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5nm Node Needs EUV for Economics

At IEDM 2014 last month in San Francisco, Applied Materials sponsored an evening panel discussion on the theme of “How do we continue past 7nm?”

"The Electrical Arts" and the First Trans-Atlantic Telegraph Cable

Before there were electrical engineers and standard definitions for the ampere, ohm and volt, entrepreneurs and scientists in the United Kingdom and the United States worked on the ...

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. ...

Solid Doping for Bulk FinFETs

In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical process

IEDM: Thanks for MEMS-ories

At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those ...

3D ASIP: "It's Complicated"

The presentations at this week's 3D Architectures in Semiconductor Integration and Packaging conference could be summed up in a famous Facebook status.



News Stories

Blog review January 26, 2015

News blogs report on Scott McGregor’s talk at ISS (where he said exponentially rising costs will bring major changes), robust design with IP, FinFET day at IEDM, multiferroic switches, ...

Blog review December 16, 2014

News blogs delve into TSMC’s announcement of EUV production orders, the International Electron Devices Meeting (IEDM), The 4th Annual Global Interposer Technology Workshop, new MRS ...

Mentor Graphics Announces New Verification IP for PCIe 4.0

Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification ...

Technology Features

Feature Articles

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Monolithic 3D breakthrough at IEEE S3S 2014

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) ...

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies ...

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Qualcomm: Scaling down is not cost-economic anymore - so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

Podcasts/Videos/Webcasts

Solid State Watch: January 23-29, 2015

Solid growth in automotive semiconductor market; $4M grant to UMass Lowell for printed and flexible electronics development; Book-to-bill ratio below parity; Researchers use oxides ...

Solid State Watch: January 16-22, 2015

SUNY Poly announces founding president; Solving an organic semiconductor mystery; UC Berkeley Extension announces new semiconductor IC program; 2015 tech trends and drivers

Solid State Watch: December 12-19, 2014

Book-to-bill above parity in November; imec demonstrates graphene EAM on IEDM 2014; Amkor licenses copper pillar wafer bump tech to GLOBALFOUNDRIES; Desktop monitor market experiences ...

Solid State Watch: December 5-11, 2014

Murata completes acquisition of Peregrine; North Carolina State University researches stacking semiconductor materials; SIA announces new president and CEO; Entegris announces availability ...

Solid State Watch: November 25-December 4, 2014

Cypress and Spansion announce merger; SEMATECH announces promising EUV research; Global semiconductor sales reach $29.7B in October; Soitec and CEA-Leti establish new solar cell efficiency ...

Solid State Watch: November 14-20, 2014

Revenue from industrial semiconductors on the rise; Combo MEMS sensors market to reach $1.4B by 2019; Notebook PC market grows while tablets struggle; Book-to-bill below parity for ...

Solid State Watch: November 7-14, 2014

A new product scope for an expanded Information Technology Agreement announced; Silicon wafer shipments increased in third quarter; New CEO of SEMATECH; SIA board of directors announces ...

Solid State Watch: October 31-November 6, 2014

The growing sensors market; Texas Instruments to expand operations in China; GlobalFoundries partners in INVECAS; Worldwide sales of semiconductors hits record-breaking high ...

Solid State Watch: October 23-30, 2014

GLOBALFOUNDRIES to take over IBM's commercial semi business; MegaChips acquires SiTime; imec and Coventor collaborate; Mergers and acquisitions shake up automotive semiconductor landscape ...

Solid State Watch: SEMICON Europa Special Edition

Pete Singer interviews new CEA-Leti CEO in Grenoble, France.