Top 10 2015 semiconductor sales leaders forecast to include NXP/Freescale; Applied Materials announces new photomask etch system; North American semiconductor equipment industry posts March 2015 book-to-bill ratio of 1.10; Global semiconductor market achieves strong, broad-based growth in 2014
Podcasts Videos Webcasts Archive
SEMI reports 2014 semiconductor photomask sales of $3.2B; Automotive touch panel revenues to hit $1.5B by 2018; Sensor shipments strengthen but falling prices cut sales growth; ClassOne enters ECD lab partnership with Shanghai Sinyang
SEMI reports 2014 global semiconductor materials sales of $44.3B; Cavendish Kinetics adopts STATS ChipPAC’s wafer level technology; MEMS shipments to reach 43.3B units by 2018; TSMC certifies Synopsys design tools for 16nm finFET plus production
NXP/Freescale merger to create an automotive semiconductor giant; Mentor Graphics releases new Xpedition Packaging Integrator flow; C3Nano and Kimoto Japan announce partnership; Brown University researchers develop new nanomaterials from silicon-based compound
Top 20 MEMS ranking revealed; Micron and Intel announce availability of their 3D NAND technology; GlobalFoundries and NXP Semiconductor develop a 40nm eNVM low-power process technology; SEMI releases book-to-bill report for February 2015
Small powerful systems give rise to medical semiconductor sales; Recovering economies driving growth in the industrial semiconductor market; NXP-Freescale merger to result in world’s eighth largest chipmaker; Light sensors market to grow 16 percent between 2013 and 2016
Cypress and Spansion complete merger; Strong fab equipment spending forecast for 2015; 11 IC product categories to exceed total IC market growth in 2015; Global mobile phone display module shipments signal stronger competition among manufacturers
NXP and Freescale announce merger; Semiconductor Industry Association announces highest January sales ever; UT Dallas research could lead to affordable night vision and thermal imaging; Breakthrough in OLED technology
Top R&D spenders announced; Applied Materials unveils 3D CD SEM metrology tool; Smartphone display panel manufacturers face pressure to reduce prices; Semiconductor unit shipments forecast to reach 1 trillion units by 2017
imec announces DSA process technology breakthrough; GlobalFoundries and imec announce partnership; January book-to-bill released; Samsung announces mass production of mobile application processor using 14nm finFET process technology
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The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
Everybody’s talking about it, but just what is DFM? According to various EDA company websites, design for manufacturing can be: generation of yield optimized cells; layout compaction; wafer mapping optimization; planarity fill; or, statistical timing among other definitions. Obviously, there is very little consensus. For me, DFM is what makes my job hard: Characterizing it, and developing tools for it, is the most important item on my agenda.
In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.
Certain measurement methodologies can be inaccurate even if they’re precise, and there are known errors associated with certain system parameters.
The etch loading effect is the dominant factor that impacts final CD control at advanced nodes with shrinking critical dimension.
A look at ways to simplify the optical and resist model calibration and to speed up the entire process.
Fabricating interconnects is one of the most process-intensive and cost-sensitive parts of manufacturing.
Testing interposer-based versions of stacked die and future versions using through-silicon vias.
EUV will introduce unwanted patterning distortions that must be accurately modeled and corrected.
How to tame data file sizes, address fractured data files creation and streamline data review techniques.