|
 |
DRAM Industry in Flux as Elpida Files for Bankruptcy |
|
|
 |
|
The DRAM industry remains in flux, as struggling Elpida Memory Inc., Japan's sole DRAM maker, filed the equivalent of bankruptcy in that nation. The filing could accelerate Micron Technology Inc.'s reported move to acquire Elpida – an event that could shake up the DRAM landscape. |
|
|
|
|
Directed-Self Assembly Gains Steam in Lithography |
|
|
 |
|
With little or no fanfare, directed self-assembly (DSA) in 2007 landed on the ITRS roadmap as a potential solution for lithography at the 10nm node. Characterizing the buzz about DSA at last week's SPIE event, Christopher Bencher, a member of the technical staff at Applied Materials Inc., said: "It's like an explosion. DSA is like being at Woodstock." |
|
|
|
|
Chip Makers Raise the Bar for Maskless Lithography |
|
|
 |
|
Next-generation maskless lithography is a great concept. But over the years, the progress for multi-beam has been slow and the technology is still not in production despite years of R&D. Now, even though the multi-beam e-beam vendors are behind the curve, the new champions of the technology — DNP, Intel, Photronics and TSMC — have raised the bar on suppliers. The question is clear: Can vendors finally deliver? |
|
|
|
|
ML2 Lithography: One Tool to Write Them All |
|
|
 |
|
TSMC senior director of micropatterning Burn Lin detailed his vision for how direct-write lithography could be used when the 450mm wafer transition occurs. And several KLA speakers detailed the unique architecture of the ReBL e-beam system now being developed. A speaker from D2S explained how both shot count and edge placement errors are reduced when circles replace rectangles stitched together. |
|
|
|
|
Analyst: EUV Misses 14nm Node and Now Aims for 10nm |
|
|
 |
|
Extreme ultraviolet (EUV) lithography has missed the 20nm — and the 14nm — process nodes, according to an analyst, who added that the tool technology is down but not out of the running. Now, the industry is shooting for the insertion of EUV at the 10nm node, according to the analyst. ASML and Cymer claim they have made major progress, however. |
|
|
|
|
Double Trouble |
|
|
 |
|
Competing double-patterning approaches are causing challenges for DFM tools vendors at 20nm and 14nm; the problems get worse at 10nm. Luigi Capodieci, R&D fellow at GlobalFoundries, said ideas to use triple patterning may never actually be implemented. "Triple patterning makes for good paper, but I'm not sure the solution is cost-effective." |
|
|
|
|
SPIE Panel: Time is Ripe for Alternative NGLs |
|
|
 |
|
The IC industry needs to think differently about lithography, according to a panel at the SPIE Advanced Lithography conference. Lithography experts said that the market is ripe for an alternative NGL solution. The panelists represented the various alternative NGL technologies, such as direct self-assembly (DSA), maskless and nanoimprint. |
|
|
|
|
Foundry Rivals Say EUV Not Ready for Prime Time |
|
|
 |
|
Two foundry vendors — GlobalFoundries and TMSC — are clearly rivals and have different strategies in the market. But lithography experts from both foundry vendors agree on one thing: The progress for extreme ultraviolet (EUV) lithography is going slower than expected and the technology is not ready for prime time right now. |
|
|
|
|
Intel Wants EUV but Keeps Lithography Options Open |
|
|
 |
|
Intel Corp. reiterated its plans to insert extreme ultraviolet (EUV) lithography as its first choice for the 10nm node, but the company is keeping its options open. The chip giant is devising a back-up plan. If EUV remains late to the party, Intel said it could shift gears and move to multi-patterning. |
|
|
|
|
Sokudo Claiming Progress Competing Against TEL |
|
|
 |
|
Sokudo, the track vendor nearly given up for dead a few years ago, now claims it is gaining market share against Tokyo Electron Ltd. CEO Tadahiro Suhara said his company "has succeeded in challenging the competition." TEL issued a press release saying it will introduce the Lithius Pro Z track by the fall of 2012, with higher throughput and improved defect control. |
|
|
|
|
Wanted: 3D Chip Testing Solutions and Standards |
|
|
 |
|
Perhaps the most overlooked challenge in the 2.5D/3D chip era is clear: test. The industry is finally coming to grips with the challenges of testing so-called known good die (KGD). Another related issue that is now rearing its ugly head is the ability to test the TSVs - and microbumps - in designs. |
|
|
|
|
Next-generation Memory Vendors Seek New Markets |
|
|
 |
|
Elpida, Hynix, Micron, Toshiba, Samsung and a number of startups are scrambling to develop various next-generation memory types. Ishai Naveh, vice president of marketing and business development for startup Adesto, said the market is ripe for a new memory type. "We believe the market is changing," he said. |
|
|
|
|
Applied Forsees Strong Year for Silicon Systems |
|
|
Foundries are driving Applied's semiconductor equipment operation to new heights. "Die sizes are up about 50 percent year-on-year for the application processors used in smartphones, which means that the foundries have got to move to leading-edge processes very, very quickly," said CEO Mike Splinter. |
|
|
|
More News & Features
|
|
