Subi Kengeri talks about which one you’ll need and why.

Consider: 200K wafers = 2.5 billion ICs for RF front-end module apps = half this year’s market.

Key technology behind world’s fastest and lowest-power integrated LTE smartphone platform

ST’s 1st 28nm FD-planar silicon results; IBM’s next-gen Fin-on-oxide; ARM on design for both.

Same process tech GloFo will have in high-volume next year: Fabless designers can try it out now

Soitec-SEH announcement is a proof point for full engagement of the SOI substrate supply chain

CTO/CMO Chery heralds ease, low cost of manufacturing, plus excellent results (interview)

Here’s a look at what’s on tap for this year – from circuits & apps to materials & devices

Why have the device modeling experts at GSS caught the industry’s ear? Let’s connect some dots

Interest ran high at events with ARM, GF, ST, IBM, Soitec, Leti, UCBerkeley and the Consortium