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New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips

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By Jeff Dorsch, Contributing Editor

Applied Materials today introduces the Applied Endura Cirrus HTX PVD, a physical vapor deposition system for creating titanium nitride hardmask films that could be used in fabricating 10-nanometer and 7nm chips.

“Titanium nitride is the metal hardmask of choice,” harder than copper and nearly as hard as diamond, says Sree Kesapragada, Applied’s global product manager for Metal Deposition Products.

“Patterning plays key role in defining the interconnect,” Kesapragada says. “Perfect via alignment is critical for device yield. Hardmask ensures the perfect via alignment critical for yield.”

The hardmasks created with the Endura Cirrus HTX TiN system strike the required balance between neutral stress and film density hardness, he asserts. The TiN hardmask, meant to resist the erosion of etching, helps ensure that via etches land where they are supposed to, and not too close to neighboring vias, which can creates shorts.

Metal hardmask layer manages alignment errors.

Applied has worked with customers at multiple sites in developing the new PVD system over the past two to three years, according to Kesapragada. He emphasizes that the Cirrus HTX TiN system offers “precision control over TiN crystal growth,” as the process chamber is “designed for tensile high-density TiN films.” The new PVD system enables high density, tensile films thanks to a high level of ionization during deposition made possible by a high frequency source.

High film desnity is needed to prevent erosion, and a neutral-to-tensile stress is needed for pattern fidelity. CVD/ALD films have tensile stress, but are low density. Traditionally deposited TiN films have good density, but compressive stress.

The formation of “islands” of TiN crystals is almost like chemical vapor deposition, “layer by layer,” Kesapragada says, “in a PVD chamber.”

In the process chamber, the first of its kind, titanium atoms are reactively sputtered in a nitrogen-based plasma, allowing for tunable composition, according to Applied. This chamber can be used for high-volume manufacturing of semiconductors with 7nm features, covering two process-node generations, Kesapragada says.

There is also “very established integration” with chemical mechanical planarization equipment, he adds.

Applied is the market leader in TiN PVD systems, with more than 200 systems shipped, according to Kesapragada. Those PVD systems have more than 700 process chambers, he adds.

The Endura Cirrus HTX TiN PVD system is being formally introduced this week at the IEEE’s 2015 International Interconnect Technology Conference in Grenoble, France.



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One Response to “New Applied PVD system targets TiN hardmasks for 10nm, 7nm chips”

  1. Todd Plaisted Says:

    These types of TiN coatings have been done for years. KDF performs numerous TTiN Tailored TiN coatings for semiconductor and medical applications. Nothing new here except the specific application. The news may be; Applied re-discovers reactive sputtering…

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