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IFTLE 348: ASE Tech Forum at Nijmegen part 1 – “Advanced Packaging 2017″

IFTLE 347: ASE Embedded Packaging Solutions

IFTLE 346 Sony Introduces Stacked Image Sensor with DRAM in Xperia XZ phones

It has been nearly a decade since Toshiba announced the use of backside TSV’s to miniaturize CMOS image sensors.

IFTLE 345 Toshiba 1Tb Flash with TSV; TSMC CoWoS expansion & 2nd Gen InFO; Samsung Foundry takes aim at TSMC

Time to catch up on some very important industry activities…

IFTLE 344 ECTC 4: Reliability Studies of 2.5/3DIC – Cisco, Infineon, Siliconware

Continuing our look at presentations from ECTC 2017.

IFTLE 343 ECTC 3: Materials and Processes: Tohoku, Hotachi Chem, Samsung

Continuing our look at the 2017 ECTC.

IFTLE 342 2017 ECTC part 2: Chip Embedding at Infineon; UCLA SuperCHIPS

As we said in IFTLE 236 Embedded Packaging refers to many different concepts, IP, manufacturing infrastructures and related technologies.

IFTLE 341 Topics from ECTC 2017: Thin Die Handling; IPD on Glass

This week, we will begin looking at key presentations from the 2017 ECTC in Orlando.

IFTLE 340 Can Unity Help Advanced Packaging Progress?

Most would agree that in order for advanced packaging solutions to lead the industry and fill the role previously held by semiconductor scaling it must see advances in infrastructure building and significant focus by all players to lower costs.

IFTLE 339 Will 450mm Equipment Keep Si the Fine Feature WLCSP Solution?

On the eve of the formal ECTC presentations, the conference held a panel session pitting wafer processing vs panel processing for the low cost production of “high density” fan out WLP.

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