InvenSense Adds GlobalFoundries as MEMS Foundry
InvenSense (Sunnyvale, Calif.) said it has qualified its CMOS-MEMS process at a 200mm GlobalFoundries fab in Singapore, providing a second-source capability for its MEMS-based motion-sensing devices.
Taiwan Semiconductor Manufacturing Company (TSMC), the primary high-volume supplier to date, has more than doubled its CMOS-MEMS capacity for InvenSense in the past year. InvenSense said having two foundries delivering CMOS-MEMS wafers will provide its customers “a high degree of supply continuity assurances and plenty of capacity to satisfy any current and unexpected increase in market demand.”
InvenSense supplies a line of “MotionTracking” solutions for consumer electronic devices, supporting intuitive motion and gesture-based interfaces. The Nasiri-Fabrication Platform integrates MEMS wafers with standard CMOS wafers using a patented wafer-to-wafer bonding process.
“InvenSense is thankful to TSMC for their continued support to bring up the Nasiri-Fabrication platform on their high-volume production lines, along with GlobalFoundries for their commitment and timely qualification of our process in their production lines,” said Steve Nasiri, founder and CEO at InvenSense.
Raj Kumar, GlobalFoundries senior vice president of the 200mm business unit and general manager of the Singapore operation, said, “We are looking forward to providing all the support and capacity that InvenSense will need for their current and future growth needs.”
(Source: InvenSense)
Tags: GlobalFoundries, InvenSense, MEMS, wafer bonding