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New CD SEM Advances 3D Patterning to See, Measure and Control 3D Devices

With the industry moving to 3D architectures, metrology solutions capable of measuring the high aspect ratio and complex features of 3D NAND and FinFET designs has been a major problem for ramping these devices to high-volume production. Recently, Applied Materials announced the new VeritySEM 5i 3D metrology system that provides imaging innovations in advanced e-beam technology and image processing for fast, accurate on-device CD SEM metrology, allowing chipmakers to see, measure and control their 3D devices during R&D, ramp and volume production. Ofer Adan, Global Product and Technology manager at Applied, reviews the tool’s technical innovations.

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