Part of the  

Solid State Technology

  and   

The Confab

  Network

About  |  Contact

Round Tables Archive

Vital Control in Fab Materials Supply-Chains – Part 2

Expert panel discussion at Critical Materials Council (CMC) Conference

Vital Control in Fab Materials Supply-Chains

Expert panel discussion at Critical Materials Council (CMC) conference.

Silicon as Disruptive Platform for IoT Applications

Q&A with Marie Semeria, CEO of CEA-Leti

Hardware/Software Co-Development for IoT Applications: Q&A with Marie Semeria, CEO of CEA-Leti

Marie Semeria, chief executive officer of CEA-Leti (http://www.leti.fr/en), sat down with SemiMD during SEMICON West to discuss how the French R&D and pilot manufacturing campus—located at the foot of the beautiful French alps near Grenoble—is expanding the scope of it’s activities to develop systems solutions for the Internet-of-Things (IoT).

Roll-to-Roll Coating Technology: It’s a Different Ball of Wax

Manufacturing flexible electronics and coatings for a variety of products has some similarities to semiconductor manufacturing and some substantial differences, principally roll-to-roll fabrication, as opposed to making chips on silicon wafers and other rigid substrates. This interview is with Neil Morrison, senior manager, Roll-to-Roll Coating Products Division, Applied Materials.

IoT Demands Part 2: Test and Packaging

To understand the state of technology preparedness to meet the anticipated needs of the different application spaces, experts from GLOBALFOUNDRIES, Cadence, Mentor Graphics and Presto Engineering gave detailed answers to questions about IoT chip needs in EDA and fab nodes.

Controlling Variabilities When Integrating IC Fab Materials

The Critical Materials Conference 2016—to be held May 5-6 in Hillsboro, Oregon (cmcfabs.org)—will explore best practices in the integration of novel materials into manufacturing

IoT Demands Part 1: EDA and Fab Nodes

To meet the anticipated needs of the different IoT application spaces, SemiMD asked leading companies within critical industry segments about the state of technology preparedness.

3D Chips, New Packaging Challenge Metrology and Inspection Gear

Metrology and inspection technology is growing more complicated as device dimensions continue to shrink. Discussing crucial trends in the field are Lior Engel, vice president of the Imaging and Process Control Group at Applied Materials, and Rudolph Technologies.

Changes and Challenges Abound in Multi-patterning Lithography

Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology. Providing responses are David Abercrombie, Design for Manufacturing Program Manager, Mentor Graphics; Gary Zhang, Vice President Marketing, ASML Brion; and Dr. Donis Flagello of Nikon Research Corporation of America.