SPIE Advanced Lithography 2013 – day 4
The last day of the conference gave the tool updates. So how is EUV progressing?
The last day of the conference gave the tool updates. So how is EUV progressing?
Day 3 of the Advanced Lithography Symposium saw even more papers on DSA.
Day 1: Awards, plenary talks, and devices made by EUV. A good start to a good week.
The premier conference in lithography is set to begin in San Jose. I’ll be posting every day.
What does this deal mean for EUV development? And what about 193-nm?
Intel, Samsung, and TSMC want to take over the semiconductor world. Will 450-mm wafers be the weapon that let’s them finally succeed?
As lithography costs go up, the benefits of a larger wafer size go down. Will the benefits of 450-mm wafers be worth the investment if they only result in a 10% cost reduction per chip?
OK, so I didn’t go to Semicon West. That doesn’t mean I don’t have opinions to share
Printing incredibly small features with standard single patterning lithography is just another day for hard drive makers.