In the previous blog, I listed technology status and would now like to discuss a couple of topics in detail.
To simplify the vast amount of information from the 2017 SPIE AL EUVL Conference for my blog, I have adopted a new format. It includes a short summary of EUVL Status, a list of notable updates, and additions to the current list of EUVL Challenges (previously published on this site).
As we look forward to 2017 SPIE Advanced Lithography Conference in San Jose next week, the focus once again will be on EUV Lithography, its readiness for manufacturing and plans of chip makers for starting to use EUVL in their fabs.
At the heart of this happy surge are the computer chips that grow more powerful every year without increasing their price. I would like to tell you how we in the computer chip industry do this, and what it will take to continue this trend in the coming decades.
Highlights from 2016 EUV Source Workshop – Work on Conversion Efficiency of EUV Sources and Continued Progress in Source Technology
The 2016 Source Workshop was held Nov 7-9, 2016 at ARCNL, Amsterdam, The Netherlands. During the workshop we received new information about EUV source power, updating what we learned at the EUVL Workshop in June.
EUV Sources remain the key component for ensuring EUV Lithography’s entry into fabs for high-volume manufacturing.
The 2016 EUVL Workshop was held last month at LBL in Berkeley, where we heard the latest news on EUV Lithography R&D development topics.
EUV Sources remain the key enabler to move EUVL into manufacturing, and we look forward to the upcoming 2015 Source Workshop (November 9-11, 2015, Dublin, Ireland) for the latest developments and status of EUV Source technology.
This year started with an announcement, during the SPIE AL Conference, of the achievement of 100 W+ power from high volume manufacturing (HVM) EUV sources in the fab.