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RF-SOI Wafers for Wireless Applications

The increasing demand for wireless data bandwidth and the emergence of LTE and LTE Advanced standards pushes radio-frequency (RF) IC designers to develop devices with higher levels of integrated RF functions, meeting more and more stringent specification levels. The substrates on which those devices are manufactured play a major role in achieving that level of performance.

This paper explains the value of using RF-SOI substrates and what the latest generation of Soitec Wave SOI (Soitec eSI™) brings to RF IC performance while simplifying the IC manufacturing process in order to address the mainstream smart phone market.

To download this white paper, click here.

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