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Posts Tagged ‘Semiconductor Industry Association’

Solid State Watch: July 3-9, 2015

Friday, July 10th, 2015
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Solid State Watch: May 1-8, 2015

Tuesday, May 12th, 2015
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Solid State Watch: February 27-March 5, 2015

Friday, March 6th, 2015
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Solid State Watch: October 31-November 6, 2014

Monday, November 10th, 2014
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The Week in Review: October 10, 2014

Friday, October 10th, 2014

Samsung Electronics announced plans on Monday to invest $14.7 billion (15.6 trillion Korean won) in a new semiconductor fabrication facility in Pyeongtaek, South Korea to meet growing demand from smartphones, enterprise computing and the emerging “Internet of Things” market.

Soraa, a developer of GaN on GaN LED technology, announced today that one of its founders, Dr. Shuji Nakamura, has been awarded the 2014 Nobel Prize in Physics. Recognizing that Nakamura’s invention, the blue light emitting diode (LED), represents a critical advancement in LED lighting, the Nobel committee explained the innovation “has enabled bright and energy-saving white light sources.”

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA’s highest honor, the Robert N. Noyce Award.

The Board of Directors of United Microelectronics Corporation (UMC), a global semiconductor foundry, this week announced a joint venture company focused on 12″ wafer foundry services with Xiamen Municipal People’s Government and FuJian Electronics & Information Group.

Emergence of new wide bandgap (WBG) technologies such as SiC and GaN materials will definitely reshape part of the established power electronics industry, according to Yole Développement (Yole).

The Week in Review: Dec. 6, 2013

Friday, December 6th, 2013

Worldwide sales of semiconductors reached $27.06 billion for the month of October 2013, a 7.2 percent increase from the same month last year when sales were $25.24 billion, according to preliminary results by Gartner, Inc. The top 25 semiconductor vendors’ combined revenue increased 6.2 percent, a significantly better performance than the rest of the market, whose revenue growth was 2.9 percent. This was, in part, due to the concentration of memory vendors, which saw significant growth in the top ranking.

Soitec, a manufacturer semiconductor materials for the electronics and energy industries, this week announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates. Soitec’s eSI products, based on Smart Cut technology, are the first “trap-rich” type of material in full production. These substrates, on which devices are manufactured, have a significant impact on the final devices’ performance. Soitec’s eSI substrates are designed by introducing an innovative material (a trap-rich layer) between the high-resistivity handle wafer and the buried oxide. This layer limits the parasitic surface conduction present in standard high-resistivity silicon-on-insulator (HR-SOI) substrates, boosting the performance of RF devices. Because this layer is built into the substrate, it reduces the number of process steps and relaxes design rules, leading to a lower cost process and possibly a smaller die area per function.

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013, according to the SEMI Year-end Forecast, released this week at the annual SEMICON Japan exposition.  In 2014, all regions except Rest of World are expected to have strong positive growth, resulting in a global increase of 23.2 percent in sales. 2015 sales are expected to continue to grow — increasing 2.4 percent with Japan, Europe, Korea, China, and Rest of World regions registering positive growth.

Micron Technology, Inc. announced that the company has named Rajan Rajgopal, vice president of Quality. Rajgopal will be responsible for overseeing all aspects of Micron’s quality systems including manufacturing, customer program management and product ramps. He brings more than 25 years of experience to Micron and most recently served as the vice president of Global Quality and Customer Enablement for GLOBALFOUNDRIES in Singapore.

SEMI’s World Fab Forecast report, published in November, predicts that fab equipment spending will decline about -9 percent (to US$32.5 billion) in 2013 (including new, used and in-house manufactured equipment).  Setting aside the used 300mm equipment GlobalFoundries acquired from Promos at the beginning of 2013 (NT$20-30 billion), fab equipment spending sinks further, to -11 percent in 2013.  The previous World Fab Forecast in August predicted an annual decline of just -1 percent (-3 percent without the used Promos 300mm equipment).

Worldwide sales of semiconductors reached $27.06 billion for the month of October 2013, a 7.2 percent increase from the same month last year when sales were $25.24 billion, and 0.8 percent higher than last month’s total, according to The Semiconductor Industry Association (SIA). “With eight straight months of growth and a new monthly sales record in October, the global semiconductor industry is on track to exceed $300 billion in annual sales for the first time ever in 2013,” said Brian Toohey, president and CEO, Semiconductor Industry Association. “The industry is projected to maintain solid growth for the remainder of 2013 and into 2014, led largely by the Americas, which has remained well ahead of last year’s pace. Congress and the Administration can help maintain and strengthen growth by resolving fiscal uncertainty and investing in scientific research.”

The Week in Review: Nov. 1, 2013

Friday, November 1st, 2013

Toshiba this week announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology. The company’s new 32-gigabyte (GB) embedded device integrates four 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba’s 19nm second generation process technology and a dedicated controller into a small package measuring only 11.5 x 13 x 1.0mm.Mass production will start from the end of November.

Mentor Graphics announced the Valor Information Highway and the Valor Warehouse Management products, two supply chain-focused tools designed to enhance Enterprise Resource Planning (ERP) effectiveness and assist electronics manufacturers in reducing material costs. Together, the two new products provide real-time material consumption and spoilage data, facilitating total materials management and traceability over the entire warehouse infrastructure, logistics, shop floor storage areas and direct points of use.

Senior executives from Semiconductor Industry Association (SIA) member companies and other multi-national semiconductor companies around the globe sent a letter to Chinese Vice Premiers Wang Yang and Ma Kai, encouraging China to support duty-free coverage for semiconductor products in an expanded Information Technology Agreement (ITA). The ITA promotes fair and open trade by providing for duty-free treatment of certain information technology products, including semiconductors, but the list of covered products has not been updated since the ITA’s inception in 1996.

Graphene may command the lion’s share of attention but it is not the only material generating buzz in the electronics world. Vanadium dioxide is one of the few known materials that acts like an insulator at low temperatures but like a metal at warmer temperatures starting around 67 degrees Celsius. This temperature-driven metal-insulator transition, the origin of which is still intensely debated, in principle can be induced by the application of an external electric field. That could yield faster and much more energy efficient electronic devices. To determine the origin of the metal-insulator transition of vanadium dioxide, Aetukuri and a collaboration of researchers led by Stuart Parkin, of SpinAps and the IBM Almaden Research Center and Hermann Dürr of the SLAC National Laboratory, studied thin films of the material at Berkeley Lab’s Advanced Light Source (ALS). Using ALS beamline 4.0.2, an undulator beamline that can provide soft X-rays with variable linear polarization, they performed a series of strain-, polarization- and temperature-dependent X-ray absorption spectroscopy tests, in conjunction with X-ray diffraction and electrical transport measurements.

Cadence announced the availability of Cadence Interconnect Workbench. A software solution providing cycle-accurate performance analysis of interconnects throughout the system-on-chip (SoC) design process, Interconnect Workbench quickly identifies design issues under critical traffic conditions and enables users to improve device performance and reduce time to market. Interconnect Workbench works in conjunction with Cadence Interconnect Validator for a complete functional verification and performance validation solution.

Peregrine Semiconductor and GLOBALFOUNDRIES, a provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. In a joint development effort, GLOBALFOUNDRIES and Peregrine created a new fabrication flow for the versatile, new, 130 nm UltraCMOS 10 technology platform. This new technology delivers a more than 50-percent performance improvement over comparable solutions. UltraCMOS 10 technology gives smartphone manufacturers unparalleled flexibility and value without compromising quality for devices ranging from 3G through LTE networks.

SEMI announced its support of the Revitalize American Innovation and Manufacturing Act of 2013, along with the National Association of Manufacturers (NAM). The Revitalize American Manufacturing and Innovation Act of 2013 is modeled on the National Additive Manufacturing Innovation Institute (NAMII), a public-private manufacturing hub located in Youngstown, Ohio. The legislation is designed to bring together industry, universities and community colleges, federal agencies, and all levels of government to accelerate manufacturing innovation. It would establish public-private institutes to bridge the gap between basic research and product development.