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The Week in Review: August 22, 2014

Himax Technologies, Inc., a supplier and fabless manufacturer of display drivers and other semiconductor products, and Lumus, a producer of Augmented Reality glasses, announced another joint initiative to continue developing the next-generation of smart glasses that will set new technological standards in image quality and performance.

North America-based manufacturers of semiconductor equipment posted $1.41 billion in orders worldwide in July 2014 (three-month average basis) and a book-to-bill ratio of 1.07, according to the July EMDS Book-to-Bill Report published this week by SEMI.   A book-to-bill of 1.07 means that $107 worth of orders were received for every $100 of product billed for the month.

Intel Corporation and Unity Technologies this week announced a strategic collaboration to advance the development of Android-based applications on Intel architecture. The agreement accelerates Intel’s mobility push as millions of developers using the Unity development platform can now bring native Android games and other apps to Intel-based mobile devices. Unity adds support for Android across all of Intel’s current and future processors including both the Intel Core and Intel Atom processor families.

MediaTek this week announced the establishment of a new research and development facility in Bengaluru, India. The new R&D facility will focus on developing innovative and inclusive solutions for wireless communications and establish MediaTek’s presence in other core segments such as connectivity and home entertainment devices.

Amkor Technology, Inc. announced that David Watson has been appointed as a new member of the Company’s Board of Directors. With this appointment, Amkor’s Board has been expanded to nine members. Mr. Watson is currently serving as Executive Vice President and Chief Operating Officer for Comcast Cable. In this role Mr. Watson oversees the teams responsible for day-to-day operations of the cable division, including sales and marketing of cable video, high-speed Internet and voice services, as well as oversight of the three operating divisions and Comcast Spotlight, the advertising sales unit.

STATS ChipPAC Ltd., a provider of advanced semiconductor packaging and test services, announced this week that it has shipped over 100 million semiconductor packages with the company’s fcCuBE technology, advanced flip chip packaging with fine pitch copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and enhanced assembly processes.

Intersil Corporation, a provider of power management and precision analog solutions, announced the ISL98611 display power and LED driver for smartphones. The ISL98611 is the first power management IC that integrates the display power and backlight LED driver functions in a single chip. It significantly improves efficiency of both functions to increase smartphone battery life by an hour or more.



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