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Blog Review November 5 2013

New blogs delve into the packaging technology of Apple’s A7, the road ahead for bulk FinFETs as defined by imec, with EUV is a gating factor for 450mm, split-manufacturing for U.S. trusted IC (TIC) program and Japan’s growing market for equipment and materials.

For the 10nm node and beyond, transistor research efforts are focused on high mobility designs with Ge and III-V channel, reducing VDD supply voltage as well as the subthreshold slope in transistors and optimizing multi-Vt designs. Pete Singer reports on work underway at imec in Belgium.

At the IEEE 3DIC in San Francisco Dan Radack of the Institute of Defense Analysis gave an update on the IARPA trusted Integrated Chip Program. Phil Garrou reports how it is now focused on split-manufacturing with FEOL done off-shore and BEOL done by trusted facilities in the U.S.

The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process and the chip includes over 1 billion transistors on a die 102 mm2 in size. Phil Garrou reports on observations on the Package-on-Package (PoP) design as noted by fellow blogger Dick James. In an earlier blog, Dick described how the Apple A7 is using Samsung’s 28nm process.

Simon Favre of Mentor Graphics notes how EUV could possibly be a gating factor for 450mm. “Would you put in 450mm immersion steppers, and then yank them out to put in EUV before they’re fully depreciated?” he asks.

In advance of Semicon Japan, to be hold December 4-6 at the Makuhari Messe, SEMI’s Dan Tracy and Yoichiro Ando report that restructuring and consolidation has led to a new focus for the semiconductor manufacturers in Japan. As a result, the semiconductor equipment market in Japan will experience double-digit growth in both 2013 and 2014, driven by higher spending for memory production and in spending increases planned for the manufacturing of power semiconductors and “More than Moore” semiconductor technologies. Total equipment spending in Japan is estimated to reach $4.6 billion by 2014. Combining this with the $8 billion-plus spending on semiconductor materials, Japan represents a $12 billion market in 2014 for the suppliers of equipment and materials.

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