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Posts Tagged ‘Flip Chip International’

Blog review April 22, 2014

Tuesday, April 22nd, 2014

Pete Singer blogs that it’s difficult to make interconnects much smaller without introducing significant increases in resistivity. At the upcoming IITC/AMC joint conference in May, many papers focus on new materials that could lead to reduced resistivity and enable further interconnect scaling. Most notably, graphene and CNTs provide an interesting alternative to copper.

Phil Garrou continues his analysis of the IMAPS Device Packaging Conference with a look at the presentations made by Flip Chip International and SUSS (the use of lasers in the manufacturing of WLP); GLOBALFOUNDRIES, Amkor and Open Silicon (a 2.5D ARM dual core product demonstrator which consists of 2 ARM die on a high density silicon interposer); Corning (results of multiple glass interposer programs) and Namics (underfill products for FC BGA and FC CSP).