Now, at first glance you may be saying, “Why is IFTLE concerned with the Toshiba’s memory business? This is an advanced packaging blog!” But I hope most of you have learned IFTLE lesson #1 which is whatever effects chips, directly affects chip packaging. So with that in mind, the recent report by Reuters that Apple is looking into joining the Foxconn bid is very interesting.
As one might expect, there were quite a number of fan-out packaging presentations at the recent IMAPS Device Packaging Conference and the next few IFTLE will examine some of those presentations.
Continuing our look at the 2017 IMAPS Device Packaging Conference (DPC) held annually in AZ.
The European SEMI Award was established in 1989 to recognize individuals and teams who have made a significant contribution to the European semiconductor and related industries.
The annual IMAPS Device Packaging Workshop was held at its usual location outside Scottsdale AZ in early March.
Finishing our look at the 2017 SEMI 3D summit in Grenoble.
Continuing our IFTLE look at the 2017 SEMI Euro 3D Summit.
Before we take a look at the recent SEMI European 3D Summit, a little news on the licensing front.
At the recent IEEE ISSCC in SF, Intel discussed the implementation of their EMIB technology [Embedded Multi-die Interconnect Bridge] technology in the Altera Stratix 10 FPGA family designed to meet the needs of developing high end communications systems.
The research wing of the Defense Department, otherwise known as DARPA, put out a broad agency announcement in Sept 2016 for a program called “Common Heterogeneous Integration and IP Reuse Strategies with the same acronym, CHIPS [BAA-16-62] with an anticipated funding level of ~ $70MM.