IFTLE 243 Amkor Fan Out Package Platforms
By Dr. Phil Garrou, Contributing Editor
Amkor recently held a customer Symposium covering their activities. Let’s take a look at some of the interesting points that they covered on their fan out package platforms.
2014 Amkor revenue is clearly dominated by the communications segment.
When looking in general at the evolution packaging they see the largest focus on filling the gap between 1 and 10um as shown below.
Their packaging roadmap to address this gap area is shown below and is tied to their Swift and Slim product families. Such ultra thin packages will have to be handled by temporary bonding to a rigid substrate in order to process them.
From a mobile products standpoint they see the 5+um range filling most of the needed requirements for density/IO, whereas the SWIFT product line will be needed for < 5um BB module (SiP) requirements.
The SWIFT and SLIM processes are depicted below. SWIFT interconnect is carried out on an RDL bumping line by Amkor whereas 2-5um SLIM interconnect is fabricated by foundry.
Since interconnect is fabricated first, higher densities can be achieved, i.e. 2-8um L/S for SWIFT vs 8-15um for traditional chips first FOWLP.
In summary depending on the requirements of the application, different technologies are available and/or are being developed to meet those requirements.Click to view full size.
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