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High-NA EUV Lithography Investment

ASML funds Zeiss for anamorphic >0.5 NA.

Process Control Deals with Big Data, Busy Engineers

“Engineers are busy, and so you only tell them something they need to know.” Intel’s Steve Chadwick

2D Materials May Be Brittle

Molybdenum-diselenide brittle, borophene not

Air-Gaps for FinFETs Shown at IEDM

Researchers from IBM and Globalfoundries will report on the first use of “air-gaps” as part of the dielectric insulation around active gates of "10nm-node" finFETs at the upcoming ...

Multibeam Patents Direct Deposition & Direct Etch

E-beams directed by design to form and repair device structures.

Has SOI’s Turn Come Around Again?

Analysts see another chance for Silicon-on-Insulator technology, as proponents claim technical and cost advantages for fully-depleted SOI.



News Stories

High-NA EUV Lithography Investment

ASML funds Zeiss for anamorphic >0.5 NA.

Process Control Deals with Big Data, Busy Engineers

“Engineers are busy, and so you only tell them something they need to know.” Intel’s Steve Chadwick

Mentor Graphics Signs Agreement with ARM to Accelerate Early Hardware/Software Development

Mentor Graphics Corporation (NASDAQ: MENT) has signed a multiyear license agreement with ARM to gain early access to a broad range of ARM Fast Models, Cycle Models and related technologies. ...

Technology Features

Feature Articles

2D Materials May Be Brittle

Molybdenum-diselenide brittle, borophene not

Multibeam Patents Direct Deposition & Direct Etch

E-beams directed by design to form and repair device structures.

Air-Gaps for FinFETs Shown at IEDM

Researchers from IBM and Globalfoundries will report on the first use of “air-gaps” as part of the dielectric insulation around active gates of "10nm-node" finFETs at the upcoming ...

Elusive Analog Fault Simulation Finally Grasped

The test time per logic gate in ICs has greatly decreased in the last 20 years, thanks to scan-based design-for-test (DFT), automatic test pattern generation (ATPG) tools, and scan ...

3D-NAND Deposition and Etch Integration

Lam talks about process control and default roadmaps.

Silicon as Disruptive Platform for IoT Applications

Q&A with Marie Semeria, CEO of CEA-Leti

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located ...

Fab Facilities Data and Defectivity

In-the-know attendees at SEMICON West at a Thursday morning working breakfast heard from executives representing the world’s leading memory fabs discuss manufacturing challenges at ...

CMOS-Photonics Technology Challenges

imec and Mentor detail painstaking progress.

79 GHz CMOS RADAR Chips for Cars from Imec and Infineon

Compact, low power, low cost solution to advance vehicle safety and automation.

Podcasts/Videos/Webcasts

Solid State Watch: August 19-25, 2016

TowerJazz and SMIC’s sales forecast to surge in 2016; Intel to produce 10nm ARM chip designs; GlobalWafers to acquire SunEdison Semiconductor; SEMI posts July 2016 book-to-bill report ...

Edwards Vacuum on Safety Protocols in the Fab Environment

Pete Singer and Geoffrey Stoddart, Global Services Marketing Director, Edwards Vacuum, met up at SEMICON West 2016 to discuss ROI associated with safety investments in a fab setting, ...

Solid State Watch: June 3-9, 2016

Semiconductor Industry Association announced worldwide sales of semiconductors reached $25.8 billion; SEMI announced that 19 new fabs and lines are forecasted to begin construction ...

Solid State Watch: May 27-June 2, 2016

GLOBALFOUNDRIES announced a joint venture with the government of Chongqing; Texas Instruments maintains leadership in analog IC marketshare; Micron releases two new solid state drive ...

Solid State Watch: May 20-26, 2016

SEMI releases new book-to-bill ratio report; Infineon and imec share details of their CMOS-based 79 GHz sensor chip; Synopsys introduces pre-wafer simulation solution; Researchers find ...

Solid State Watch: May 13-19, 2016

IBM scientists achieve storage memory breakthrough; Kateeva closes its Series E funding round with $88 million in new financing; Worldwide silicon wafer area shipments increased during ...

Solid State Watch: May 5-12, 2016

Worldwide semiconductor capital spending projected to decline 2 percent in 2016; Worldwide sales of semiconductors reached twenty six point one billion for the month of March 2016; ...

Behind the Scenes: Presto Engineering

Tim Lillie, General Manager, North America, provides a look at Presto Engineering's operations in this corporate video.

Solid State Watch: December 4-10, 2015

Semiconductor fab equipment spending growth in 2015; NXP and Freescale complete merger; Atomically-flat tunnel transistor overcomes fundamental power challenge of electronics; Imec ...

Solid State Watch: November 27 – December 3, 2015

Researchers discover new phase of carbon; IDMs on track to outpace fabless semiconductor supplier growth; Advanced packaging to reach 44% of packaging services by 2020; European Commission ...