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IFTLE 327 SEMI 3D Summit Part 3: Increased Use of Sensors; HVM FOWLP Applications

Finishing our look at the 2017 SEMI 3D summit in Grenoble.

IFTLE 326 2017 SEMI Euro 3D Summit: Thermo-compression Bonding and Plasma Dicing

Continuing our IFTLE look at the 2017 SEMI Euro 3D Summit.

IFTLE 325 Omnivision takes Ziptronix License; Semi Europe 3D Summit Part 1

Before we take a look at the recent SEMI European 3D Summit, a little news on the licensing front.

IFTLE 324 Intel EMIB Implementation in the Stratix MX

At the recent IEEE ISSCC in SF, Intel discussed the implementation of their EMIB technology [Embedded Multi-die Interconnect Bridge] technology in the Altera Stratix 10 FPGA family designed to meet the needs of developing high end communications systems.

IFTLE 323 The New DARPA Program “CHIPS”; Amkor Acquires Nanium; GE Licenses SEMCO

The research wing of the Defense Department, otherwise known as DARPA, put out a broad agency announcement in Sept 2016 for a program called “Common Heterogeneous Integration and IP Reuse Strategies with the same acronym, CHIPS [BAA-16-62] with an anticipated funding level of ~ $70MM.

IFTLE 322 SEMI ISS 2017: A Period of Uncertainty?

SEMI’s annual Industry Strategy Symposium was held at its usual site, Half Moon Bay CA a few weeks ago.

IFTLE 321 IMAPS 3D ASIP Part 4: SPIL Fan-Out Options; BESI Thermo-compression Bonding Options

Continuing our look at the IMAPS 3D ASIP Conference from this past December.

IFTLE 320 3D ASIP: Amkor Multi Die Packaging; Brewer‘s New Temp Bonding Sys

Continuing our look at the IMAPS 3D ASIP Conference 2016.

IFTLE 319 Mike Ma to Amkor; 3D ASIP Part 2: Image Sensing – Sony, Tessera, SMIC

This week, I can announce that Dr. Mike Ma, with 23 years in the microelectronics industry, has moved from SPIL to Amkor as Taiwan Country Manager.

IFTLE 318 2016 IMAPS 3D ASIP: The Expanding World of Fan-Out Packaging

The 13th 3D ASIP conference was held this year under the umbrella of IMAPS.

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