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Blog review March 24, 2014

IBS has recently issued a new white paper entitled Why Migration to 20nm Bulk CMOS and 16/14nm FinFETs Is Not the Best Approach for the Semiconductor Industry. Handel Jones of IBM says the focus of the analysis is on technology options that can be used to give lower cost per gate and lower cost per transistor within the next 24 to 60 months, covering the 28nm, 20nm and 14/16nm nodes.

Sitaram Arkalgud of Invensas and Rich Rogoff of Rudolph Technologies will present this Thursday as part of a free webcast focused on 2.5/3D integration and advanced packaging, including and new lithography options. Sitaram, who formerly led the 3D charge at SEMATECH, is now the vp of 3D technology at Invensas and Rich is the vp and general manager of the lithography systems group at Rudolph.

Phil Garrou provides a delightful lecture to the packaging community on nomenclature. He says the word “lecture” is one of those wonderful English words with multiple meanings. Lecture can mean “a talk or speech given to a group of people to teach them about a particular subject,” but it can also mean “a talk that criticizes someone’s behavior in an angry or serious way.” In his latest blog, lecturing means both!



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