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IEDM: Thanks for MEMS-ories

At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by IBM and Intel. Those ...

3D ASIP: "It's Complicated"

The presentations at this week's 3D Architectures in Semiconductor Integration and Packaging conference could be summed up in a famous Facebook status.

Germanium Junctions for CMOS

Enabling NMOS using Ge channels for CMOS finFETs.

Applied Materials Introduces New Hardmask Process, Saphira

A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical ...

Air-gaps in Copper Interconnects for Logic

Intel’s “14nm-node” process uses air-gaps in dielectrics; direction disclosed four years ago.

RF and MEMS Technologies to Enable the IoT

Communications and energy-harvesting capabilities can be integrated into ubiquitous always-on smart nodes.



News Stories

Blog review December 16, 2014

News blogs delve into TSMC’s announcement of EUV production orders, the International Electron Devices Meeting (IEDM), The 4th Annual Global Interposer Technology Workshop, new MRS ...

Mentor Graphics Announces New Verification IP for PCIe 4.0

Mentor Graphics Corp. announced the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP, which reduces testbench assembly time for ASIC and FPGA design verification ...

Applied Materials Introduces New Hardmask Process, Saphira

A new hardmask material, called Saphira, and accompanying processes was introduced Applied Materials. The material, which is transparent and offers high selectivity and good mechanical ...

Technology Features

Feature Articles

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Experts at the Table: Focus on Semiconductor Materials

The cutting edge in semiconductor manufacturing has meant not only big changes in IC design and process technology, but also in semiconductor materials. Experts weigh in from Linde ...

Monolithic 3D breakthrough at IEEE S3S 2014

In the upcoming 2014 IEEE S3S conference (October 6-9), MonolithIC 3D will unveil a breakthrough flow that is game-changing for 3D IC. For the first time ever monolithic 3D (“M3DI”) ...

Process Watch: Sampling matters

Determining an optimum sampling strategy comes down to weighing the cost of process control against the benefit of capturing the defect or other excursion in a timely manner.

Foundry, EDA partnership eases move to advanced process nodes

A leading semiconductor foundry and an EDA vendor with design-for-yield (DFY) solutions have enjoyed a long-term partnership. Recently, they worked together to leverage DFY technologies ...

Sustainability through Materials Recovery

Recovering and reusing materials is becoming an increasingly essential consideration in order to ensure consistent quality, a stable supply of materials, and lower costs. On- and off-site ...

Qualcomm: Scaling down is not cost-economic anymore - so we are looking at true monolithic 3D

Over the course of three major industry conferences (VLSI 2013, IEDM 2013 and DAC 2014), executives of Qualcomm voiced a call for monolithic 3D "to extend the semiconductor roadmap ...

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Podcasts/Videos/Webcasts

Solid State Watch: December 12-19, 2014

Book-to-bill above parity in November; imec demonstrates graphene EAM on IEDM 2014; Amkor licenses copper pillar wafer bump tech to GLOBALFOUNDRIES; Desktop monitor market experiences ...

Solid State Watch: December 5-11, 2014

Murata completes acquisition of Peregrine; North Carolina State University researches stacking semiconductor materials; SIA announces new president and CEO; Entegris announces availability ...

Solid State Watch: November 25-December 4, 2014

Cypress and Spansion announce merger; SEMATECH announces promising EUV research; Global semiconductor sales reach $29.7B in October; Soitec and CEA-Leti establish new solar cell efficiency ...

Solid State Watch: November 14-20, 2014

Revenue from industrial semiconductors on the rise; Combo MEMS sensors market to reach $1.4B by 2019; Notebook PC market grows while tablets struggle; Book-to-bill below parity for ...

Solid State Watch: November 7-14, 2014

A new product scope for an expanded Information Technology Agreement announced; Silicon wafer shipments increased in third quarter; New CEO of SEMATECH; SIA board of directors announces ...

Solid State Watch: October 31-November 6, 2014

The growing sensors market; Texas Instruments to expand operations in China; GlobalFoundries partners in INVECAS; Worldwide sales of semiconductors hits record-breaking high ...

Solid State Watch: October 23-30, 2014

GLOBALFOUNDRIES to take over IBM's commercial semi business; MegaChips acquires SiTime; imec and Coventor collaborate; Mergers and acquisitions shake up automotive semiconductor landscape ...

Solid State Watch: SEMICON Europa Special Edition

Pete Singer interviews new CEA-Leti CEO in Grenoble, France.

Solid State Watch: Sept. 25-Oct. 3, 2014

TSMC's new low-power tech platform and ARM-based networking processor with finFET technology; New 3D IC being researched; Dow Corning offering new 150mm SiC wafers

Solid State Watch: September 12-18, 2014

EUV available at 10nm; Mentor Graphics appoints new VP of Embedded Systems; ProPlus expands operations in Europe; Rudolph releases new SONUS technology