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Posts Tagged ‘Broadcom’

Optimal+ Turns 10, Wins Accolades For Its Work

Friday, July 17th, 2015

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By Jeff Dorsch, Contributing Editor

Optimal+ has been in business since 2005. The Israel-based company, which has offices around the world, has something else to celebrate this year: Frost & Sullivan gave Optimal+ its 2015 Global Semiconductor Test Visionary Innovation Leadership Award.

“Frost & Sullivan firmly believes that Optimal+ is the epitome of visionary innovation as it relates to Big Data analytics for the semiconductor industry,” the management consulting and market research firm said. It cited Optimal+’s ability to offer customers a high return on investment, along with improvements in quality and yield, among other attributes.

Optimal+ last year changed its name from OptimalTest, saying it had expanded beyond semiconductor test operations to supply chain management and visibility, product planning, and Big Data analytics.

“The name Optimal+ is more representative of our business and focus moving forward,” founder and CEO Dan Glotter said in a statement.

Kenneth Levy, the chairman emeritus of KLA-Tencor and founder of KLA Instruments, serves as chairman of the Optimal+ board. The company’s investors include Aviv Ventures, Carmel Ventures, Evergreen Venture Partners, and Pitango Venture Capital.

Optimal+ has Advanced Micro Devices and Broadcom among its customers, and it has worked with a wide variety of fabless semiconductor companies, integrated device manufacturers, and outsourced semiconductor assembly and test firms.

“Everything we do is predicated on ROI,” says David Park, the company’s vice president of worldwide marketing. Optimal+ has processed and approved more than 20 billion chips in its decade-long history, and it says its software and services are checking out 15 billion chips a year now.

Park says the company can deliver up to 2 percent greater yield and up to 3 percent improvement in product yield recovery based solely on test, while also increasing operational efficiency and productivity improvements by up to 20 percent. Optimal+ is additionally all about test-time reduction, he adds.

Optimal+ last month rolled out Release 6.0 of its Semiconductor Operations Platform with a new feature, Extreme Analytics and Characterization, or EXACT. It also announced the selection of the HP Vertica Analytics Platform to help its customers with business intelligence and analytics.

For Optimal+, the company’s product and services portfolio is all about providing “Manufacturing Intelligence,” Park notes.

Blog review January 26, 2015

Monday, January 26th, 2015

Scott McGregor, President and CEO of Broadcom, sees some major changes for the semiconductor industry moving forward, brought about by rising design and manufacturing costs. Speaking at the SEMI Industry Strategy Symposium (ISS) in January, McGregor said the cost per transistor was rising after the 28nm, which he described as “one of the most significant challenges we as an industry have faced.” Pete Singer reports.

Matthew Hogan, Mentor Graphics writes a tongue-in-cheek blog about IP, saying chip designers need only to merely insert the IP into the IC design and make the necessary connections. Easy-peasey! Except…robust design requires more than verifying each separate block—you must also verify that the overall design is robust. When you are using hundreds of IPs sourced from multiple suppliers in a layout, how do you ensure that the integration of all those IPs is robust and accurate?

Dick James, Senior Analyst at Chipworks IEDM blogs that Monday was FinFET Day. He highlights three finFET papers, by TSMC, Intel, and IBM.

A research team led by folks at Cornell University (along with University of California, Berkeley; Tsinghua University; and Swiss Federal Institute of Technology in Zurich) have discovered how to make a single-phase multiferroic switch out of bismuth ferrite (BiFeO3) as shown in an online letter to Nature. Ed Korczynski reports.

SEMI praised the bipartisan effort in the United States Congress to pass the Revitalize American Manufacturing and Innovation (RAMI) Act as part of the year-end spending package. Since its introduction in August 2013, SEMI has been a champion and leading voice in support of the bill that would create public private partnerships to establish institutes for manufacturing innovation.

Phil Garrou takes a look at some of the key presentations at the 2014 IEEE 3DIC Conference recently held in Cork, Ireland.

Adele Hars writes that there were about 40 SOI-based papers presented at IEDM. In Part 1 of ASN’s IEDM coverage, she provides a rundown of the top SOI-based advanced CMOS papers.

Karen Lightman of the MEMS Industry Group says power is the HOLY GRAIL to both the future success of wearables and IoT/Everything.  Power reduction and management through sensor fusion, power generation through energy harvesting as well as basic battery longevity. It became very clear from conversations at the MIG conference as well as in talking with folks on the CES show floor that the issue of power is the biggest challenge and opportunity facing us now.

In order to keep pace with Moore’s Law, semiconductor market leaders have had to adopt increasingly challenging technology roadmaps, which are leading to new demands on electronic materials (EM) product quality for leading-edge chip manufacturing. Dr. Atul Athalye, Head of Technology, Linde Electronics, discusses the challenges.


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