Sematech said six companies have joint its 3D Enablement program in Albany. Advanced Semiconductor Engineering Inc. (ASE), Altera Corp., Analog Devices Inc. (ADI), LSI Corp., ON Semiconductor Corp., and Qualcomm Inc. have joined the program, based at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.  They join CNSE, GlobalFoundries, Hewlett Packard, Hynix, IBM, Intel, Samsung, and UMC.

In December 2010, Sematech, along with the Semiconductor Industry Association (SIA) and the Semiconductor Research Corporation (SRC), launched a new 3D Enablement program to drive industry standardization efforts and technical specifications for heterogeneous 3D integration. The primary focus is on developing technologies and specifications necessary for establishing standards in critical areas such as inspection, metrology, microbumping, bonding, and thin wafer and die handling.

Membership is open to international fabless, fab-lite and IDM companies, outsourced semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers. In addition, the program and its members are collaborating with a broad network of companies, consortia, universities, national laboratories, and associations from around the world, Sematech said.

Tags: 3D, Altera, On Semiconductor, Qualcomm, Sematech, SRC, TSVs

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