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The Week in Review: August 29, 2014

Intel releases new packaging technologies; Fairchild Semiconductor to close two facilities; KLA-Tencor introduces new metrology tools; UMC joins Fujitsu's new foundry company; Thinnest-possible ...

The Week in Review: August 22, 2014

Collaboration for next-generation smart glasses; Book-to-bill ratio holds steady in July; Intel and Unity to collaborate; MediaTek launches new R&D facility; Amkor appoints new ...

Blog review August 18, 2014

New blogs give a deeper look at the ASML/IBM announcement on EUV, Samsung’s V-NAND vertical flash, warpage in packaging as discussed at ECTC, embedded software, an IoT infographic ...

Top Stories

Lithography: What are the alternatives to EUV?

Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

Overlay Metrology Suite for Multiple Patterning

KLA-Tencor releases WaferSight PWG, LMS IPRO6, and K-T Analyzer 9.0 to control overlay and critical dimension (CD) in advanced IC fabs.

Atomic Layer Etch now in Fab Evaluations

Lam’s CTO talks about the future of etch in beta-site tests.

An EDA view of semiconductor manufacturing

The concern that there is a significant break between tools used by designers targeting leading edge processes, those at 32 nm and smaller to be precise, and those used to

3D memory for future nanoelectronic systems

Bit-growth slows while specialized stacking accelerates innovation in future memory solutions for communications, energy, and health-care.

Technology Features

Feature Articles

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Qualcomm: Scaling down is not cost-economic anymore – so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important ...

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective ...

Eliminating the Challenges of Giga-Scale Circuit Design With Nano-Scale Technologies

Dr. Lianfeng Yang of ProPlus Design Solutions, Inc. says that the only way out of today's challenges is to more tightly integrate tools for nano-scale modeling, giga-scale SPICE simulation ...

Design for Yield Trends

Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

Monte Carlo Analysis Has Become A Gamble

Years ago, someone overhead a group of us talking about Monte Carlo analysis and thought we were referring to the gambling center of Monaco and not computational algorithms that have ...

Model-Based Hints: GPS for LFD Success

For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry.

Round Tables

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

Big sell: IP Trends and Strategies

Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.

Experts At The Table: Commercial potential and production challenges for 3D NAND memory technology

In this roundtable discussion focused on 3D NAND , we hear from Samsung Electronics (SE) in South Korea, Bradley Howard, Vice President of Advanced Technology Group, Etch Business Unit, ...

Experts At The Table: Exploring the relationship between board-level design and 3D, and stacked, dies

SemiMD discussed what board level design can tell us about chip-level (three-dimensional) 3D and stacked dies with Sesh Ramaswami, Applied Materials’ Managing Director, TSV and Advanced ...

Experts At The Table: Design For Yield (DFY) moves closer to the foundry/manufacturing side

SemiMD discussed the trend for design for yield (DFY) moving closer to the foundry/manufacturing side with Dr Bruce McGaughy, Chief Technology Officer and Senior Vice President of Engineering, ...

Experts Roundtable: More than Moore – manufacturing challenges for MEMS

Semiconductor Design & Manufacturing discussed ‘More than Moore‘ (MtM) standardization topics and challenges with Peter Himes, VP of marketing and strategic alliances ...

Podcasts/Videos/Webcasts

Solid State Watch: August 22-28, 2014

Fairchild Semiconductor closes two facilities; Intel releases new packaging technologies, Thinnest-possible semiconductor material; New metrology tools from KLA-Tencor

Solid State Watch: August 15-22, 2014

Silicon wafer shipments increase; The growing semiconductor industry in India; Equipment book-to-bill ratio remains steady; Next-generation smart glasses in development

Solid State Watch: July 31-August 7, 2014

Global semi sales hit record high; Benchmark established for EUV; Semiconductors for health and fitness set for double-digit growth; Smart cities on the rise

Solid State Watch: June 27-July 3, 2014

Gigaphoton achieves 92W EUV light source output; New graphene substitute has HVM potential; SMIC and Qualcomm collaborate; Nanolab Technologies acquires Microtech

Solid State Watch: June 13-19, 2014

Inpria completes another round of financing; GS Nanotech to launch mass assembly of 3D TSVs; memsstar relocates; Entegris launches i2M Center

Solid State Watch: June 6-12, 2014

Entropic consolidation; Field-effect transistor research, 2014 Symposium on VLSI Technology; ON Semiconductor to acquire Aptina Imaging

Solid State Watch: May 30-June 5, 2014

Fab equipment spending increase; SID announces winners of Display Industry Awards; Samsung's 14nm finFET process technology ready; Synopsys, Intel and ST collaborate on 28nm FD-SOI ...

Solid State Watch: May 23-29, 2014

STATSChipPAC releases new encapsulated wafer level chip scale package; Applied Materials reveals the Endura Ventura PVD system; Ziptronix and EV Group achieve submicron post-bond alignment ...

Solid State Watch: May 16-22, 2014

Increase in first quarter wafer shipments; Changes to the top 25 semiconductor suppliers; IC Advanced Technology Research Institute; The 17th annual IITC held this week

Solid State Watch: May 9-15, 2014

STMicroelectronics licenses 28nm FD-SOI to Samsung; DoD policy to reduce counterfeit semiconductors; OLED market growth; Applied Materials releases new CVD system