Finishing our look at the 2017 SEMI 3D summit in Grenoble.
Continuing our IFTLE look at the 2017 SEMI Euro 3D Summit.
Before we take a look at the recent SEMI European 3D Summit, a little news on the licensing front.
At the recent IEEE ISSCC in SF, Intel discussed the implementation of their EMIB technology [Embedded Multi-die Interconnect Bridge] technology in the Altera Stratix 10 FPGA family designed to meet the needs of developing high end communications systems.
The research wing of the Defense Department, otherwise known as DARPA, put out a broad agency announcement in Sept 2016 for a program called “Common Heterogeneous Integration and IP Reuse Strategies with the same acronym, CHIPS [BAA-16-62] with an anticipated funding level of ~ $70MM.
SEMI’s annual Industry Strategy Symposium was held at its usual site, Half Moon Bay CA a few weeks ago.
Continuing our look at the IMAPS 3D ASIP Conference from this past December.
Continuing our look at the IMAPS 3D ASIP Conference 2016.
This week, I can announce that Dr. Mike Ma, with 23 years in the microelectronics industry, has moved from SPIL to Amkor as Taiwan Country Manager.
The 13th 3D ASIP conference was held this year under the umbrella of IMAPS.