Intel Invests in Multi-beam Mask Writer Firm
By Mark LaPedus, SemiMD senior editor
The introduction of next-generation maskless lithography tools has taken longer than expected.
The multi-beam e-beam technology is complex and expensive. IMS, KLA-Tencor, Mapper, Multibeam and others are separately working on maskless, a direct-write technology that is supposed to eliminate the costly photomask in IC production.
There is also a crying need for a multi-beam e-beam system for the production of photomasks. Today’s e-beams are simply too slow for the most complex mask layers. Sematech is looking to fund a program in the arena.
In any case, one multibeam e-beam hopeful has received a major boost. IMS Nanofabrication AG has signed an undisclosed equity funding round with participation from Intel Capital, Photronics Inc. and private investor groups.
IMS focuses its efforts on the development and production of key tool components for mask writing and direct-write lithography applications. The Austrian firm has been developing a so-called electron multi-beam Mask Exposure Tool (eMET) for the fabrication of leading-edge masks and templates. The company has completed a proof-of-concept 50keV eMET.
“Successful demonstration of an electron multi-beam mask writer column would be a significant step forward in addressing industry needs for higher productivity mask writing capability at finer levels of resolution,” said Keith Larson, vice president of Intel Capital.
Photronics is joining the equity round to support the development of technology that allows it to provide leading-edge mask production capability to its customers. Christopher Progler, chief technology officer of Photronics, said: “Our investment in IMS demonstrates our commitment to invest in technologies that can keep Photronics on the cutting edge of mask writing technology.”
The equity funding from Intel, Phototronics and others will be used to complete an electron multi-beam mask exposure tool proof-of-concept eMET to support tool characterization, column optimization and infrastructure enhancements that set the stage for commercialization. Additional terms of the transaction are not being disclosed. The equity funding agreement is subject to satisfaction of customary closing conditions with closing expected to occur by the end of 2011.
IMS is working to “commercialize our electron multi-beam mask exposure tool (eMET) for sub 22nm mask writing applications,” said Max Bayerl, CEO of IMS. “The additional resources will help IMS to demonstrate a 256 thousand e-beam mask writer column with initial exposures by the end of 2011.”
“At BACUS 2011 we showed results as achieved with a novel electron-optical column providing 200x reduction,” said Hans Loeschner, vice president of technical marketing at IMS.
“We achieved 6.65nm 1sigma blur (including resist blur) over a 82µm x 8µm field in very good agreement with the simulations. Further we have a 256k-APS (Aperture Plate System, k=1024) in place and tested (with a special setup), proving 512 x 512 programmable beams,” he said. “We are in the process of inserting the 256k-APS into the novel column which is mounted onto a 1nm 1sigma test stage onto which 6 inch mask blanks can be loaded.”
Tags: IMS, Intel, Photronics