IFTLE 84 …. and the Winner is
Dr Kesser was shipped MRS volume 970 "Enabling Technologies for 3D Integration" edited by Bower, Garrou, Ramm and Takahashi. Beth received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. in Materials Science and Engineering at the University of Illinois at Urbana-Champaign. Beth’s interests include developing materials and packaging technologies for the semiconductor industry, which has resulted in 7 patents, 5 patents pending, and over 33 publications in this area. Currently, Beth is the Wafer Level Packaging Product and Technology Manager at Qualcomm in San Diego. Also, Beth is the Assistant Program Chair of the 62nd ECTC to be held in San Diego, CA in May 2012 and was just elected to the IEEE CPMT Board of Governors.
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