The Challenges Of 28nm HKMG
28nm Super Low Power (28nm-SLP) is the low power CMOS offering delivered on a bulk silicon substrate for mobile consumer and digital consumer applications. This technology has four Vt’s (high, regular, low and super low) for design flexibility with multi-channel length capability and offers the ultimate in small die size and low cost. Multiple SRAM bit cells for high density and high-performance are available. With the simpler process integration of a “Gate-First” HKMG scheme, 28nm-SLPalso offers the use of an eFuse, which is known to be more competitive and superior than a BEOL copper fuse solution.
To read more, click here.