The Week In Review: Aug. 20
GlobalFoundries and ARM announced an agreement to jointly deliver ARM’s processor designs on GlobalFoundries’ 20nm and finFET process technologies.
Applied Materials has signed a two-year contract with GlobalFoundries to service all Applied’s equipment at its Fab 1 in Dresden, Germany.
The North American semiconductor equipment industry posted a book-to-bill ratio of 0.87, according to SEMI.
Tokyo Electron Ltd. will acquire fab tool vendor FSI for $6.20 per share in cash, or about $252.5 million.
Sematech has reached a milestone in reducing tool-generated defects from multi-layer deposition of mask blanks used for extreme ultraviolet lithography (EUVL).
The Hybrid Memory Cube Consortium (HMCC), led by Micron and Samsung, announced that its developer members have released the initial draft of the Hybrid Memory Cube (HMC) interface specification.
Semiconductor spending in Asia-Pacific among original equipment manufacturers (OEMs) headquartered in the region is expected to rise by an average of 6% in 2012, according to an IHS iSuppli.
Following a sharp 30% drop during the first three months of 2012, worldwide shipments of flat-panel televisions returned to growth in the second quarter, according to iSuppli.
Based on the WSTS’s June global semi sales of $26.329 billion, actual sales number, the latest monthly forecast expectation for total global semi sales calculated by the Cowan LRA forecasting model came in at $297 billion. This represents a 2012 year-o-year sales growth forecast expectation of minus 0.85 percent which declined from the previous month’s year-over-year sales growth forecast estimate of plus 0.1 percent.
Tags: Applied Materials, ARM, FSI, GlobalFoundries, Hybrid Memory Cube, IHS iSuppli, Micron, Samsung, Sematech, TEL, Tokyo Electron