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Posts Tagged ‘SSD’

Mentor Graphics Veloce Emulation Platform Used by Starblaze for Verification of SSD Enterprise Storage Design

Wednesday, September 21st, 2016

Mentor Graphics Corporation (NASDAQ: MENT) today announced that the Veloce® emulation platform was successfully used by Starblaze Technology for a specialized high-speed, enterprise-based Solid State Drive (SSD) storage design.

Starblaze performed a detailed and lengthy analysis of the available solutions in the emulation market.  The Veloce emulation platform was selected and deployed because of its superior virtualization technology and memory protocol support, rich software debug capabilities and proven track record delivering innovative emulation technology.

“The enterprise SSD market is evolving rapidly, so the SoC (System on a Chip) verification technology we use has to be perfectly aligned with our needs, especially in terms of flexibility and high-performance protocol support,” said Sky Shen, CEO of Starblaze Technology. “After using the Veloce emulation platform on our latest high-performance, enterprise SSD controller project, we are convinced that a virtual solution with extensive software debug capability is the trend for the future of emulation technology.”

In the SSD storage space, it is extremely important for design teams to study the architecture and tune the performance while finding deep hardware bugs in the pre-silicon stage. Starblaze used VirtuaLAB PCIe to provide the host connection to their design on the Veloce emulation platform. The VirtuaLAB PCIe delivers very high debug productivity, and Starblaze was able to use its Software Design Kit “as is” without any modification or adaption.  In addition to using Veloce VirtuaLAB, Starblaze used Mentor’s Codelink® software debug capability to support the requirements of their embedded core software debug. In the flash interface side, the Veloce platform provides both HW and SW sparse memory solutions, which permits the necessary tradeoffs in the storage application.

ICE and Virtual:  Complementary Technologies

With the Veloce Emulation platform, verification teams have access to the best of both worlds, whether using an ICE-based or virtual emulation environment.  In-circuit emulation (ICE), a foundational emulation use model, remains a ‘must have’ for SoC designs that need to connect to real devices or custom hosts where physical hardware is required. The Veloce iSolve™ library offers a full complement of hardware components to build a robust ICE-based flow.

As more verification teams move from an ICE-based flow to a virtual flow, the Veloce emulation platform provides a smooth transition.  The Veloce Deterministic ICE App complements ICE by eliminating the non-deterministic nature of ICE and enabling advanced verification techniques: debug, power analysis, coverage closure, and software debug.

Full virtualization is achieved with the Veloce VirtuaLAB environment, which delivers virtual ICE-equivalent, high-speed host protocols and memory devices, allowing for greater flexibility for hardware/software system-level debug, power analysis, and system performance analysis.

“The Veloce emulation platform continues to deliver a comprehensive and robust emulation platform to a broad set of markets that all have unique challenges,” said Eric Selosse, vice president and general manager of the Mentor Emulation Division. “With Starblaze’s expertise in Flash Controller and SoC design, they quickly recognized the benefits of our VirtuaLAB solution.  Our success in working with them is attributed to our in-depth knowledge of the power of a virtual solution, and our timely support in deploying the Veloce emulation platform to meet their specific needs.”

About the Veloce Emulation platform

The Veloce emulation platform uses innovative software, running on powerful, qualified hardware and an extensible operating system, to target design risks faster than hardware-centric strategies. Now considered among the most versatile and powerful of verification tools, emulation greatly expands the ability of project teams to do hardware debugging, hardware/software co-verification or integration, system-level prototyping, low-power verification and power estimation and performance characterization.

The Veloce emulation platform is a core technology in the Mentor® Enterprise Verification Platform™ (EVP) – a platform that boosts productivity in ASIC and SoC functional verification by combining advanced verification technologies in a comprehensive platform. The Mentor EVP combines Questa® advanced verification solutions, the Veloce emulation platform, and the Visualizer™ debug environment into a globally accessible, high-performance datacenter resource. The Mentor EVP features global resource management that supports project teams around the world, maximizing both user productivity and total verification return on investment.

Veloce2 Emulator

Veloce2 Emulator is a high capacity, high-speed, multi-application powerhouse for simulation and emulation of SoC designs Learn More

About Mentor Graphics

Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of approximately $1.18 billion. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. http://www.mentor.com.

Mentor Graphics U2U Meeting April 26 in Santa Clara

Monday, April 11th, 2016

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Mentor Graphics’ User2User meeting will be held in Santa Clara on April 26, 2016. The meeting is a highly interactive, in-depth technical conference focused on real world experiences using Mentor tools to design leading-edge products.

Admission and parking for User2User is free and includes all technical sessions, lunch and a networking reception at the end of the day. Interested parties can register on-line in advance.

Wally Rhines, Chairman and CEO of Mentor Graphics, will kick things off at 9:00am with a keynote talk on “Merger Mania.“ Wally notes that in 2015, the transaction value of semiconductor mergers was at an all-time historic high.  What is much more remarkable is that the average size of the merging companies is five times as large as in the past five years, he said. This major change in the structure of the semiconductor industry suggests that there will be changes that affect everything from how we define and design products to how efficiently we develop and manufacture them. Dr. Rhines will examine the data and provide conclusions and predictions.

He will be followed by another keynote talk at 10:00 by Zach Shelby, VP of Marketing for the Internet of Things at ARM. Zach was co-founder of Sensinode, where he was CEO, CTO and Chief Nerd for the ground-breaking company before its acquisition by ARM. Before starting Sensinode, Zach led wireless networking research at the Centre for Wireless Communications and at the Technical Research Center of Finland.

After user sessions and lunch, a panel will convene at 1:00pm to address the topic “Ripple or Tidal Wave: What’s driving the next wave of innovation and semiconductor growth?” Technology innovation was once fueled by the personal computer, communications, and mobile devices. Large capital investment and startup funding was rewarded with market growth and increased silicon shipments. Things are certainly consolidating, perhaps slowing down in the semiconductor market, so what’s going to drive the next wave of growth?  What types of designs will be staffed and funded? Is it IoT?  Wearables?  Automotive?  Experts will address these and other questions and examine what is driving growth and what innovation is yet to come.

Attendees can pick from nine technical tracks focused on AMS Verification, Calibre I and II, Emulation, Functional Verification, High Speed, IC Digital Implementation, PCB Flow, and Silicon Test & Yield Solutions. You’ll hear cases studies directly from users and also updates from Mentor Graphics experts.

These user sessions will be held at 11:10-12:00am, 2:00-2:50pm and 3:10-5:00pm.

A few of the highlights:

  • Oracle’s use of advanced fill techniques for improving manufacturing yield
  • How Xilinx built a custom ESD verification methodology on the Calibre platform
  • Qualcomm used emulation for better RTL design exploration for power, leading to more accurate power analysis and sign-off at the gate level
  • Micron’s experience with emulation, a full environment for debug of SSD controller designs, plus future plans for emulation
  • Microsoft use of portable stimulus to increase productivity, automate the creation of high-quality stimulus, and increase design quality
  • Formal verification at MicroSemi to create a rigorous, pre-code check-in review process that prevents bugs from infecting the master RTL
  • A methodology for modeling, simulation of highly integrated multi-die package designs at SanDisk
  • How Samsung and nVidia use new Automatic RTL Floorplanning capabilities on their advanced SoC designs
  • Structure test at AMD: traditional ATPG and Cell-Aware ATPG flows, as well as verification flows and enhancements

Other users presenting include experts from Towerjazz, Broadcom, GLOBALFOUNDRIES, Silicon Creations, MaxLinear, Silicon Labs, Marvell, HiSilicon, Qualcomm, Soft Machines, Agilent, Samtec, Honewell, ST Microelectronics, SHLC, ViaSat, Optimum, NXP, ON Semiconductor and MCD.

The day winds up with a closing session and networking reception from 5:00-6:00pm.

Registration is from 8:00-9:00am in the morning.

Samsung Begins Mass Producing Industry First 256-Gigabit, 3D V-NAND

Tuesday, August 11th, 2015

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Samsung Electronics has begun mass producing the industry’s first 256-gigabit (Gb), three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid state drives (SSDs).

Samsung’s new 256Gb 3D V-NAND flash doubles the density of conventional 128Gb NAND flash chips. In addition to enabling 32 gigabytes (256 gigabits) of memory storage on a single die, the new chip will also easily double the capacity of Samsung’s existing SSD line-ups, and provide an ideal solution for multi-terabyte SSDs.

Samsung introduced its 2nd generation V-NAND (32-layer 3-bit MLC V-NAND) chips in August 2014, and launched its 3rd generation V-NAND (48-layer 3-bit MLC V-NAND) chips in just one year, in continuing to lead the 3D memory era.

In the new V-NAND chip, each cell utilizes the same 3D Charge Trap Flash (CTF) structure in which the cell arrays are stacked vertically to form a 48-storied mass that is electrically connected through some 1.8 billion channel holes punching through the arrays thanks to a special etching technology. In total, each chip contains over 85.3 billion cells. They each can store 3 bits of data, resulting 256 billion bits of data, in other words, 256Gb on a chip no larger than the tip of a finger.

A 48-layer 3-bit MLC 256Gb V-NAND flash chip delivers more than a 30 percent reduction in power compared to a 32-layer, 3-bit MLC, 128Gb V-NAND chip, when storing the same amount of data. During production, the new chip also achieves approximately 40 percent more productivity over its 32-layer predecessor, bringing much enhanced cost competitiveness to the SSD market, while mainly utilizing existing equipment.

Samsung plans to produce 3rd generation V-NAND throughout the remainder of 2015, to enable more accelerated adoption of terabyte-level SSDs. While now introducing SSDs with densities of two terabytes and above for consumers, Samsung also plans to increase its high-density SSD sales for the enterprise and data center storage markets with leading-edge PCIe NVMe and SAS interfaces.