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IFTLE 374 IMAPS Device Pkging Conf part 1: 3DIncites Award Winners

The 14th Int Conf on Device Pkging was held at its normal site, Ft. McDowell, AZ, last week. I normally show a picture of the general chair of the meeting and I will this time also (below), but I thought it was about time we gave due credit to the IMAPS staff that makes the meeting possible.

IFTLE 373 Semi ISS Part 2: ASE’s Hunt describes “Transformative Fan-Out” Packaging

Finishing up our look at the 2018 SMI ISS meeting, let’s take a look what John Hunt, ASE, had to say about the “Transformative Power of Fan-Out.”

IFTLE 371 Semi ISS: Market Opportunities and Drivers

Let’s take a look at some of the presentations given at the Semi ISS (Industry Strategy Symp) conference in January at Half Moon Bay.

IFTLE 371 RIP 3D-ASIP: 2004 – 2017

The 14th 3D ASIP Conference (3-D Architectures for Semiconductor Integration and Packaging) has officially ended.

IFTLE 370 3D-ASIP Part 3: Bonding and Assembly in HBM Memory Stacks

Continuing our look at the 14th annual 3DASIP Conference.

IFTLE 369 Samsung HBM2; Ultra Fine Pitch Interconnect; Thin Die Pick and Place

First introduced in June 2016, the Samsung HBM2 consists of eight 8Gb HBM2 dies and a buffer die at the bottom of the stack, vertically interconnected by TSVs and µbumps.

IFTLE 368 IMAPS addresses the Chip-Package Interaction (CPI)

This week, I am interrupting our look at the 2017 3D-ASIP conference to take a look at consolidation in the equipment industry and the recent issue of IMAPS Advancing Microelectronics magazine.

IFTLE 367 CIS Consolidation; DARPA CHIPS Headlines 14th 3D-ASIP Conf.

Remembering our IFTLE rule that maturing markets have 3 players with > 85% of market share, we note that Gartner Assoc. has reported that the top 5 vendors accounted for 88.9% of global CIS revenue in 2016 and the top 3 companies have 78.9% of the market, up from 77.1% in 2015 so we are getting close.

IFTLE 366 IWLPC Part 3; LED WLP & IMEC & Experi Hybrid Wafer Bonding

Tanja Braun of IZM Fraunhoffer discussed “Fan-out and Panel level technology for Advanced LED Packaging.”

IFTLE 365 Altera FPGA with HMB2 and EMIB; IWLPC 2017 Part 2

Before we continue our coverage of the 2017 IWLPC, I need to make sure everyone has seen the announcement from Intel (Altera) on the availability of the Intel Stratix 10 MX FPGA, their FPGA (field programmable gate array) with integrated HBM2 (High Bandwidth Memory).

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