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IFTLE 280 2016 European 3D Summit: Economic Profit in Today’s Micro electronics

By Dr. Phil Garrou, Contributing Editor

Continuing our look at the 2016 SEMI European 3D Summit.

McKinsey

A very interesting chart from McKinsey on 2014 economic profit in the microelectronics industry (below). It is clear that very few companies are responsible for most of the economic profit.

McKinsey 1

The big 5 of Intel, TSMC, Qualcomm, TI and Samsung contributed > 70% of the entire industries economic profit for the last 15 years.

The following are the top 10 2014 assembly and test companies.

mckinsey 2

While market share is key in most semiconductor industry segments, there is no such link in assembly and test. Partnerships and portfolio appear to be the most important factors I assembly & test.

Their key trends for Assembly & test are:

mckinsey 3

None of these should be a surprise to readers of IFTLE.

Fraunhoffer Inst

In a joint presentation by the different Fraunhoffer Institutes in Germany, Andy Heinig show the following comparison of their SiO2 and polymer based processes.

Fraunhoffer 1

They indicate that the required number of routing layers not only depending on component complexity (i.e., pin count, pitch), but also on interposer material composition ( i.e. polymer vs SiO2 based)

- Polymer-based interposers with increased width and spacing of interconnect require a minimum of 3 metal layers

- Finer L/S of SiO2-based interposers allows routing on a single metallization layer

- Different consideration for power/ground nets (larger line/space) necessary

3M

The 3M wafer support system for thinning and backside processing has been around for several years. Their standard process is shown below.

3M 1

They are also developing a thermal cure adhesive that can be mechanically debonded. This eliminates the LTHC layer and the laser module. Properties are shown below.

3M 2

For all the latest in 3DIC and other advanced packaging, stay linked to IFTLE…

 

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