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Blog review April 14, 2014

New blogs provide a preview of The ConFab’s keynote talk by Qualcomm’s Roawen Chen, a review by CEA-Leti researchers on 3D integration with SOI, an analysis of the IMAPS Device ...

The Week in Review: April 11, 2014

SIA reports sales of semiconductors in February 2014 increased 11.4 percent from February 2013; GSA celebrates 20 years; SEMI expanding Innovation Village at SEMICON Europa

Blog review April 7, 2014

New blogs reveal the lineup of speakers for The ConFab’s Session 1, which will provide an excellent overview of the semiconductor industry’s major drivers and challenges; thought ...

Top Stories

GLOBALFOUNDRIES and Samsung join forces on 14nm finFETs

GLOBALFOUNDRIES and Samsung are announcing a joint program for 14nm FinFETs that offers a single process design kit (PDK) and manufacturing at four different fabs with identical processes. ...

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Big sell: IP Trends and Strategies

Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.

3D NAND: To 10nm and beyond

The transition to 3D NAND is inevitable, but there is still plenty to be squeezed from 2D NAND technology. An Applied Materials-sponsored panel at IEDM discussed where the industry ...

Technology Features

Feature Articles

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Safety critical devices drive fast adoption of advanced DFT

Devices used in safety critical applications such as automobiles need be known to work and have the ability to be regularly verified. Therefore, a very high-quality test is important ...

FinFET on SOI: Potential Becomes Reality

We report here empirical results demonstrating the electrical benefits of SOI-based FinFETs. There are benefits inherent in the elimination of dopant as the means to establish the effective ...

Eliminating the Challenges of Giga-Scale Circuit Design With Nano-Scale Technologies

Dr. Lianfeng Yang of ProPlus Design Solutions, Inc. says that the only way out of today's challenges is to more tightly integrate tools for nano-scale modeling, giga-scale SPICE simulation ...

Design for Yield Trends

Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

Monte Carlo Analysis Has Become A Gamble

Years ago, someone overhead a group of us talking about Monte Carlo analysis and thought we were referring to the gambling center of Monaco and not computational algorithms that have ...

Model-Based Hints: GPS for LFD Success

For several technology nodes now, designers have been required to run lithography-friendly design (LFD) checks prior to tape out and acceptance by the foundry.

Reducing Mask Write-Time—Which Strategy Is Best?

An upcoming challenge of advanced-node design is the expected mask write time increase associated with the continued use of 193nm wavelength lithography.

SPICEing up Circuit Design

Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about the challenges of designing for yield using SPICE models.

Round Tables

Roll over flat panel displays

Flexible displays is a technological field that has been in R&D and pre-commercial development for several years, but what needs to happen to make volume production a reality, in ...

Big sell: IP Trends and Strategies

Experts from Semico Research, Cadence, Uniquify and Sonics challenge growth trends for semiconductor intellectual property (SIP) with FinFETs, the IoT and more.

Experts At The Table: Commercial potential and production challenges for 3D NAND memory technology

In this roundtable discussion focused on 3D NAND , we hear from Samsung Electronics (SE) in South Korea, Bradley Howard, Vice President of Advanced Technology Group, Etch Business Unit, ...

Experts At The Table: Exploring the relationship between board-level design and 3D, and stacked, dies

SemiMD discussed what board level design can tell us about chip-level (three-dimensional) 3D and stacked dies with Sesh Ramaswami, Applied Materials’ Managing Director, TSV and Advanced ...

Experts At The Table: Design For Yield (DFY) moves closer to the foundry/manufacturing side

SemiMD discussed the trend for design for yield (DFY) moving closer to the foundry/manufacturing side with Dr Bruce McGaughy, Chief Technology Officer and Senior Vice President of Engineering, ...

Experts Roundtable: More than Moore – manufacturing challenges for MEMS

Semiconductor Design & Manufacturing discussed ‘More than Moore‘ (MtM) standardization topics and challenges with Peter Himes, VP of marketing and strategic alliances ...

Podcasts/Videos/Webcasts

Solid State Watch: April 11-17, 2014

GlobalFoundries and Samsung join forces on 14nm finFETs; Dow Corning files complaint against Beijing KMT Technology; Semiconductor photomask market growth; Deca Technologies ships 100-millionth ...

Solid State Watch: April 4-10, 2014

February semi sales increase; Scalable CVD process for making 2-D molybdenum diselenide; MEMS microphone growth; SEMI releases report on semiconductor packaging materials

Solid State Watch: March 29-April 3, 2014

Researchers improve performance of III-V nanowire solar cells on graphene; ON Semiconductor acquires Truesense Imaging; Polymer cools hot electronic devices at 200 degrees C; SEMATECH ...

Solid State Watch: March 21-28, 2014

Intel and Altera extend partnership; eInfochips to offer design services at 16nm; North Carolina State University LED research; Samsung releases new flip chip LED package

Solid State Watch: March 14-20, 2014

Toshiba and SanDisk sue SK Hynix; Berkeley research on on-chip inductors; EV Group opens HQ in China; SEMI awards SMIC CEO with Outstanding EHS Achievement Award

Solid State Watch: March 7-13, 2014

New method for wafer level packaging; Thinnest-possible LEDs; imec achieves record conversion in fullerene-free organic solar cell; Chinese LED market update

Solid State Watch: February 28-March 6, 2014

SIA awards University Research Award; Fab equipment spending increase in 2014; Semi industry posts highest-ever January sales; 19th century physics could change future of nanotech, ...

Solid State Watch: February 21-28, 2014

MIT research; Soraa’s most efficient LEDs; EU launches PLACYD; GlobalFoundries and Fraunhofer extend collaboration

Solid State Watch: February 14-20, 2014

Successful financing for Inpria Corp.; Record speed in silicon-germanium chip; MACOM acquires Nitronex; imec presents 79 GHz radar transmitter on 28nm CMOS

Solid State Watch: February 7-13, 2014

IBM looking for buyers for semiconductor business; Worldwide silicon revenues declined in 2013; SPTS opens Korean office; Leti launches PIEZOMAT