I’ve been looking back at the talk given by Mark Bohr and Zane Ball (Building Winning Products with Intel Advanced Technologies and Custom Foundry Platforms) at the Intel Developer Forum (IDF) in August last year, and I’m a bit puzzled.
At IEDM last month, there was much ado about the adjacent 7-nm late-news papers from TSMC and the GLOBALFOUNDRIES/IBM/Samsung group consortium from the Albany Nanotechnology Center, and with less ado, Samsung gave a 5-nm presentation later in the conference.
Now for the second part of the preview, starting with the Tuesday afternoon sessions.
On December 3rd – 7th , the good and the great of the electron device world will make their usual pilgrimage to San Francisco for the 2016 IEEE International Electron Devices Meeting.
One of the lesser-known stories of mobile phone evolution is the development of proximity sensing in order to save power and disable touch-screen functions when the phone is actually being used as a phone. This essentially means turning off the screen (and the touch-capability tasks) when the phone is brought up to the ear.
As usual, within days of the August 19 launch of the Samsung Galaxy Note 7, we had it in pieces and had identified most of the significant components that were inside.
July 11 – 15 was the week for the annual pilgrimage down to the SEMICON West show, though it’s becoming less of a show these days than a gathering place for the industry, with multiple conferences in parallel.
A bit earlier than usual, the IEDM (International Electron Devices Meeting) press kit is available, and among the announcements are a couple of surprises.
Day 3 was just a morning session, with China being the topic. Sunny Hui, SVP Worldwide Marketing for SMIC, gave (for me) a notable keynote on “Collaborate to Win in the China Market”.