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IFTLE 383 Global Foundries “Adv Packaging Trends in the Foundry Space”

At the recent IMAPS Device Packaging Conference outside Phoenix Hamid Eslampour, CMOS BU Product Management, of GlobalFoundries (GF) discussed Advanced Packaging in the Foundry Space.

IFTLE 382 Semiconductor Activity in China – Betting on AI

China is by far the largest consumer of semiconductors reportedly accounting for 45 percent of the worldwide demand for chips, used both in China and for exports. More than 90 percent of its consumption relies on imported ICs.

IFTLE 381 TSMC WOW

At the TSMC Technology Symposium in Santa Clara, the company discussed their new Wafer-on-Wafer (WOW) silicon wafer stacking technology for the 7 and 5nm nodes.

IFLE 380 IMAPS Device Packaging Conf Part 3: Yole Updates FO-WLP

This week, let’s take a look at the latest Yole update on Fan out Packaging by Jerome Azemar that was presented at the IMAPS 2018 Device Packaging Conference.

IFTLE 379 IMAPS DPC 2018: Chip to Wafer Hybrid Bonding

IFTLE has extensively discussed the applicability of the Ziptonix technologies (acquired and now owned by Xperi): ZiBond (oxide-oxide bonding) and DBI (copper-oxide to copper-oxide “hybrid bonding”)

IFTLE 378 IBM/DARPA ICECool Program Summary; Apple to Inc use of Apple Chips

Bloomberg is reporting that Apple, which has used Intel processor chips in its computers since 1995, is planning to use its own chips in Mac computers beginning as early as 2020 (code-named Kalamata), replacing processors from Intel.

IFTLE 377 μ-Transfer Printing going mainstream?; Heterogeneous Int at IMAPS DPC

OSRAM licenses m-transfer printing from X-Celeprint; Heterogeneous Integration Roadmap Update at IMAPS DPC

IFTLE 376 ASE / TDK launch ASE Embedded; The AI Ecosystem Develops

Taiwan’s ASE has initiated a joint venture with Japan’s TDK Corp to produce embedded packaging solutions in Kaohsiung Taiwan. ASE has 51% ownership in the venture which currently employs 150 people.

IFTLE 375 EVG / IBM Laser Debonding; Samsung Increases Focus on CMOS Image Sensor Mkt

IBM’s Hybrid Laser Release Process has been licensed by EV Group for inclusion in their low-temperature laser debonding equipment.

IFTLE 374 IMAPS Device Pkging Conf part 1: 3DIncites Award Winners

The 14th Int Conf on Device Pkging was held at its normal site, Ft. McDowell, AZ, last week. I normally show a picture of the general chair of the meeting and I will this time also (below), but I thought it was about time we gave due credit to the IMAPS staff that makes the meeting possible.

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