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The Week in Review: Nov. 22, 2013

GLOBALFOUNDRIES, Open-Silicon and Amkor Technology have jointly exhibited a functional system-on-chip (SoC) solution on a 2.5D silicon interposer featuring two 28nm logic chips, with embedded ARM processors. The jointly developed design is a test vehicle that showcases the benefits of 2.5D technology for mobile and low-power server applications. The companies recently demonstrated the functioning SoC at ARM TechCon in Santa Clara, CA.

North America-based manufacturers of semiconductor equipment posted $1.12 billion in orders worldwide in October 2013 (three-month average basis) and a book-to-bill ratio of 1.05, according to the October EMDS Book-to-Bill Report published this week by SEMI.   A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month. “Both equipment orders and billings improved in the October data, resulting in a book-to-bill ratio returning above parity,” said Denny McGuirk, president and CEO of SEMI.  ”Order activity is well above the figures reported one year ago and point towards on-going investments in advanced process technologies for NAND Flash, microprocessor, and foundry.”

Soraa, a developer of GaN on GaN LED technology, announced that it will open a new semiconductor fabrication plant in Buffalo, New York. In partnership with the State of New York, the company will construct a new state-of-the-art GaN on GaN LED fabrication facility that will employ hundreds of workers. The new facility is projected to be operational in 2015. Soraa currently operates an LED fabrication plant in Fremont, California, one of only a few in the US.

Dow Corning introduced new Dow Corning MS-2002 Moldable White Reflector Silicone at Strategies in Light Europe 2013. This highly reflective white material extends the excellent photo-thermal stability and high-moldability that typifies Dow Corning’s award-winning optical-grade Moldable Silicone family to the reflective elements of LED lamp and luminaire applications. Dow Corning MS-2002 Moldable White Reflector Silicone targets reflectivity as high as 98 percent to help further boost light output from LED devices, improve overall energy efficiency and prolong device reliability.

SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has successfully installed an ELP300 excimer laser stepper to support next generation advanced packaging and 3D IC laser debonding applications at the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin. The ELP300 excimer laser platform is designed for high volume manufacturing and processing of 100mm to 300mm wafers.

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, introduced the EVG PHABLE exposure system, which is designed specifically for manufacturing photonic components.  Leveraging EVG’s expertise in photolithography, the EVG PHABLE system incorporates a unique contactless lithography mask-based approach that enables full-field, high-resolution and cost-efficient micro- and nanopatterning of passive and active photonic components, such as patterned structures on light emitting diode (LED) wafers, in high-throughput production environments.

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