Posts Tagged ‘ASML’
By Jeff Dorsch, contributing editor
Extreme-ultraviolet lithography systems will be available to pattern critical layers of semiconductors at the 10-nanometer process node, and EUV will completely take over from 193nm immersion lithography equipment at 7nm, according to Martin van den Brink, president and chief technology officer of ASML Holding.
Giving the keynote presentation Tuesday at the SPIE Photomask Technology conference in Monterey, Calif., Martin offered a lengthy update on his company’s progress with EUV technology.
Sources for the next-generation lithography systems are now able to produce 77 watts of power, and ASML is shooting for 81W by the end of 2014, Martin said.
The power figure is significant since it indicates how many wafers the litho system can process, a key milestone in EUV’s progress toward becoming a volume manufacturing technology. With an 80W power source, ASML’s EUV systems could turn out 800 wafers a day, he noted.
The goal is to get to 1,000 wafers per day. ASML has lately taken to specifying throughput rates in daily production, not wafers per hour, since many wafer fabs are running nearly all the time at present.
ASML’s overarching goal is providing “affordable scaling,” Martin asserted, through what he called “holistic lithography.” This involves both immersion litho scanners and EUV machines, he said.
Martin offered a product roadmap over the next four years, concluding with manufacturing of semiconductors with 7nm features in 2018.
The ASML president acknowledged that the development of EUV has been halting over the years, while asserting that his company has made “major progress” with EUV. He said the EUV program represented “a grinding project, going on for 10 years.”
For all of EUV’s complications and travails, “nothing is impossible,” Martin told a packed auditorium at the Monterey Conference Center.
With many producers of photomasks in attendance at the conference, Martin promised, “We are not planning to make a significant change in mask infrastructure” for EUV. He added, “What you are investing today will be useful next year, and the year after that.”
Vivek Bakshi provides a deeper look at the ASML/IBM announcement on EUV progress. ASML and IBM reconfirmed the benchmarking in press and via social media. In short, 637 wafers per day throughput stands, resulting from the successful upgrade of source power by 100%, to its targeted level of ~43 W.
Dick James of Chipworks finally has his hands on Samsung’s V-NAND vertical flash. The vertical flash was first released in an enterprise solid-state drive (SSD) last year, in 960 GB and 480 GB versions. Then in May this year they announced a second-generation V-NAND SSD, with a stack of 32 cell layers.
Phil Garrou provides an overview of controlling warpage in packaging as discussed at ECTC by Hitachi Chemical, Amkor, Qualcomm, and imec.
Anand Sundaram, Senior Associate for PwC’s PRTM Management Consulting writes that software that controls and powers embedded devices is playing a key role in making possible the highly integrated, multi-functional ‘smart’ devices we take for granted in our daily lives – from the ubiquitous smart phones/tablet to ‘smart’ home appliances and wearable electronics.
Pete Singer posted an IoT infographic, courtesy of Jabil. The global IoT market is poised for explosive growth. By 2020, the market is expected to soar to $7.1 trillion. This infographic, courtesy of Jabil, gives an good overview of what will be connected (even garbage bins!).
Bob Smith, Senior Vice President of Marketing and Business Development, Uniquify blogs that these days, chip design may seem like an intricately connected jigsaw puzzle, including small, oddly shaped interlocking pieces.
By Pete Singer
The semiconductor equipment industry received quite a jolt recently. In July, lithography equipment supplier ASML announced a customer co-investment program that enabled minority equity investments in ASML (up to 25% total) by its largest customers. Customers could also make commitments to fund ASML’s research and development (R&D) spending for future programs.
Intel was the first investor, acquiring 15% equity ownership interest in ASML. R&D funding and equity investment agreements totaled approximately $4.1 billion. Part of the deal was a contractual commitment from Intel for advance purchase orders for 450 mm and EUV development and production tools from ASML. ASML has said the results of the technology investments will be available to every semiconductor manufacturer with no restrictions.
In August, TSMC joined in, taking a 5% stake in ASML, worth about $1.04 billion. TSMC also committed about $341 million, spread over 5 years, to ASML’s R&D programs.
The Intel announcement made instant believers out of many that both EUV and 450mm would actually happen. Both technologies have been significantly delayed beyond initial target dates, and the thinking was that some massive investment would be required to get them production-ready in a reasonable timeframe (i.e,. 2015-2020). $5+ billion is a pretty good start!
Not only does it seem to ensure that EUV will succeed, but it removed one of the most significant barriers to 450mm development. Even if 450mm solutions were developed for all the other types of process equipment — deposition, etch, ion implant, CMP, cleaning, etc. — it would be going nowhere without EUV. Now, seemingly overnight, 450mm seems inevitable.
It is a new era for semiconductor manufacturing equipment suppliers, for they must now seriously tackle the 450mm challenge, but don’t expect a blossoming new model based on customer co-investments anytime soon. There are at least two competitors in other markets, and developments will likely be funded the way they always have been — though good old-fashioned capitalism.
New process isolates promising material; Revolutionary solar-friendly form of silicon shines; New way to move atomically thin semiconductors for use in flexible devices
Revving up fluorescence for super fast LEDs; Smallest world record has ‘endless possibilities’ for bio-nanotechnology; Printing in the hobby room: Paper-thin and touch-sensitive displays on various materials
The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.
Everybody’s talking about it, but just what is DFM? According to various EDA company websites, design for manufacturing can be: generation of yield optimized cells; layout compaction; wafer mapping optimization; planarity fill; or, statistical timing among other definitions. Obviously, there is very little consensus. For me, DFM is what makes my job hard: Characterizing it, and developing tools for it, is the most important item on my agenda.
In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.
Certain measurement methodologies can be inaccurate even if they’re precise, and there are known errors associated with certain system parameters.
The etch loading effect is the dominant factor that impacts final CD control at advanced nodes with shrinking critical dimension.
A look at ways to simplify the optical and resist model calibration and to speed up the entire process.
Fabricating interconnects is one of the most process-intensive and cost-sensitive parts of manufacturing.
Testing interposer-based versions of stacked die and future versions using through-silicon vias.