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Emerging Memory Types Headed for Volumes

After decades of R&D, two emerging memory types – the phase change memory-based 3D Xpoint, co-developed by Intel and Micron, and the embedded spin-torque transfer magnetic RAM ...

Applied Materials Fields Cobalt Solution for MOL

Applied Materials has introduced a set of processes that enable cobalt to be used instead of tungsten and copper for contacts and middle-of-line interconnects.

Waddle-room for Black Swans: EUV Stochastics

Industry still has DUV ducks in a row

Companies Ready Cobalt for MOL, Gate Fill

As cobalt begins to replace tungsten at the smaller-dimension interconnect layers, Applied Materials is readying process flows and E-beam inspection solutions.

Logic Densities Advance at IEDM 2017

At the International Electron Devices Meeting, logic platform presentations from GlobalFoundries and Intel featured Moore's Law density scaling.

Deep Learning Joins Process Control Arsenal

Where does the machine win, and where does the brain still win?” Howard Witham, APC keynote speaker.



News Stories

Emerging Memory Types Headed for Volumes

After decades of R&D, two emerging memory types – the phase change memory-based 3D Xpoint, co-developed by Intel and Micron, and the embedded spin-torque transfer magnetic RAM ...

Applied Materials Fields Cobalt Solution for MOL

Applied Materials has introduced a set of processes that enable cobalt to be used instead of tungsten and copper for contacts and middle-of-line interconnects.

Companies Ready Cobalt for MOL, Gate Fill

As cobalt begins to replace tungsten at the smaller-dimension interconnect layers, Applied Materials is readying process flows and E-beam inspection solutions.

Technology Features

Feature Articles

Emerging Memory Types Headed for Volumes

After decades of R&D, two emerging memory types – the phase change memory-based 3D Xpoint, co-developed by Intel and Micron, and the embedded spin-torque transfer magnetic RAM ...

Waddle-room for Black Swans: EUV Stochastics

Industry still has DUV ducks in a row

Deep Learning Joins Process Control Arsenal

Where does the machine win, and where does the brain still win?” Howard Witham, APC keynote speaker.

XPoint NVM Array Process Engineering

PCM materials, not PCM devices

Embedded FPGAs Offer SoC Flexibility

With mask costs rising and the need for flexibility growing, companies are beginning to adopt embedded field programmable gate arrays in their SoC designs.

EUVL Materials Readiness for HVM

Ecosystem stretches for 2018 pilot production.

Mechanistic Modeling of Silicon ALE for FinFETs

U of M and Lam Research show how avoid yield losses.

Lithographic Stochastic Limits on Resolution

Difficult to cheat physics and make a profit.

Deep Learning Could Boost Yields, Increase Revenues

Deep learning is “a shiny new hammer” that chip industry may figure out how to use.

Edge Placement Error Control in Multi-Patterning

SPIE-AL presentations show materials dominate patterning.

Podcasts/Videos/Webcasts

Solid State Watch: August 19-25, 2016

TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report ...

Edwards Vacuum on Safety Protocols in the Fab Environment

Pete Singer and Geoffrey Stoddart, Global Services Marketing Director, Edwards Vacuum, met up at SEMICON West 2016 to discuss ROI associated with safety investments in a fab setting, ...

Solid State Watch: June 3-9, 2016

Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction ...

Solid State Watch: May 27-June 2, 2016

GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive ...

Solid State Watch: May 20-26, 2016

SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find ...

Solid State Watch: May 13-19, 2016

IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during ...

Solid State Watch: May 5-12, 2016

Worldwide semiconductor capital spending projected to decline 2 percent in 2016; Worldwide sales of semiconductors reached twenty six point one billion for the month of March 2016; ...

Behind the Scenes: Presto Engineering

Tim Lillie, General Manager, North America, provides a look at Presto Engineering's operations in this corporate video.

Solid State Watch: December 4-10, 2015

Semiconductor fab equipment spending growth in 2015; NXP and Freescale complete merger; Atomically-flat tunnel transistor overcomes fundamental power challenge of electronics; Imec ...

Solid State Watch: November 27 – December 3, 2015

Researchers discover new phase of carbon; IDMs on track to outpace fabless semiconductor supplier growth; Advanced packaging to reach 44% of packaging services by 2020; European Commission ...


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