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Blog Review: December 2, 2013

Phil Garrou completes his look at various packaging and 3D integration happenings from Semicon Taiwan, including news from Disco, Namics and Amkor. Choon Lee of Amkor, for example, predicted a silicon interposer cost of 2.7-4$/cm sq (100 sq mm) and expectations of organic interposer costs at 50% cost reduction.

Dynamic resource allocation can significantly improve turnaround time in post-tapeout flow. Mark Simmons of Mentor Graphics blogs about recent work that demonstrated 30% aggregate turnaround time improvement for a large set of jobs in conjunction with a greater than 90% average utilization across all hardware resources.

The MEMS Industry Group blog reflects on the trend toward sensor fusion and the role that hardware approaches such as FPGAs and microcontrollers will play in moving the technology forward.

44 years ago, the internet was born when two computers, one at UCLA and one at the Stanford Research Institute, connected over ARPANET (Advanced Research Projects Agency Network) to exchange the world’s first “host-to-host” message. Ricky Gradwohl of Applied Materials celebrates the “birthday” with thoughts on how far the internet has come.

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