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IFTLE 332 Wither Goest the Toshiba NAND Business?; Unity SC; IMAPS DPC part 4: JCET eWLB-SiP

Now, at first glance you may be saying, “Why is IFTLE concerned with the Toshiba’s memory business? This is an advanced packaging blog!” But I hope most of you have learned IFTLE lesson #1 which is whatever effects chips, directly affects chip packaging. So with that in mind, the recent report by Reuters that Apple is looking into joining the Foxconn bid is very interesting.

IFTLE 331 IMAPS DPC Part 3: K&S Describes InFO Process Flow

As one might expect, there were quite a number of fan-out packaging presentations at the recent IMAPS Device Packaging Conference and the next few IFTLE will examine some of those presentations.

IFTLE 330 2017 IMAPS DPC Part 2: “80% of Value-add Growth from Wafer Based Packaging”

Continuing our look at the 2017 IMAPS Device Packaging Conference (DPC) held annually in AZ.

IFTLE 329 3D Integration Leaders – Europe; Trolls; More on Intel EMIB

The European SEMI Award was established in 1989 to recognize individuals and teams who have made a significant contribution to the European semiconductor and related industries.

IFTLE 328 IMAPS DPC Part 1: New MIL Qualified Player in FOWLP

The annual IMAPS Device Packaging Workshop was held at its usual location outside Scottsdale AZ in early March.

IFTLE 327 SEMI 3D Summit Part 3: Increased Use of Sensors; HVM FOWLP Applications

Finishing our look at the 2017 SEMI 3D summit in Grenoble.

IFTLE 326 2017 SEMI Euro 3D Summit: Thermo-compression Bonding and Plasma Dicing

Continuing our IFTLE look at the 2017 SEMI Euro 3D Summit.

IFTLE 325 Omnivision takes Ziptronix License; Semi Europe 3D Summit Part 1

Before we take a look at the recent SEMI European 3D Summit, a little news on the licensing front.

IFTLE 324 Intel EMIB Implementation in the Stratix MX

At the recent IEEE ISSCC in SF, Intel discussed the implementation of their EMIB technology [Embedded Multi-die Interconnect Bridge] technology in the Altera Stratix 10 FPGA family designed to meet the needs of developing high end communications systems.

IFTLE 323 The New DARPA Program “CHIPS”; Amkor Acquires Nanium; GE Licenses SEMCO

The research wing of the Defense Department, otherwise known as DARPA, put out a broad agency announcement in Sept 2016 for a program called “Common Heterogeneous Integration and IP Reuse Strategies with the same acronym, CHIPS [BAA-16-62] with an anticipated funding level of ~ $70MM.

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