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Blog review December 9, 2013

New blogs examine the future of NAND flash memory, a preview of the International Electron Devices Meeting (IEDM) – is it time to think about the end of silcon? – Skyworks’ use of SOI, the Sony ISX014 8MP sensor, MEMS and the Internet of Things, and The ConFab, which will be held June 22-25, 2014 in Las Vegas.

Blog review March 31, 2014

New blogs discuss metrology in the age of 3D memory, the many benefits of FDSOI, this year’s IMAPS Device Packaging Conference, the recent MEMS Industry Group meeting in Europe, and the upcoming R&D panel session at The ConFab in June.

IP interoperability in SoCs: Mix and match doesn’t always work

More often than not, a design re-spin isn’t just a simple re-spin with a tweak here and a tweak there. The new design will probably have to comply with modified specifications that inevitably raise the bar for performance and power usage, and it will probably contain new IP that must be integrated.

3D EDA brings together proven 2D solutions

Design methodologies and technologies for 2D multi-chip systems are extended into 3D using proprietary tools based on industry standards.

Blog review March 10, 2014

New blogs take a look The ConFab, where Dr. Gary Patton of IBM will provide a keynote talk, Applied Materials’ success working with Lawrence Berkeley Lab, ST’s view of FDSOI, the recent RTI- Architectures for Semiconductor & Packaging conference, the EUVL Conference during SPIE’s advanced litho program, and the newly-reported numbers for January: the best ever!

Blog review March 3, 2014

New blogs take a look at design challenges associated with re-filling an engineering change orders (ECOs), this year’s ISS meeting, and the pervasiveness of cheap silicon.

Blog review February 24, 2014

New blogs take a look at recent reports from G450C showing good results for major process steps and inspection (although cost benefits remain to be proven), new FD-SOI results demonstrating a 10X faster DSP, the need for high sigma yield brought on by the move to 28/20nm and 16nm, Obama’s policy impact on the semiconductor industry, the recent IEEE 3D IC and GaTech Interposer meetings, and the latest nanotechnology-use survey from NCMS.

Blog review January 6, 2014

New blogs examine cooling 3D IC stacks and the role of DARPA’s ICECool program, what was going in 50 years ago in January of 1964 as viewed through the pages of Solid State Technology, and design for test requirements of safety critical applications such as those of automobiles.

Blog Review: October 28 2013

New blogs cover SoC design with system level functionality, 3D system integration, fixing litho hotspots, packaging design with the database diary, and why mobility is the new industry driver.

Blog Review October 21 2013

EUV on time for 10nm, mask defectivity an issue, pellicles an option, source power timing; DSA very promising; Intel delays 14nm production; FinFETS tech of choice; Intel stands firm on 450mm; Market reports from Semicon Taiwan.