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IFTLE 339 Will 450mm Equipment Keep Si the Fine Feature WLCSP Solution?

On the eve of the formal ECTC presentations, the conference held a panel session pitting wafer processing vs panel processing for the low cost production of “high density” fan out WLP.

IFTLE 338 Bar Cohen to Take Over IEEE EPS (CPMT); Ho and Tu Win IEEE Packaging Field Award

As we noted in IFTLE 336, the IEEE packaging society, which has been known as IEEE Components, Packaging and Manufacturing Technology society since 1993 is about to be renamed the IEEE Electronics Packaging Society (EPS).

IFTLE 337 Will Samsung displace Intel in 2017?; Foundry Samsung – A reality; I-Cube

IC insights has announced that if memory market prices continue to hold through 2Q17 Samsung could displace Intel, which has held the #1 semiconductor sales ranking since 1993.

IFTLE 336 ISHM to IMAPS; IEEE CPMT to IEEE EPS?

This week I’d like to give you the IFTLE historical perspective on the two major name changes of our key International Microelecronic Packaging & Interconnect Societies. One occurred 20 years ago and one that is occurring as we speak.

IFTLE 335 Catching Up on China and the Wait for the New Industry Driver

Catching up on some recent stories of great importance to our electronics industry… and thus packaging.

IFTLE 334 On High Performance Computing, Chiplets and Interposers

Most of us packaging focused technologists do not traditionally follow what’s being presented at the IEEE High Performance Computing Architectures Conference (HPCA)…but that’s why you follow IFTLE…i.e. to find such material.

IFTLE 333 Amkor & Global discuss FOWLP at IMAPS Device Pkging Conf

Finishing up our look at the IMAPS Device Packaging Conference with presentations by Amkor, Global Foundries and Huan Tien (FCT) on their FOWLP technologies.

IFTLE 332 Wither Goest the Toshiba NAND Business?; Unity SC; IMAPS DPC part 4: JCET eWLB-SiP

Now, at first glance you may be saying, “Why is IFTLE concerned with the Toshiba’s memory business? This is an advanced packaging blog!” But I hope most of you have learned IFTLE lesson #1 which is whatever effects chips, directly affects chip packaging. So with that in mind, the recent report by Reuters that Apple is looking into joining the Foxconn bid is very interesting.

IFTLE 331 IMAPS DPC Part 3: K&S Describes InFO Process Flow

As one might expect, there were quite a number of fan-out packaging presentations at the recent IMAPS Device Packaging Conference and the next few IFTLE will examine some of those presentations.

IFTLE 330 2017 IMAPS DPC Part 2: “80% of Value-add Growth from Wafer Based Packaging”

Continuing our look at the 2017 IMAPS Device Packaging Conference (DPC) held annually in AZ.

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