Market forces have forced some foundries to the cutting edge—and left huge opportunities for others.

First of three parts: What’s missing, what’s running out of steam, and best guesses for how to tackle issues at future process nodes.

Biggest gap is in EDA because tools are not optimized for DSA, but work is under way to make DSA commercially viable.

Delays in EUV and progress in DSA have pushed to the front of the line as a viable patterning alternative.

DSA is gaining far more attention as delays continue to plague EUV and the threat of multipatterning increases.

What’s happening at the extreme end of the data overload world and why that’s so important for big data management.

Rising costs, a fixed number of customers and limited options are forcing changes in how big equipment companies go to market—and with whom.

New areas of reliability checking are being developed to include transistor-level power intent analysis.

A candid one-on-one interview about the future of lithography with Molecular Imprints’ CEO.

Semiconductor manufacturers are still betting big on EUV, but it’s no longer their only bet.