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IFTLE 391 DoD Worried About Access to State-of-the-art Packaging Technologies

Continuing last week’s conversation about access to state-of-the-art packaging capabilities if you are not a large volume player, let’s look at the current concerns of the USG (US govt).

IFTLE 390 Raytek – An Accessible Wafer Level Packaging Start-up in Taiwan

While all readers of IFTLE know that advances in chip packaging have been proceeding at a rapid rate at the same time as front end IC advances are becoming harder and harder to achieve, access to these advanced technologies are difficult if you are not one of the large volume players.

IFTLE 389 Samsung 2μm L/S Panel Level Packaging Technology Revealed at ECTC

This week and next, IFTLE will take a look at the key Samsung presentations from the recent ECTC meeting in San Diego.

IFTLE 388 2018 ECTC Part 3 TSMC & Samsung – Flexing their Muscle at ECTC

Sometimes, not always but sometimes, you can see a trend coming.

IFTLE 387 Broadcom Looks to Advanced Packaging; Rumors from ECTC San Diego

Boon Chye Ooi , Sr VP of Operations for Broadcom spoke at the IEEE ECTC luncheon addressing “Packaging advancements to enable artificial intelligence (AI), autonomous cars and wearables in the near future: cost and implications to supply chains.”

IFTLE 386 IEEE EPS Awards at 2018 ECTC

Memorial Day in the US means the start of the IEEE ECTC meeting, which is run by the IEEE EPS society (Electronic Packaging Society).

IFTLE 385 Samsung’s Semiconductor Focused Activities

Let’s take a look at Samsung’s System LSI activities per their recent Investor program. ICs and applications that were highlighted are shown below.

IFTLE 384 Sony Refocuses on Smartphones for 5G

Sony had some interesting things to say about their semiconductor and imaging technology businesses at their recent investor relations day May 22nd in Tokyo.

IFTLE 383 Global Foundries “Adv Packaging Trends in the Foundry Space”

At the recent IMAPS Device Packaging Conference outside Phoenix Hamid Eslampour, CMOS BU Product Management, of GlobalFoundries (GF) discussed Advanced Packaging in the Foundry Space.

IFTLE 382 Semiconductor Activity in China – Betting on AI

China is by far the largest consumer of semiconductors reportedly accounting for 45 percent of the worldwide demand for chips, used both in China and for exports. More than 90 percent of its consumption relies on imported ICs.

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