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Via Doubling to Improve Yield

In nanometer designs, the number of single vias, and the number of via transitions with minimal overlap, can contribute significantly to yield loss. Yet doubling every via leads to other yield-related problems and has a huge impact on design size. While there is still concern over of how many vias can be fixed without rerouting and without creating DRC violations, the Calibre via doubling tool can identify via transitions and recommend areas for second via insertion without increasing area.

To download this white paper, click here.

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One Response to “Via Doubling to Improve Yield”

  1. Byungchun Yang Says:

    Although you might be right in improving yield with double vias, forming a strong gouged (embedded) via without damaging materials such as via sidewall and trench bottom would be a far better idea. Please read US8,207,060, and give Byungchun Yang a call. Via and contact yield can be improved to their maximum.

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