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Design Archive

EUVL Materials Readiness for HVM

Ecosystem stretches for 2018 pilot production.

Mechanistic Modeling of Silicon ALE for FinFETs

U of M and Lam Research show how avoid yield losses.

Deep Learning Could Boost Yields, Increase Revenues

Deep learning is “a shiny new hammer” that chip industry may figure out how to use.

Lithographic Stochastic Limits on Resolution

Difficult to cheat physics and make a profit.

Edge Placement Error Control in Multi-Patterning

SPIE-AL presentations show materials dominate patterning.

Picosun and Hitachi MECRALD Process

ALD fab films at lower temperatures.

SiPs Simplify Wireless IoT Design

System-in-package solutions, running a proven software stack, are easing wireless design for Internet of Things end node applications.

Photonics in Silicon R&D Toward Tb/s

COSMICC Project and AIM Program developments

2D Materials May Be Brittle

Molybdenum-diselenide brittle, borophene not

Multibeam Patents Direct Deposition & Direct Etch

E-beams directed by design to form and repair device structures.