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Top Stories — July 23, 2015
Technologies for Advanced Systems Shown at IMEC Tech Forum USA
R&D summarized of the nanoscale building blocks for our fab future.
Applied Materials' Olympia ALD Spins Powerful New Capabilities
Applied Materials unveiled the Applied Olympia ALD system, using thermal sequential-ALD technology for the high-volume manufacturing (HVM) of leading-edge 3D memory and logic chips.
Low-Cost Manufacturing of Flexible Functionalities
FlexTech Alliance updates on substrates, processes, and devices.
3DIC Technology Drivers and Roadmaps
Circuit performance and silicon area improvements seen in new die stacks.
Optimal+ Turns 10, Wins Accolades For Its Work
Optimal+ has been in business since 2005. The Israel-based company, which has offices around the world, has something else to celebrate this year: Frost & Sullivan gave Optimal+ its 2015 Global Semiconductor Test Visionary Innovation Leadership Award.
Breaking Down Power Management Verification
During system-level verification, it is imperative to verify that the software power control applications properly initialize power states and power domains.
Got MEMS? Get In Touch With memsstar For Production Equipment
As you might guess from the company's name, memsstar is involved in microelectromechanical system (MEMS) devices. The company offers manufacturing equipment for "MEMS-specific production," says CEO Tony McKie.
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News & Features
Solid State Technology's Latest Issue
The July issue of SST features articles on SOI substrates for extending Moore and more than Moore; controlling measurements in WLP in high mix, high volume manufacturing; a summary of the OASIS mask standard, how ECAE improves sputtering target performance, and a report on how the emerging market for connected smart devices will bring more changes to the semiconductor sector.
Dr. Gary Patton joins The ConFab Advisory Board
Solid State Technology announced that Dr. Gary Patton has joined the Advisory Board for its annual conference and networking event, The ConFab. Dr. Patton is the CTO and Head of Worldwide Research and Development at GLOBALFOUNDRIES. As an advisory board member Dr. Patton will assist with defining the conference theme and inviting industry leaders to attend the event and take meetings with suppliers.
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Blogs/Twitter
Pete's Posts Blog
IoT, Healthcare and 5G to Drive RF and Microwave
Industry trends to the Internet of Things, advanced healthcare and 5G are good news for everyone involved in ...
IC Design
Custom Layout Designers Need New Tools for New and Expanding Markets
For a long time, digital was the darling of the semiconductor industry.
Applied Innovation
50 Years of Moore's Law
For 50 years, Moore's Law has served as a guide for technologists everywhere in the world, setting the ...
Materials Matters
The Increasing Demand for UHP Nitrogen and the SPECTRA Generator
The increasing need for high-purity nitrogen in making semiconductor devices has driven the capacity of SPECTRA nitrogen generators. ...
Ed's Threads
Single-electron Molecular Switch 4nm Across
A molecule rotating on the surface of a crystal can function as a tunnel-gate of a transistor, as ...
Insights From Leading Edge
IFTLE 247 ECTC part 3: More Thermo Compression Bonding from Intel and ASM
Is there any question that TCB is real and will be the next big bonding technology ? This ...
Viewpoints: SEMI
SEMI Recognizes Leaders, Pushes Issues at Washington Forum
As Congress continued a busy spring session, SEMI hosted its annual Washington Forum event on April 28 & ...
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Videos/Podcasts
Solid State Watch: June 19-25, 2015
IHS says Moore's Law led to trillions added in global economy; Cadence and Applied Materials collaborate on CMP process optimization; Power transistors seen stabilizing and setting record sales in 2015; Nanowires could be the LEDs of the future
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White Papers
RF-SOI Wafers for Wireless Applications
The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
DFM: What is it and what will it do?
Everybody's talking about it, but just what is DFM? According to various EDA company websites, design for manufacturing can be: generation of yield optimized cells; layout compaction; wafer mapping optimization; planarity fill; or, statistical timing among other definitions. Obviously, there is very little consensus. For me, DFM is what makes my job hard: Characterizing it, and developing tools for it, is the most important item on my agenda.
Via Doubling to Improve Yield
In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.
The Impact Of 14-nm Photomask Uncertainties on Computational Lithography Solutions
Certain measurement methodologies can be inaccurate even if they're precise, and there are known errors associated with certain system parameters.
A Study Of Model-Based Etch Bias Retarget For OPC
The etch loading effect is the dominant factor that impacts final CD control at advanced nodes with shrinking critical dimension.
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