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Posts Tagged ‘Element Six’

The Week in Review: October 17, 2014

Friday, October 17th, 2014

Driven by rising demand for fitness and health monitoring features as well as by improved user interfaces, shipments of sensors used in wearable electronic devices will rise by a factor of seven from 2013 through 2019, according to IHS Technology.

Intermolecular, Inc. announced this week that Dr. Bruce McWilliams has been appointed president and chief executive officer. David Lazovsky has resigned as president and chief executive officer and from the Board of Directors to pursue other interests.

Qualcomm announced that it has reached agreement with CSR regarding the terms of a recommended cash acquisition of CSR will be acquired by Qualcomm Global Trading Pte. Ltd.

Texas Instruments this week announced it has shipped more than 22 billion units of copper wire bonding technology from its internal assembly sites and is now in production for major high reliability applications including automotive and industrial.

Element Six this week announced the development of a new thermal grade of diamond grown by chemical vapor deposition (CVD), DIAFILM TM130.

The Week in Review: May 16, 2014

Friday, May 16th, 2014

On May 14, 2014, it was announced that STMicroelectronics and Samsung Electronics signed an agreement on 28nm Fully Depleted Silicon-on-Insulator (FD-SOI) technology for multi-source manufacturing collaboration. The agreement includes ST’s fully developed process technology and design enablement ecosystem from its 300mm facility in Crolles, France. The Samsung 28nm FD-SOI process will be qualified in early 2015 for volume production.

Applied Materials announced its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.. The introduction of cobalt as a superior metal encapsulation film marks the most significant materials change to the interconnect in over 15 years.

Dow Corning introduced Dow Corning EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components.

Element Six today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices.

A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps.

SEMATECH announced that researchers have reported progress which could significantly improve resist sensitivity by incorporating metal oxide nanoparticles for extreme ultraviolet (EUV) lithography, bringing the technology another step toward enabling the development of high performance resists required to enable EUV for high-volume manufacturing (HVM).

Mentor Graphics Corporation this week announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance. The MicReD Industrial Power Tester 1500A tests the reliability of power electronic components that are increasingly used in industries such as automotive and transportation including hybrid and electrical vehicles and trains, power generation and converters, and renewable energy applications such as wind turbines.  It is the only commercially available thermal testing product that combines both power cycling and thermal transient measurements with structure function analysis while providing data for real-time failure-cause diagnostics.

The Week in Review: Jan. 31, 2014

Friday, January 31st, 2014

The Obama Administration this week announced the selection of North Carolina State University to lead a public-private manufacturing innovation institute for next generation power electronics. Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing on small and medium-sized companies. The 18 companies already committed to the consortium include: ABB, APEI, Avogy, Cree, Delphi, Delta Products, DfR Solutions, Gridbridge, Hesse Mechantronics, II-VI, IQE, John Deere, Monolith Semiconductor, RF Micro Devices, Toshiba International, Transphorm, USCi and Vacon. The institute, backed by a $70 million investment from the Department of Energy, will focus on power electronics using wide bandgap (WBG) semiconductors, bringing together over 25 companies, universities and state and federal organizations.

Semiconductor Manufacturing International Corporation, China’s largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer (MPW) stage to support customer’s requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate (HKMG) processes. Over 100 IPs from multiple third party IP partners as well as SMIC’s internal IP team are prepared to serve various projects from worldwide design houses that have been showing interest in SMIC 28nm processes.

Researchers with the Lawrence Berkeley National Laboratory have developed a process-friendly technique that would enable the cooling of microprocessor chips through carbon nanotubes. Frank Ogletree, a physicist with Berkeley Lab’s Materials Sciences Division, led a study in which organic molecules were used to form strong covalent bonds between carbon nanotubes and metal surfaces. This improved by six-fold the flow of heat from the metal to the carbon nanotubes, paving the way for faster, more efficient cooling of computer chips. The technique is done through gas vapor or liquid chemistry at low temperatures, making it suitable for the manufacturing of computer chips.

With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing. Fab construction spending is expected to grow from about US$ 1.1billion in 2013 to $1.4 to 1.8 billion in 2014.  The 27th annual SEMICON Korea, the leading semiconductor technology event serving the region, will be held at COEX in Seoul. The event opens with a keynote speech by Dr. Roawen Chen from Qualcomm on “Mobile Innovation: Leading the Semiconductor Industry to a Smart, Connected World.”

Element Six, a developer of synthetic diamond supermaterials, today announced that the University of Strathclyde has successfully demonstrated two notable high-power laser research developments—the first ever tunable diamond Raman laser and the first continuous-wave (CW) laser—both using Element Six’s synthetic diamond material. These two achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

Novoset, LLC and Lonza introduced the Primaset ULL-950 and Primaset HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries. These thermoset resins are based on Cyanate ester (CE) chemistry.


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