New research could enhance LEDs and displays; Intel to collaborate with Georgia Tech; imec extends its GaN R&D program; Strong silicon wafer area shipment growth reported in second quarter of 2015
Podcasts Videos Webcasts Archive
Worldwide sales of semiconductors reach $84B in second quarter of 2015; Toshiba announces world’s first 16-die stacked NAND flash memory with TSV tech; Intel and Micron unveil 3D XPoint memory technology; Samsung cuts into Intel’s sales lead
Storm of mergers and acquisitions in 2015; China’s automotive semiconductor market growth is slowing; University of Pennsylvania engineers and physicists research spintronic computers; Global flat panel display industry revenue is forecast to fall
ROHM Semiconductor acquires Powervation, SEMI posts book-to-bill report; Amkor Technology to expand operations in China; Analog Devices joins SRC’s research program Trustworthy and Secure Semiconductors and Systems.
Pete Singer chats with Kevin McLaughlin, Global Electronics Marketing Manager of SACHEM, at SEMICON West 2015.
Paul Alers, Head of Product Management at Busch, talks with Pete Singer at SEMICON West 2015 about going green and “premium efficiency.”
Pete Singer met up with Paul Rawlings, VP of Marketing, Semiconductor & Display, Solar, LED Business Unit at Edwards, to discuss environmental regulation of gases in semiconductor manufacturing.
Chinese chipmaker Tsinghua prepares $23B bid for Micron Technology; ClassOne wins Best of West; Mark Durcan, Micron CEO, recognized for outstanding EHS leadership; Leti and EVG launch INSPIRE
IBM produces industry’s first 7nm node test chips; GLOBALFOUNDRIES completes acquisition of IBM’s microelectronics business; Phablet shipments on track to overtake tablets; Semiconductor Industry Association releases global sales for May 2015
Pete Singer talks with Ravi Laxman and Ravi Gukathasan from Digital Specialty Chemicals about the company’s recent funding from Intel.
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The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
Everybody’s talking about it, but just what is DFM? According to various EDA company websites, design for manufacturing can be: generation of yield optimized cells; layout compaction; wafer mapping optimization; planarity fill; or, statistical timing among other definitions. Obviously, there is very little consensus. For me, DFM is what makes my job hard: Characterizing it, and developing tools for it, is the most important item on my agenda.
In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.
Certain measurement methodologies can be inaccurate even if they’re precise, and there are known errors associated with certain system parameters.
The etch loading effect is the dominant factor that impacts final CD control at advanced nodes with shrinking critical dimension.
A look at ways to simplify the optical and resist model calibration and to speed up the entire process.
Fabricating interconnects is one of the most process-intensive and cost-sensitive parts of manufacturing.
Testing interposer-based versions of stacked die and future versions using through-silicon vias.
EUV will introduce unwanted patterning distortions that must be accurately modeled and corrected.
How to tame data file sizes, address fractured data files creation and streamline data review techniques.