krzanich said – smaller, more personal, and more connected.

With the advent of wearable gadgets, implemented with Intel’s Curie module, “personal is at a new level,” he noted. “Displays are more personal and more connected.”

The devices of today, such as smartphones and tablet computers, “are dumb displays,” he asserted. “Everything you do is flat.”

While the advent of touch displays has freed users from computer mice and keyboards, the display remains “2D, flat,” Krzanich noted.

The next step is to make computers able to “see and hear like a human,” he said. “For humans, everything is 3D.”

He added, “That future is not too far off.”

Speech recognition has been in development for some time and has demonstrably advanced, Krzanich said. “When you can hear but not see, you’re only halfway there,” he added.

The Intel chief then held up a RealSense module, which is 3.75 millimeters in thickness. It can be embedded in the top bezel of a laptop computer, among other applications, he noted.

Intel is making its RealSense software development kit available at, and “all of these APIs are free,” Krzanich said.

The chip company has been working with such companies as Disney, Lego, and Food Network to develop RealSense applications, he added.

“RealSense cameras enable a new video experience, a much more immersive experience,” Krzanich said. “The computer starts to see the world as you and I do.”

Moving beyond consumer applications, Intel is now working on industrial and professional apps, according to Krzanich.

He demonstrated how a device with a RealSense camera could complete a three-dimensional scan of his body in about 30 seconds, and showed off a bust of himself made with a 3D printer.

This was followed by a demonstration of putting a virtual Brian Krzanich into a video game, where the figure ran and did handsprings and backflips. “If only I could do this in real life,” he joked.

Krzanich also demonstrated how RealSense can work with augmented reality, repeating a demo done at the International Consumer Electronics Show in January, where a virtual piano appeared in mid-air and could be played. With some help, he showed how a virtual secondary screen could materialize in mid-air and could employ AR for a variety of applications.

Krzanich appealed to the keynote attendees to take advantage of the free RealSense SDK.

“We want you to create something bigger and better,” he concluded. “We need help.”

Solid State Watch: May 1-8, 2015

Tuesday, May 12th, 2015
YouTube Preview Image

Solid State Watch: March 20-26, 2015

Thursday, March 26th, 2015
YouTube Preview Image

Proponents of EUV, immersion lithography face off at SPIE

Wednesday, February 25th, 2015

By Jeff Dorsch, contributing editor

The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium in San Jose, Calif.

Extreme-ultraviolet lithography, on one side, is represented by ASML Holding, its Cymer subsidiary, and ASML’s EUV customers, notably Intel, Samsung Electronics, and Taiwan Semiconductor Manufacturing.

On the other side is 193i immersion lithography, represented by Nikon and its customers, which also include Intel and other leading chipmakers.

There are other lithography technologies being discussed at the conference, of course. They are bit players in the drama, so to speak, although there is a lot of discussion and buzz about directed self-assembly technology this week.

ASML broke big news on Tuesday morning, reporting that Taiwan Semiconductor Manufacturing was able to expose more than 1,000 wafers in one day this year with ASML’s NXE:3300B EUV system. “During a recent test run on an NXE:3300B EUV system we exposed 1,022 wafers in 24 hours with sustained power of over 90 watts,” Anthony Yen, TSMC’s director of research and development, said at SPIE.

While ASML was obviously and justifiably proud of this milestone, after achieving its 2014 goal of producing 500 wafers per day, it cautioned that more development remains for EUV technology.

“The test run at TSMC demonstrates the capability of the NXE:3300B scanner, and moves us closer to our stated target of sustained output of 1,000 wafers per day in 2015,” ASML’s Hans Meiling, vice president service and product marketing EUV, said in a statement. “We must continue to increase source power, improve system availability, and show this result at multiple customers over multiple days.”

The day before, Cymer announced the first shipment of its XLR 700ix light source, which is said to improver scanner throughput and process stability for manufacturing chips with 14-nanometer features. The company also debuted DynaPulse as an upgrade option for its OnPulse customers. The XLR 700ix and DynaPulse together are said to offer better on-wafer critical dimension uniformity and provide stable on-wafer performance.

Another revelation at SPIE is that SK Hynix has been working with the NXE:3300, too, and is pleased with the system’s capabilities. According to Chang-Moon Lim, who spoke Monday morning, SK Hynix was recently able to expose 1,670 wafers over three days, with uptime of 86.3 percent over that period.

“Progress has been significant on various aspects, which should not be overshadowed by the delay of [light] sources,” he said of ASML’s EUV systems.

The Korean chipmaker is exploring how it could work without pellicles on the EUV reticle, Lim noted. ASML has been developing a pellicle, made with polycrystalline silicon, in cooperation with Intel and others.

Nikon Precision and other Nikon subsidiaries didn’t issue any press releases at SPIE. The companies presented much information at Sunday’s LithoVision 2015 event, held at the City National Civic auditorium, across the street from the San Jose Convention Center, where SPIE Advanced Lithography is staged.

On offer at the Nikon conference was the claimed superiority of 193i immersion lithography equipment to EUV systems for the 14nm, 7nm and future process nodes. Donis Flagello, Nikon Research Corp. of America’s president, CEO, and chief operating officer, emphasized that message on Tuesday morning with an invited paper on “Evolving optical lithography without EUV.”

Nikon’s champion machine is the NSR-S630D immersion scanner, which was touted throughout the LithoVision event. The system is capable of exposing 250 wafers per hour, according to Nikon’s Yuichi Shibazaki.

Ryoichi Kawaguchi of Nikon told attendees, “EUV lithography needs more stability and improvement.” He also brought up the topic of manufacturing on 450-millimeter wafers, which has mostly gone ignored in the lithography competition. Nikon will ship a 450mm system this spring to the Global 450 Consortium in Albany, N.Y., Kawaguchi said. The bigger substrates could provide “an alternative option to reduce cost,” he added.

Erik Byers of Micron Technology observed, “EUV is not a panacea.”

Which lithography technology will prevail in high-volume manufacturing? The question may not be definitively answered for some time.

Blog review January 26, 2015

Monday, January 26th, 2015

Scott McGregor, President and CEO of Broadcom, sees some major changes for the semiconductor industry moving forward, brought about by rising design and manufacturing costs. Speaking at the SEMI Industry Strategy Symposium (ISS) in January, McGregor said the cost per transistor was rising after the 28nm, which he described as “one of the most significant challenges we as an industry have faced.” Pete Singer reports.

Matthew Hogan, Mentor Graphics writes a tongue-in-cheek blog about IP, saying chip designers need only to merely insert the IP into the IC design and make the necessary connections. Easy-peasey! Except…robust design requires more than verifying each separate block—you must also verify that the overall design is robust. When you are using hundreds of IPs sourced from multiple suppliers in a layout, how do you ensure that the integration of all those IPs is robust and accurate?

Dick James, Senior Analyst at Chipworks IEDM blogs that Monday was FinFET Day. He highlights three finFET papers, by TSMC, Intel, and IBM.

A research team led by folks at Cornell University (along with University of California, Berkeley; Tsinghua University; and Swiss Federal Institute of Technology in Zurich) have discovered how to make a single-phase multiferroic switch out of bismuth ferrite (BiFeO3) as shown in an online letter to Nature. Ed Korczynski reports.

SEMI praised the bipartisan effort in the United States Congress to pass the Revitalize American Manufacturing and Innovation (RAMI) Act as part of the year-end spending package. Since its introduction in August 2013, SEMI has been a champion and leading voice in support of the bill that would create public private partnerships to establish institutes for manufacturing innovation.

Phil Garrou takes a look at some of the key presentations at the 2014 IEEE 3DIC Conference recently held in Cork, Ireland.

Adele Hars writes that there were about 40 SOI-based papers presented at IEDM. In Part 1 of ASN’s IEDM coverage, she provides a rundown of the top SOI-based advanced CMOS papers.

Karen Lightman of the MEMS Industry Group says power is the HOLY GRAIL to both the future success of wearables and IoT/Everything.  Power reduction and management through sensor fusion, power generation through energy harvesting as well as basic battery longevity. It became very clear from conversations at the MIG conference as well as in talking with folks on the CES show floor that the issue of power is the biggest challenge and opportunity facing us now.

In order to keep pace with Moore’s Law, semiconductor market leaders have had to adopt increasingly challenging technology roadmaps, which are leading to new demands on electronic materials (EM) product quality for leading-edge chip manufacturing. Dr. Atul Athalye, Head of Technology, Linde Electronics, discusses the challenges.

Next Page »